ABSTRACT Epoxy resin is widely utilized for the encapsulation of power semiconductor devices, necessitating excellent insulation properties, mechanical performance, and moisture resistance. In this study, hexadecyltrimethoxysilane was employed to modify diatomite, which was then combined with polyurethane-modified epoxy resin to fabricate a series of filled composites with varying diatomite content. The influence of diatomite content on the mechanical properties, thermal properties, and insulation performance of the polyurethane/epoxy resin composites was investigated. Experimental results showed that, under the synergistic effect of polyurethane and diatomite, the composite containing 4 wt.% diatomite exhibited improvements of 13.95% and 61.11% in tensile strength and flexural strength, respectively, compared to the epoxy resin. The elongation at break and flexural displacement also increased by 22.46% and 68.23%, respectively. Furthermore, the incorporation of diatomite effectively compensated for the thermal losses caused by polyurethane, enhancing thermal stability. Electrical property tests indicated that the addition of diatomite reduced the dielectric constant and conductivity of the epoxy resin while simultaneously improving its breakdown strength.
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