Electrostatic Discharge Threat Research Articles

Alternative method for electrostatic discharge stress testing of individual system components

Electrostatic discharge (ESD) testing of integrated circuits (ICs) is necessary to ensure that the products can withstand several types of ESD threats, including those encountered in the factory and in the field. This study discusses the testing of components with electrostatic stress waveforms that were originally designed for predicting system failures in the field. IC manufacturers are struggling to obtain reliable data when applying system tests to their components due to interface and repeatability problems found with this form of evaluation. To alleviate these problems and some of the confusion, a new test methodology has been designed and implemented. It is used for testing individual components that have pins that are to be connected to the external ports on a completed design. This study reports on a new method that solves these IC testing problems and compares it to the current approach most often employed.

Peak current failure levels in ESD sensitive semiconductor devices and their application in evaluation of materials used in ESD protection. Part 1: Theoretical analysis

This paper shows that theoretical analysis of the thermal model of damage to electrostatic discharge (ESD) energy susceptible devices combined with data from Human Body Model test on devices can be used to estimate an ESD pulse current threshold for damage to ESD energy susceptible semiconductor devices over a wide range of ESD duration and waveforms. The technique is intended for laboratory evaluation of ESD threats from equipment, materials and other ESD sources in the electronics assembly factory environment. In Part 2 of this paper the predicted ESD current damage threshold is experimentally demonstrated to give a useful boundary to a ‘safe’ area of ESD current and duration.

Discharge Current From Coated Wire to GMR Head

The giant magnetoresistive (GMR) head used in magnetic recording is an extremely sensitive device that is sensitive to electrostatic discharge (ESD). A generally available coated wire that is electrified on its surface can increase the potential of the copper core. When the wire is touched to the GMR head terminal, the discharge current can damage the sensor of the GMR head. Four types of wires were measured for three lengths each. Resin-coated wires were electrified from 20 V to more than 1 kV. The peak current discharging to the GMR head ranged from 100 mA to more than 1000 mA. A resin-coated wire as short as 5 cm was found to damage the GMR head. Among the wires examined herein, only the enameled wire is recommended to connect the GMR head because no charge or discharge currents were observed for this wire. When an ionizer is used to neutralize the tribocharge on the surface of the wire, the remaining charge in the copper core depends on the effectiveness of the neutralization process. A wire with an antistatic coating is required in order to reduce the ESD threat to sensitive devices such as the GMR head

Measurements of real ESD threats have been ignored too long

Electrostatic discharge (ESD) protection circuits are built into every pin of an integrated circuit (IC) to protect the core operating circuits. Many different standards groups have assumed the responsibility of producing ESD testing standards for the IC industry. The quality of ESD testing and their standards have suffered from a lack of measurement updates without an effort for periodic investigations of the real threat from ESD. Measurements to determine the real parameters of ESD threat have been ignored for too long. The present tests and standards will continue because organized ESD experts in standards groups are unconcerned with the real threat and can ignore the new data we have measured.

Assessment of ESD threats to electronic components

Electrostatic discharge (ESD) is a major source of failures in electronic devices and products detected during manufacturing. Reduction of semiconductor element dimensions as well as implementation of new product and production technologies have made many devices extremely vulnerable to disturbances of electrostatic origin. Effective ESD damage prevention requires that ESD threats are carefully assessed and understood. This paper reviews new research results on electrostatic discharges as well as tools for the assessment of ESD threats to electronic components. Influences of the new results on the ESD control are discussed. There is a need to modify existing standards for the ESD control in electronics industry in order to meet challenges related to the manufacturing of future electronic products.

Short and long loop manufacturing feedback using a multisensor assembly test chip

A family of silicon test chips for use in making diagnostic measurements during electronics assembly has been developed. These assembly test chips (ATCs) contain sensors that measure a number of variables associated with assembled IC degradation, including the degree of integrated circuit (IC) corrosion, handling damage, electrostatic discharge threat, moisture or humidity, mechanical stress, mobile ion density, bond pad cratering, and high-speed logic degradation. The chips in the ATC family are intended to give manufacturing feedback in four ways: direct feedback in evaluation of an assembly manufacturing line in an objective, nonintrusive way; before and after comparisons on an assembly production line when an individual process, material, or piece of equipment has been changed; resident lifetime monitor for system package aging and ongoing reliability projection; and thermal, mechanical, DC electrical, and high-frequency mock-up evaluation of packaging (including multichip) schemes.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>