Embedded Atom Method Potentials For Cu Research Articles

Embedded atom method potential for studying mechanical properties of binary Cu–Au alloys

We present an embedded atom method (EAM) potential for the binary Cu–Au system. The unary phases are described by two well-tested unary EAM potentials for Cu and Au. We fitted the interaction between Cu and Au to experimental properties of the binary intermetallic phases Cu3Au, CuAu and CuAu3. Particular attention has been paid to reproducing stacking fault energies in order to obtain a potential suitable for studying deformation in this binary system. The resulting energies, lattice constant, elastic properties and melting points are in good agreement with available experimental data. We use nested sampling to show that our potential reproduces the phase boundaries between intermetallic phases and the disordered face-centered cubic solid solution. We benchmark our potential against four popular Cu–Au EAM parameterizations and density-functional theory calculations.

Vibrational contribution to thermal transport in liquid cooper: Equilibrium molecular dynamics study

The vibrational contribution to the thermal transport properties of liquid Cu is investigated in detail in the temperature range 1300–1800K. The calculations are performed in the framework of equilibrium molecular dynamics making use of the Green–Kubo formalism and one of the most reliable embedded-atom method potentials for Cu. It is found that the temporal decay of the heat current autocorrelation function of the liquid Cu model can be described by a single exponential function, which is characterized in the studied temperature range by a constant value of the heat flux relaxation time of about 0.059ps. The vibrational thermal conductivity of the liquid Cu model slightly decreases with temperature from about 1.1W/(mK) at 1300K to about 1W/(mK) at 1800K. Near the melting temperature it is about 30% lower than the vibrational thermal conductivity of the f.c.c Cu model. The calculated thermal diffusivity of the liquid Cu model is demonstrated to retain a constant value of about 2.7×10−7m2/s in the studied temperature range, which is about two orders of magnitude higher than the atomic diffusivity in the model at the melting temperature. The vibrational contribution to the total thermal conductivity of liquid Cu is found to slightly decrease with temperature, being estimated as about 0.7–0.5% in the temperature range of 1400–1800K. Furthermore, the applicability of some simple theoretical treatments of vibrational thermal transport in liquid Cu is discussed.

Molecular dynamics prediction of phonon-mediated thermal conductivity of f.c.c. Cu

The phonon-mediated thermal conductivity of f.c.c. Cu is investigated in detail in the temperature range 40–1300 K. The calculations are performed in the framework of equilibrium molecular dynamics making use of the Green–Kubo formalism and one of the most reliable embedded-atom method potentials for Cu. It is found that the temporal decay of the heat current autocorrelation function (HCACF) of the Cu model at low and intermediate temperatures demonstrate a more complex behaviour than the two-stage decay observed previously for the f.c.c. Ar model. After the first stage of decay, it demonstrates a peak in the temperature range 40–800 K. A decomposition model of the HCACF is introduced. In the framework of that model we demonstrate that a classical description of the phonon thermal transport in the Cu model can be used down to around one quarter of the Debye temperature (about 90 K). Also, we find that above 300 K the thermal conductivity of the Cu model varies with temperature more rapidly than , following an exponent close to −1.4 in agreement with previous calculations on the Ar model. Phonon thermal conductivity of Cu is found to be about one order of magnitude higher than Ar. The phonon contribution to the total thermal conductivity of Cu can be estimated to be about 0.5% at 1300 K and about 10% at 90 K.

Ab initio local energy and local stress: application to tilt and twist grain boundaries in Cu and Al

The energy-density and stress-density schemes (Shiihara et al 2010 Phys. Rev. B 81 075441) within the projector augmented wave (PAW) method based on the generalized gradient approximation (GGA) have been applied to tilt and twist grain boundaries (GBs) and single vacancies in Cu and Al. Local energy and local stress at GBs and defects are obtained by integrating the energy and stress densities in each local region by the Bader integration using a recent algorithm (Yu et al 2011 J. Chem. Phys. 134 064111) as well as by the layer-by-layer integration so as to settle the gauge-dependent problem in the kinetic terms. Results are compared with those by the fuzzy-Voronoi integration and by the embedded atom method (EAM). The features of local energy and local stress at GBs and vacancies depend on the bonding nature of each material. Valence electrons in Al mainly located in the interatomic regions show remarkable response to structural disorder as significant valence charge redistribution or bond reconstruction, often leading to long-range variations of charges, energies and stresses, quite differently from d electrons in Cu mainly located near nuclei. All these features can be well represented by our local energy and local stress. The EAM potential for Al does not reproduce correct local energy or local stress, while the EAM potential for Cu provides satisfactory results.

Molecular dynamics simulation of thermal conductivity of Cu–Ar nanofluid using EAM potential for Cu–Cu interactions

Mechanism of heat conduction in copper-argon nanofluids is studied by molecular dynamics simulation and the thermal conductivity was obtained using the Green–Kubo method. While the interatomic potential between argon atoms is described using the well-known Lennard–Jones (L–J) potential, a more accurate embedded atom method (EAM) potential is used in describing the interatomic interaction between copper atoms. It is found that the heat current autocorrelation function obtained using L–J potential to describe the copper-copper interatomic interaction fluctuates periodically due to periodic oscillation of the instantaneous microscopic heat fluxes. Thermal conductivities of nanofluids using EAM potentials were calculated with different volume fractions but the same nanoparticle size. The results show that thermal conductivity of nanofluids are almost a linear function of the volume fraction and slightly higher than the results predicted by the conventional effective media theory for a well-dispersed solution. A solid-like base fluid liquid layer with a thickness of 0.6 nm was found in the simulation and this layer is believed to account for the small discrepancy between the results of MD simulation and the conventional effective media theory.

Influence of single crystal orientation on homogeneous dislocation nucleation under uniaxial loading

Atomistic simulations are used to investigate how the stress required for homogeneous nucleation of partial dislocations in single crystal copper under uniaxial loading changes as a function of crystallographic orientation. Molecular dynamics is employed based on an embedded-atom method potential for Cu at 10 and 300 K. Results indicate that non-Schmid parameters are important for describing the calculated dislocation nucleation behavior for single crystal orientations under tension and compression. A continuum relationship is presented that incorporates Schmid and non-Schmid terms to correlate the nucleation stress over all tensile axis orientations within the stereographic triangle. Simulations investigating the temperature dependence of homogeneous dislocation nucleation yield activation volumes of ≈ 0.5 – 2 b 3 and activation energies of ≈ 0.30 eV . For uniaxial compression, full dislocation loop nucleation is observed, in contrast to uniaxial tension. One of the main differences between uniaxial tension and compression is how the applied stress is resolved normal to the slip plane on which dislocations nucleate—in tension, this normal stress is tensile, and in compression, it is compressive. Last, the tension–compression asymmetry is examined as a function of loading axis orientation. Orientations with a high resolved stress normal to the slip plane on which dislocations nucleate have a larger tension–compression asymmetry with respect to dislocation nucleation than those orientations with a low resolved normal stress. The significance of this research is that the resolved stress normal to the slip plane on which dislocations nucleate plays an important role in partial (and full) dislocation loop nucleation in FCC Cu single crystals.

Atomistic simulations of homogeneous dislocation nucleation in single crystal copper

Atomistic simulations are used to investigate how the stress required for homogeneous nucleation of partial dislocations in single crystal copper under uniaxial tension changes as a function of crystallographic orientation. Molecular dynamics is employed based on an embedded-atom method potential for Cu at 10 and 300 K. Results indicate that non-Schmid parameters are required to describe dislocation nucleation for certain single crystal orientations. Specifically, we find that the stereographic triangle can be divided into two regions: a region where dislocation nucleation is dominated by the conventional Schmid factor (the resolved shear stress in the direction of slip) and a region where dislocation nucleation is dominated by the normal factor (the resolved stress normal to the slip plane). A continuum relationship that incorporates Schmid and non-Schmid terms to correlate the stress required for dislocation nucleation over all tensile axis orientations within the stereographic triangle is presented. The significance of this work is that simulation results are cast into an atomistically inspired continuum formulation for partial dislocation loop nucleation in face-centered cubic single crystals.

An embedded-atom potential for the Cu–Ag system

A new embedded-atom method (EAM) potential has been constructed for Ag by fitting to experimental and first-principles data. The potential accurately reproduces the lattice parameter, cohesive energy, elastic constants, phonon frequencies, thermal expansion, lattice-defect energies, as well as energies of alternate structures of Ag. Combining this potential with an existing EAM potential for Cu, a binary potential set for the Cu–Ag system has been constructed by fitting the cross-interaction function to first-principles energies of imaginary Cu–Ag compounds. Although properties used in the fit refer to the 0 K temperature (except for thermal expansion factors of pure Cu and Ag) and do not include liquid configurations, the potentials demonstrate good transferability to high-temperature properties. In particular, the entire Cu–Ag phase diagram calculated with the new potentials in conjunction with Monte Carlo simulations is in satisfactory agreement with experiment. This agreement suggests that EAM potentials accurately fit to 0 K properties can be capable of correctly predicting simple phase diagrams. Possible applications of the new potential set are outlined.