Diffusion Behavior Of Elements Research Articles

Microstructure evolution, elemental diffusion behavior, and bonding strength of TA1/AZ31B laminated composite fabricated by hot pressing

Ti/Mg composites can combine the benefits of Ti and Mg in terms of mechanical properties, cost, and other factors, making them highly valuable for various applications. In this study, Ti/Mg laminate composites were prepared by vacuum hot pressing at temperatures of 350 °C, 400 °C, and 450 °C for 6 h, 8 h, and 10 h, respectively. The study aimed to examine the effect of the diffusion behavior of elements and microstructure on the bonding strength of Ti/Mg laminate composites. The shear strength test results indicated that the laminated composites displayed a strong bonding strength at 400 °C, while a significant decrease in bonding strength was noted at 350 °C and 450 °C. Results of TEM analysis show that when the temperature is 350 °C, the intermetallic compound is not observed at the interface; when the temperature increased to 400 °C, a transition region along the interface is observed, and there is a Ti3Al compound in the region, the compound is uniformly distributed along the interface; when the preparation temperature is 450 °C, intermetallic compounds were observed at the interface, and the compounds were TiAl, TiAl was not uniformly distributed along the interface. EBSD analysis showed that in the Mg matrix of the composites, the distribution of coarse crystals and fine crystals was obvious due to the dynamic recrystallization, and such a distribution of grain size was also conducive to the further enhancement of the bonding strength of the composites. It can be concluded that the formation of intermetallic compounds with a continuous distribution of the transition region caused by elemental diffusion and the enhancement of the mechanical properties at the matrix are both effective in improving the bond strength of composites.

Effect of Sulfurization Temperature on Properties of Cu2ZnSnS4 Thin Films and Diffusion of Ti Substrate Elements

The addition of flexible Cu2ZnSnS4 (CZTS) thin film solar cells to titanium (Ti) substrates is an attractive way to achieve the low-cost manufacturing of photovoltaics. Prior research has indicated that the appropriate diffusion of Ti elements can enhance the crystalline growth of CZTS films. However, the excessive diffusion of Ti has been shown to adversely affect the photovoltaic performance of CZTS photovoltaic devices. Therefore, it is essential to regulate the diffusion of Ti elements within CZTS thin films to optimize their photovoltaic properties. The tendency for Ti substrate elements to diffuse into CZTS films is also influenced by the activation energy associated with these Ti elements. The sulfurization temperature is posited to be a critical factor in modulating the diffusion and activation energy of Ti elements within CZTS thin films. Consequently, this research investigates the alteration of the sulfurization temperature of CZTS thin films in order to enhance the properties of these thin films and to examine the diffusion behavior of titanium elements. The results reveal that as the sulfurization temperature increases, the diffusion of Ti elements within the CZTS thin films initially increases, then decreases, and subsequently increases again. This pattern suggests that the diffusion of Ti elements is affected not only by the activation energy of the Ti elements but also by the defect hopping distance within the CZTS thin films. Notably, at a sulfurization temperature of 550 °C, the grains at the base of the CZTS thin film demonstrate an increased density, which is associated with a reduced defect hopping distance, thereby hindering the diffusion of Ti elements within the CZTS thin films. Furthermore, at this specific sulfurization temperature, the slope of the current–voltage (I–V) curve for the CZTS/Ti structure reaches its maximum, indicating optimal ohmic contact characteristics.

Cooling rate effects on microstructure and diffusion behaviour in Ti65 alloy: Insights from a modified diffusion model

In the continuous cooling process, the growth of the equiaxed α-phase grains in near-α high-temperature titanium alloys is controlled by the diffusion of alloying elements. Establishing a specific connection between the cooling rate and the diffusion behaviour of alloying elements aids in the precise prediction of the evolution of equiaxed α-phase grain size. This study meticulously controlled the cooling rate during the two-phase region annealing treatment of the Ti65 alloy. Using EPMA technology, the diffusion behaviour of solute elements during cooling was accurately characterized. The study found that slowing the cooling rate promotes the coarsening of the lamellar secondary α-phase grains and the growth of the primary equiaxed α-phase grains. At higher annealing temperatures, the growth of equiaxed α-phase grains can occur at faster cooling rates, while coarse lamellar secondary α-phase grains can be retained at slower cooling rates. The diffusion behaviour of solute elements Al, Ta, Mo, and W between the α-phase and transformed β-phase matrix is significantly influenced by the cooling rate, thus they are considered as the controlling elements for the growth of the equiaxed α-phase grains. Based on the diffusion behaviours of these controlling elements, their single-element diffusion models were categorized and integrated for predicting the grain size of the equiaxed α-phase. The predictions from the revised diffusion model show an excellent agreement with the actual results, with an error margin of about 5%.

Bonding Behavior and Mechanism of Composite Interface Between Carbon Steel/Stainless Steel Laminates at Different Temperatures and Strain Rates

Compared to hot roll and explosive bonding, there are relatively few studies on warm/cold roll bonding under low temperature conditions. In this article, the warm/cold roll bonding simulation experiment is conducted to research the deformation, interface bonding rate, microstructure, element diffusion behavior, metallographic structure, and phase of carbon steel/stainless steel. The results show that the plastic deformation remains consistent below 400 °C but exhibits temperature sensitivity above 400 °C. The lower strain rate can increase the bonding rate, while insulation treatment may reduce the bonding rate. The formation of cracks is inhibited at 25 °C and 45% reduction rate due to the challenge of cracking the surface oxide film. Temperature significantly affects bonding, with improved performance observed above 600 °C. Uneven element distribution of bonding area may be related to the precipitated compounds, while insulation treatment increases the mutual diffusion ability of elements. The increase in temperature leads to an increase in pearlite, a decrease in ferrite, and decarburization occurs within the carbon steel matrix. The carbon elements diffuse from carbon steel to the surface of stainless steel. The increase in temperature increases the content of surface compounds.

In situ high-temperature transmission electron microscopy investigation of dynamic element migration for Sm-Co-Fe-Cu-Zr sintered magnets

The investigation delved into the dynamic migration of elements and the evolution of interface structures within the Sm(CobalFe0.09Cu0.09Zr0.03)7.2 magnet as temperature increased, employing high-temperature transmission electron microscopy. Notably, the Cu distribution exhibited temperature susceptibility. Elevating the temperature from room temperature (RT) to 400 °C led to a notable expansion in the distribution width of Cu, ranging from 28.5 to 50.8 nm. Simultaneously, the average Cu content at the cell boundaries decreased from 14.4 to 11.6 at.%. According to the high-temperature in-situ experimental results of the transmission electron microscopy thin-film samples, the derived diffusion coefficients, D300°Cand D400°C, were determined as 0.0525 nm2/s and 1.414 nm2/s, respectively. The significantly higher D400°C compared to D300°C underscores the considerable influence of temperature on Cu element diffusion behavior. The simulation results demonstrate that the trend of magnetic properties variation at different temperatures closely aligns with the observed trend. Subsequent calculation of the temperature coefficient of intrinsic coercivity (β) reveals that |β300–400°C| is notably higher than |βRT-300°C|. This suggests a substantial impact of Cu diffusion-induced deterioration on the β. Moreover, micromagnetic simulation results delineated the reverse magnetization process for magnets at varying temperatures, revealing that the presence of the Cu diffusion region diminished the pinning effect of the cell boundary phase. Furthermore, a wider Cu diffusion region facilitated easier magnetic moment reversal at the cell boundary phase, resulting in a marked deterioration of intrinsic coercivity. This elucidates that the formation of the Cu diffusion region stands as one of the primary reasons for the sharp decline in magnetic properties of Sm2Co17-type magnets under high-temperature conditions.

Effects of recrystallization and element diffusion behavior on interfacial bonding quality and mechanical properties of aluminum laminated composites

For aluminum laminated composites (ALCs), interlayer bonding strength plays a crucial role in its performance. In this work, 7050/Al/7A52 and 7A62/Al/7A52 ALC were studied to explore the effects of recrystallization and element diffusion on interfacial bonding quality and mechanical properties. The results show that attributed to the deformation localization occurs at the 7A52/pure Al interface, continuous dynamic recrystallization (CDRX), discontinuous dynamic recrystallization (DDRX) and geometric dynamic recrystallization (GDRX) coexist, while only DDRX exists at the bonding interfaces of 7050/pure Al and 7A62/pure Al. Among them, 7A62/pure Al interface has the most obvious element diffusion behavior among the three kinds of interfaces. Notably, recrystallization would have a higher effect on improving bonding quality, which causes the 7A52/pure Al interface of the composites more difficult to delaminate during the tensile test. Besides, the enhancement of element diffusion depth at the 7A62/pure Al interface promotes the bonding strength of 7A62/Al/7A52 ALC to increase by 21.0% compared with that of 7050/Al/7A52 ALC. After the dynamic impact test, the peak flow stress and energy absorption value of 7A62/Al/7A52 ALC reached 567.1 MPa and 72.2 MJ/m3, and the interface remains intact. However, due to the existence of huge strength deviation in the 7A62/pure Al interface, it is more prone to fail during the tensile process, resulting in a decrease in the elongation of the composites.

Exploring the deposition pathway in the notch region of double-graded bandgap ACIGS solar cells

The bandgap widening of Ag-alloyed Cu(In,Ga)Se2 (ACIGS) thin films poses a significant challenge in enhancing their photocurrent. This study demonstrates correlations between element diffusion behavior and notch-point formation in ACIGS films, which ultimately influence the resulting current circuit voltage and fill factor. Our findings delineate a novel approach for fabricating a suitably tailored band gap grading in ACIGS, which serves as a bottom subcell in tandem configuration. This was achieved by modulating a wide range of process temperatures from 340 to 470 °C, which were measured by pyrothermal, to assess the GGI profile during deposition. Experiments were undertaken to variate the second-stage conditions, striving to sustain the photocurrent, mitigate defects, and enhance crystallinity, achieving an impressive performance of 17.7 % without applying post-deposition treatments or anti-reflection coatings. The efficiencies surpassing 8 % were achieved as we measured these cells under a 715 nm long-pass filter, which corresponds to the bandgap of a typical top cell in tandem applications (1.73 eV photon energy). These results emphasize the significance of understanding the deposition temperature and its impact on the properties of ACIGS films, paving the way for further advancements in solar-cell technology.

Influence of pre-aluminizing on elemental diffusion behavior and fracture mechanism of thermal barrier coatings

The development of high-performance aero-engines raises the urgent requirement of coatings deposited on blades, containing both thermal barrier coatings (TBCs) on the external surface and aluminide coatings in the internal winding cooling channels. A TBC system with a low activity aluminizing process before deposition of conventional TBC was developed here to evaluate the feasibility of co-deposition technology. The thermal cyclic oxidation behavior of co-deposited “Al-modified TBC” was examined at 1100 °C and compared to that of conventional TBC. The cross-sectional microstructure evolution and elemental diffusion behavior of the modified TBC were also investigated. Even though the underlying aluminizing layer can serve abundant Al for the upper NiCoCrAlYHf layer to eliminate “Al depletion” in conventional TBC, which is a main reason for spallation, the Al-modified TBC system exhibited shorter thermal cycling life than conventional TBC. The spallation mechanism was discussed. Cracks caused by the fast growth rate of thermally grown oxide (TGO), Cr-rich precipitates resulted from the decreased γ/γ′-phase in the coating, and Re-rich precipitates originated from outward diffusion through the aluminide layer were mainly responsible for the failure.

Fabricating a MnCo coating to improve oxidation resistance and electrical conductivity of Crofer22H alloy as SOFC interconnect

The oxidation kinetic behavior of Crofer22H alloy at 700–800 °C was investigated. Due to the high oxidation rate exhibited at 800 °C, the xCr-MnCo dual-structured spinel coating was prepared by magnetron sputtering. The element diffusion behavior of the coating/alloy system was changed by control the formation of Cr layer with different thicknesses on the surface. Appropriately increase the thickness of Cr barrier layer can effectively hinders the Fe outward diffusion and improve the antioxidant performance. Fe doped into Mn–Co spinel increased the electron hopping in the crystal structure. Higher electron hopping and thin Cr2O3 layer reduced the electron resistance.

Uncovering the isothermal transformation dynamics and elemental diffusion behavior of reversed austenite in PH13-8Mo steel

The isothermal transformation kinetics and microstructural evolution of the reversed austenite significantly influence the properties of PH13-8Mo steel. However, the microscopic phase transformation behavior related to elemental diffusion during isothermal processes for PH13-8Mo steel needs further examination. Herein, we systematically investigate the isothermal transformation and elemental diffusion behavior of reversed austenite in PH13-8Mo steel. Phase transformation kinetic measurements unravel that the complete elimination of residual austenite can be achieved. Only hierarchical martensitic microstructure without austenite is detected after the solution-cooling treatment at 927 °C with a cooling rate of 10 °C/s, determining the critical martensite transformation start and finish temperature to be 176.6 °C, 11.6 °C. The isothermal kinetics of reverted austenite satisfy the Johnson-Mehl-Avrami relationship. The fraction of reversed austenite increases from 0.14 % at 510 °C to 8.73 % at 593 °C. Lath martensite boundaries with large kernel average misorientation values promote elemental diffusion at the interface. Further, the underlying behavior of elemental diffusion is elucidated during the isothermal aging process. The interfacial model indicates the growing width of the reversed austenite up to 100 nm and the compositional gradient formed by the elemental diffusion during aging for 0–5 h at 593 °C. The interdiffusion coefficient calculations interpret the diffusion direction of alloying element Ni from martensite to reversed austenite; Cr and Mo may form alloying carbides at the austenite-martensite interface; Al possesses the fastest diffusivity in martensite and austenite phases. The present work unveils the phase transformation kinetics of PH13-8Mo steel, achieving quantitative regulation for maraging stainless steel.

Effect of nickel interlayer on laser welding of copper/titanium dissimilar metal joint

Cu/Ti dissimilar metal welding components have significant potential applications in aerospace, nuclear industries, and other fields. To achieve a robust connection between titanium (TA2) and copper (T2), this study conducted laser-welding experiments using nickel as an intermediate layer. The influence of a nickel intermediate layer on the joint formation, microstructure, mechanical properties, melting, and element diffusion behavior were investigated. The results revealed that without the addition of a nickel intermediate layer, when the laser beam was biased toward the titanium side during welding, a 17 μm thick layer of intermetallic compounds formed in the copper-side weld region. In this area, a notable concentration of fragile Ti–Cu intermetallic compounds forms, rendering it the weakest point in the joint. As a consequence, the ultimate tensile strength of the joint measures at 131 MPa, which is roughly 55 % of the tensile strength of the copper base material. The introduction of a nickel intermediate layer led to a change in the microstructure of the fusion zone, with Cu–Ti intermetallic compounds dispersed within, preventing the formation of brittle Ti–Cu phases at the copper interface. The addition of the nickel interlayer increased the tensile strength of the TA2-T2 joint to 224 MPa, which is approximately 94 % that of the copper parent material, and the joint exhibited ductile fracture behavior in the copper parent material's heat-affected zone.

Experimental study and simulation of the interface shear deformation behavior in AISI304/Q235 clad plate with thin cladding layer

The mechanical properties and interface damage characteristics of hot-rolled bonded stainless steel/carbon steel (SS/CS) clad plate with thin cladding were investigated. The focus is on mechanical property-microstructure relationships in shear deformation. In detail, the mechanical response of the cladding components and clad plate were characterized. Then a hybrid numerical–experimental identification procedure for the cohesive zone model (CZM) in the simulation of heterogeneous SS/CS interface using finite element (FE) method was developed. A mixed-mode bilinear CZM, considering the anisotropy of the thin cladding was coupled FE model, showing a high accuracy for predicting the shear deformation behavior. The results showed obvious differences in the microstructure and mechanical properties of the SS and CS layers and the formation of an inhomogeneous interfacial layer. Additionally, the bond strength and delamination position of SS/CS clad plate are highly dependent on the interfacial oxide distribution and elemental diffusion behavior. Interestingly, the thin cladding is subjected to bending moments in shear deformation, resulting in delamination of the interface that is not completely dominated by one shear mode. And these abrupt interfacial failures could be clarified via stress-strain state and local damage analysis of the well-reproduced FE model of cladding material.

Effects of Cu, Sn, and Ti doping on the interfacial properties of Ag-based filler metal/WC: First-principles study and experimental characterization

First-principles calculations were used to determine the formation energy, work of adhesion, and electronic structure of the interface of Ag-doped (Cu, Sn, and Ti)/WC, revealing the effect of doping atoms on the interfacial bonding behavior. Additionally, an active filler metal Ag–Cu–Sn–Ti was developed from the calculation results and applied to braze YG18 cemented carbide/40Cr steel joint. The interfacial structure and elemental diffusion behavior at the filler metal/WC interface were characterized. The doping of Cu and Ti at the interface contributes significantly to the stability of the interfacial structure and the improvement of the work of adhesion. The effect of doping of Sn atoms at different positions on interfacial stability and the work of adhesion is not obvious, and it can be doped into Ag alloys as a melting point depressant. The charge accumulation zone and atomic orbital hybridizations at the interface contributes to enhance the interface stability and the work of adhesion. The TEM analysis demonstrates that the diffusion behavior of Ti is particularly noticeable, aggregating at the Ag/WC interface and interacting with C to generate a TiC reaction layer, ultimately producing a WC/TiC/Ag interface structure.

Effect of refractory element addition on high temperature oxidation process of complex concentrated alloy coatings

The sluggish diffusion effect of complex concentrated alloys (CCAs) affords them considerable application potential in the field of high temperatures. In this study, the role of refractory elements in the high temperature oxidation process of denary complex concentrated alloy coatings (CCACs, namely NiCoCrFeAl0.8Si0.1(MoNbTaW)x, where x is 0.025, 0.05, 0.1 and 0.15) prepared via laser cladding was investigated. Four groups of the CCACs with different refractory contents were subjected to 100 h of high-temperature oxidation experiments, and the oxidation products and microscopic characteristics of the samples were observed via XRD and SEM, respectively. Atomic-scale characterisation and analysis of the oxidised samples were performed using TEM and XPS technology to explore the diffusion behaviour of elements in the high-temperature process. Results indicate that the solid solution limit of the CCACs is obtained by regulating the topological instability of the lattice matrix via the addition of refractory elements. Consequently, when 0.1 > x > 0.025, the coating is a body-centred cubic (BCC) + face-centred cubic (FCC); when x = 0.1, the coating maintains a single-phase FCC structure; and when x > 0.1, the coating changes to an FCC + BCC duplex structure. The x0.1 group exhibits the smallest relative strain among all coatings, which is conducive to maintaining the structural stability of the face-centred cubic at high temperatures and delaying atomic migration within the lattice. Furthermore, the oxidation kinetics curve of the CCACs with a single- phase FCC exhibits low Kp values. In a single- FCC lattice, the atom diffusion rate through volume slows down and grain boundary diffusion decreases. Considering the Weibull modulus for the hardness statistical value after coating oxidation, the modulus of single-FCC phase CCACs is also higher than others. This study has the potential to contribute to the application of high-temperature thermal protection for CCACs.

Mechanism of oxide film removal and analysis of diffusion behavior of interfacial elements during magnetic pulse-assisted semi-solid brazing

The magnetic pulse-assisted semi-solid brazing (MPASSB) for Cu/Al tubes is proposed, in order to effectively remove oxide film to ensure the metallurgical bonding of Cu/Al brazing and joint performance. By designing a field shaper with a specific taper angle, the axial distribution of the electromagnetic force, tube deformation, and filler metal shear rheology are controlled to obtain the interface joining characteristics under different mechanical conditions. The relationship between the deformation behavior of the tube and filler metal with the interface element diffusion and metallurgical bonding is analyzed through the forming process simulation and interface microscopic characterization. In addition, the mechanical mechanism of oxide film removal is discussed as well. The results show that metallurgical bonding and element diffusion depend on the comprehensive effect of the interface compressive stress and the shear rheology of the filler metal. The larger the compressive stress, the better the oxide film removal. The stress at the bottom Cu/filler metal interface is the weakest, with an oxide layer thickness of 11.5 µm. The higher the shear rheological rate, the less the element diffusion depth. The filler metal flow rate at the bottom Cu/filler metal interface is the slowest, with a maximum depth of element diffusion of 13.5 µm. On the premise of ensuring the effective removal of the oxide film, the shear rheological rate (compressive stress) should not be too high.

Re-healing of separated steel substrate and work-hardened surface layer in roll-bonded steel–aluminum laminates

Roll bonding is ideal for preparing metallic composite laminates (MCLs). When MCLs are prepared by roll bonding, a work-hardened surface layer (WHSL) is typically prepared on the plate surface to promote bonding. However, differences in the mechanical properties of the WHSL and substrate lead to the WHSL separated from steel substrate during roll bonding, resulting in low bonding strengths of the roll-bonded laminates. This study focused on steel–Al laminates to successfully heal the cracks between the WHSL and the steel substrates via heat treatment. The crack-healing mechanism, element diffusion behavior, bonding property, and fracture morphology of the laminates were investigated. The results show that after roll bonding, the WHSL of the steel surface was separated from the steel substrate, and the steel–Al laminates exhibited a lower bonding strength. After annealing the laminates with cracks between WHSL and steel substrate at 450 °C for 60 min, a 426.8 nm Fe2O3 layer was generated between the WHSL and the steel substrate, healing the cracks. Additionally, good connectivity was observed between the WHSL and steel substrate. The shear strength of the steel–Al laminates increased by 1.7 times after the formation of the Fe2O3 layer. Analysis of the fracture morphology showed that shear fracture primarily occurs at the interface between the WHSL and steel substrate before the formation of the Fe2O3 layer; after the Fe2O3 layer is formed, shear fracture primarily occurs in the aluminum substrate. This study provides a new strategy for improving the bonding strength of roll-bonded steel–Al laminates.

Diffusion Welding for TC4 Titanium Alloy/T2 Copper with Vanadium Foil

TC4 titanium alloy (TC4) was vacuum diffusion welded to T2 copper (T2) with vanadium (V) foil as an interlayer. The influence of process parameters on elemental diffusion behavior, microstructure evolution, and shear performance of welded joints was explored. An obvious solid-solution diffusion zone appeared in the welded interface between TC4 and V, but no distinct diffusion zone formed in the joint interface of V/T2. The solid-solution phases of (Ti6, V)ss, (Ti3, V)ss, and (Ti, V7)ss appeared in the interface of TC4/V. The crystallographic orientations of (Ti6, V)ss, (Ti3, V)ss, and (Ti, V7)ss phases in high-resolution transmission electron microscope images were (002), (201), and (121), respectively. The lattice mismatch between (Ti6, V)ss and (Ti3, V)ss was calculated to be 11.9%. The activation energy to form a stable solid solution between titanium and vanadium was 226.6 kJ/mol. The highest shear strength of the welded joint reached 160 MPa, obtained at 860°C (1580°F) for 60 min. The joint fractured along the interface of V/T2, illustrating that the solid-solution structure between Ti and V was stronger than the metallurgical bonding between V and Cu. The fracture surface of the welded joints revealed a river pattern and ladder topography, representing a cleavage fracture mode. FCC-Cu, BCC-V, and β-Ti were detected on both fracture surfaces of the TC4 titanium alloy and T2 pure copper sides. The influence of welding temperature on the diffusion of V in Ti was greater than on Ti in V, and Ti and Cu diffused faster than V in the joint.

Dissolution Behavior of Chromite Ore in CaO‐SiO2 System

Numerous investigations proposed that the dissolution of chromite ore is the rate‐controlling step for the smelting reduction of chromite ore. The mechanism of chromite ore dissolution in the binary CaO‐SiO2 system is presented. The effect of basicity, temperature, and reducing conditions on chromite ore dissolution is elaborated. The solubility of chromite ore increases considerably when the basicity increases from 0.56 to 0.65. However, the solubility of chromite ore decreases when the basicity further increases from 0.65 to 0.74. The positive effect of reducing conditions on the solubility of chromite ore is evident. The maximum dissolved Cr2O3 in slag under reducing conditions by using a graphite crucible reaches 2.6 wt% after 15 min of dissolution. The element diffusion behavior at the chromite/slag interface is elaborated through SEM‐EDS technology. The analysis suggests that the rate‐controlling step in the early stage is the interface dissolution reaction. After a certain time, the rate‐controlling step becomes the mass transfer of Cr2O3 from the chromite ore to the chromite/slag interface. The activation energy of the dissolution reaction is = 285.29 kJ mol−1.

Effect of Boronizing on the Microstructure and Mechanical Properties of CoCrFeNiMn High-Entropy Alloy.

The CoCrFeNiMn high-entropy alloys were treated by powder-pack boriding to improve their surface hardness and wear resistance. The variation of boriding layer thickness with time and temperature was studied. Then, the frequency factor D0 and diffusion activation energy Q of element B in HEA are calculated to be 9.15 × 10-5 m2/s and 206.93 kJ/mol, respectively. The diffusion behavior of elements in the boronizing process was investigated and shows that the boride layer forms with the metal atoms diffusing outward and the diffusion layer forms with the B atoms diffusing inward by the Pt-labeling method. In addition, the surface microhardness of CoCrFeNiMn HEA was significantly improved to 23.8 ± 1.4 Gpa, and the friction coefficient was reduced from 0.86 to 0.48~0.61.

Influence of high-current pulsed electron beam irradiation on element diffusion behavior and mechanical properties of TC4/304 stainless steel diffusion bonded joints

Influence of high-current pulsed electron beam irradiation on element diffusion behavior and mechanical properties of TC4/304 stainless steel diffusion bonded joints