Design Of Electronic Products Research Articles

The status of binocular visual functions among Taiwan high-tech industry engineers and its correlation with computer vision symptom

To analyze the status of binocular visual functions, the relationship between binocular visual function and computer vision-related symptoms in the high-tech industry group. The study sample was comprised of 33 participants aged between 20 and 40 years of age. After completing basic information and the Computer Vision Symptom Scale (CVSS-17) questionnaire, the participants underwent a comprehensive examination of binocular visual function. All data were statistically analyzed with SPSS V26.0 software. The value of the binocular vision function of the Taiwan high-tech industry group was significantly different compared with the Scheiman and Morgan standard value. Study subjects were generally found to exhibit larger exophoric at distance, which in turn might lead to a lower ability to maintain binocular fusion to a single image, or recover from fusional disruption at distance. Subjects also experienced accommodation and convergence problems at near at the same time. Age, gender, and refractive errors had no significant impact on CVSS-17 scores, only the duration of computer usage showed a significant effect, particularly for internal symptom factor (ISF) dimensions. In addition, the interaction between the ISF and external symptom factor resulted in more severe visual symptoms. Long-term use of electronic devices may lead to an imbalance in binocular vision function, thereby increasing or exacerbating visual symptoms. If the use of electronic devices is an unchangeable trend, interventions in prescription, visual training or the visual design of electronic products become worthwhile topics for development.

Enabling Co-Design of 3D Heterogeneous Packages

The days of ‘throwing it over the wall’ are over. Heterogeneous Integration (HI) is ushering in a new era of electronic product design with collaboration at its core – one that lives or dies on seamless interaction between analog/digital IC teams and package design teams. The use of advanced packaging technologies to combine smaller, discrete chiplets into one system-in-package (SiP) not only pushes the need for more advanced multi-die packaging, it makes packaging part and parcel of the process. And in doing so, it significantly reduces dependance on Moore’s Law at a time in which building an advanced monolithic system-on-chip (SoC) has become prohibitively expensive. For many tech companies, Moore’s Law no longer represents the best technical nor economical path to designing a product. And for a great many of those companies, HI presents a solution – SiPs close to the SoC form factor but with far lower overall cost, greater yield and perhaps most importantly, faster time to market. While SiP as a packaging concept has been around for decades, the recent tsunami of designs that have adopted HI is truly a disruptive change. This presentation will outline some potential solutions to the challenges design teams face when pivoting from monolithic IC design to 3D heterogenous package design.

Experimental and numerical study on temperature control performance of phase change material heat sink

With the increasing power consumption of electronic products, the rising temperature leads to the deterioration of working environment and the reduction of service life. In order to control the temperature rise of electronic products, in this paper, the heat sinks with phase change material (PCM) and honeycomb metal were designed. And their performance was compared with that of the original heat sink (without PCM and honeycomb metal) then studied under various working conditions. Paraffin (n-eicosane) and prepared low melting point alloy were filled into the heat sink with honeycomb metal. The temperature control performance of heat sink was tested experimentally under different heating power. A two-dimensional heat transfer mathematical model of honeycomb metal PCM heat sink was established and solved numerically. The numerical results were compared with experimental data to verify the mathematical model. The results demonstrate that PCM heat sinks effectively controls the temperature of electronic devices and the low melting point alloy makes heat sink better performance than paraffin. Honeycomb metal further decreases the temperature of the paraffin heat sink by up to 3.6 °C, and extends the effective working time of the alloy heat sink by 14 %. The performance of the low melting point honeycomb metal heat sink is superior to that of the paraffin honeycomb metal heat sink at high heating power, and is close to the latter at low heating power. The effective working time of PCM honeycomb metal heat sink is significantly extended when the PCM melting point is close to the limit temperature, especially at high heating power and for the PCM with low thermal conductivity. This study provides valuable reference for temperature control design of electronic products.

PROVISION AND EVALUATION OF TESTABILITY OF THE DESIGN OF COMPLEX RADIO-ELECTRONIC MEANSDEVICES AT THE STAGES OF THEIR DESIGN

The influence of modern X-ray and electrical methods for monitoring and diagnosing complex radio-electronic means on their design and layout solutions is considered. The most significant design principles for the design of traceable electronic products are formulated in the form of qualitative recommendations on the structural continuity of the components, the effective location of control points, ensuring the accessibility of the structure to unhindered measurements, and the creation of technological control and diagnostic maps. A system of particular indicators of the controllability of the design of the components of radio electronic means has been developed, which determine the convenience of monitoring and diagnosing their technical condition and making decisions to improve the operational manufacturability. Using the example of evaluating the testability of the designed device for operational monitoring of the state of on-board equipment of aircraft, it is shown that the proposed system of indicators made it possible to quantify the design decisions made by the designer, which influenced the increase in this indicator for the designed product compared to its analogue.

End-to-End Lifecycle Considerations for Minerals Powering Critical Technologies

The United States (U.S.) is poised for a new wave of industrialization as it prepares to scale up domestic semiconductor manufacturing and widely implement clean energy infrastructure. With widespread application spaces beyond clean energy, such as communication, computing, healthcare, national security, and transportation, the scope of these endeavors is expected to be massive and long-term. The success of these initiatives is highly dependent on the non-renewable minerals used in critical technologies necessitating the adaptation of current business and legislative models to accommodate future long-term extraction and implementation needs. Without these adaptations, advancements will likely be made at the expense of taxpayers, vulnerable communities, and ecological preservation efforts. Here we propose policy recommendations to the U.S. federal government to minimize environmental and socio-economic harm resulting from metal mining and promote integration of circular economy principles in electronic product design. These recommendations are expected to have both domestic and international impacts in reducing harmful waste and increasing product longevity. Furthermore, these recommendations align with ensuring long-term U.S. leadership in the semiconductor and clean energy industries.

Hypergraph and network flow-based quality function deployment

Quality function deployment (QFD) has been a widely-acknowledged tool for translating customer requirements into quality product characteristics based on which product development strategies and focus areas are identified. However, the QFD method considers the correlation and effect between development parameters, but it is not directly implemented in the importance ranking of development actions. Therefore, the cross-relationships between development parameters and their impact on customer requirement satisfaction are often neglected. The primary objective of this study is to make decision-making more reliable by improving QFD with methods that optimize the selection of development parameters even under capacity or cost constraints and directly implement cross-relationships between development parameters and support the identification of interactions visually. Therefore, QFD is accessed from two approaches that proved efficient in operations research. 1) QFD is formulated as a network flow problem with two objectives: maximizing the benefits of satisfying customer needs using linear optimization or minimizing the total cost of actions while still meeting customer requirements using assignment of minimum cost flow approach. 2) QFD is represented as a hypergraph, which allows efficient representation of the interactions of the relationship and correlation matrix and the determination of essential factors based on centrality metrics. The applicability of the methods is demonstrated through an application study in developing a sustainable design of customer electronic products and highlights the improvements' contribution to different development strategies, such as linear optimization performed the best in maximizing customer requirements' satisfaction, assignment as minimum cost flow approach minimized the total cost, while the hypergraph-based representation identified the indirect interactions of development parameters and customer requirements.

Research on Responsibility Consciousness in Electronic Product Design

Design ethics is a guiding principle with metaphysical significance in design, which has a very important impact on electronic product design. With the development of science and technology network, electronic products are increasingly dependent on people. Among them, the design ethics of electronic products aims to guide users to a better direction of truth, goodness and beauty, and better protect users. At the same time, it advocates the rational use of existing social resources and the protection of our environment, It plays a certain role in promoting ecological development. Electronic products are designed not only for the public, but also for special vulnerable groups, such as the disabled, the elderly and children. This paper analyzes some phenomena and problems of existing electronic products, explores how to apply design ethics to electronic product design, and analyzes the sense of responsibility of design ethics in electronic product design when people face daily life and society.

DEVELOPMENT OF ELECTRONIC TEACHING MATERIALS BASED ON ENRICHED VIRTUAL MODEL ON HUMAN RESPIRATORY SYSTEM MATERIALS TO IMPROVE STUDENT'S COGNITIVE ABILITY

This study aims to produce electronic teaching materials based on blended learning enriched virtual models that are valid, practical, and effective in improving students' cognitive abilities. This type of research is Research and Development (R&D). The subjects in this study were 15 students of class VIII junior high school. Two expert validators and one practitioner carry out validation to assess the product from the aspects of presentation, content, and language. Practicality is assessed based on the implementation of learning, student activities, and student responses to electronic teaching materials. Effectiveness is assessed based on THB. The study results obtained: (1) The design of electronic teaching material products discusses the structure and function of the organs of the human respiratory system equipped with images, audio, and video. (2) The validation of these electronic teaching materials obtained an average score of 93% (very valid). (3) The practicality test score from the learning implementation results obtained 100% (very good), the student activity score was 89.5% (very good), and the student response results obtained 95% (very good). (4) The effectiveness test results based on N-Gain analysis obtained an average score of 0.7 medium criteria. Thus, the electronic teaching materials developed are suitable for learning support to improve students' cognitive abilities in the human respiratory system material. The research implies that it can be of information for broader research.

A climate classification for corrosion control in electronic system design

Climate factors such as humidity and temperature have a significant impact on the corrosion reliability of electronic products. Given the huge geographical variability in climate conditions globally, a climate classification is a useful tool that simplifies the problem of considering climate when designing electronics packaging. Most current guidelines for electronic product design rely on the Köppen–Geiger classification first developed by Köppen over a century ago. Köppen devised a set of heuristics to separate climates to match different vegetation types. These climate classes are unlikely to be the optimal for electronic product design. This paper presents a new climate classification using parameters important for corrosion reliability of electronics. The classification is based on real climate data measured every 3 h during a 5-year period at over 9000 locations globally. A key step is defining relevant features of climate affecting corrosion in electronics. Features related to temperature are defined, but also the amount of time that the difference between Temperature and Dew Point is less than 1, 2 or 3 ℃. These features relate to the risk of condensation in electronic products. The features are defined such that diurnal, seasonal and yearly variation is taken into account. The locations are then clustered using K-means clustering to obtain the relevant climate classes. This data-driven classification, based on key features for corrosion reliability of electronics, will be a useful aid for product design, reliability testing and lifetime estimation.

The Configuration Design of Electronic Products Based on improved NSGA-III with Information Feedback Models

<p>The configuration of electronic products is an important means to meet the diverse and personalized needs of users and achieve mass customization, and one of its goals is to recommend an excellent bill of material to users according to users’ individualized needs and preferences. Current research describes the configuration of electronic products as a single-objective optimization model, which suffers from the problems of single recommended configuration and difficulty in meeting the dynamic adjustment of user preferences. Therefore, we describe it as a multi-objective optimization model and propose an NSGA-III-FR algorithm to solve the model. In order to balance the convergence and diversity of the algorithm, NSGA-III-FR has made two improvements on the basis of NSGA-III with information feedback models: introducing adaptive parameters to balance NSGA-III-F1 and NSGA-III-R1; and using Angle Penalized Distance (APD) to improve the niche technology. The experimental results show that our modified meth-od can achieve better performance compared with the other three algorithms.</p> <p> </p>

PENERAPAN TECHNOLOGY ACCEPTANCE MODEL PADA RANCANGAN BUKU ELEKTRONIK PANDUAN PERJALANAN WISATA SEJARAH KOTA BANDUNG

Historical tourism resources are one of the comparative and comparative advantages of Bandung city to other tourist destinations in Indonesia. The special characteristic of historical tourism is that the power of narratives poses a broader need for means of interpretation in the form of travel guides. Through the application of Technology Acceptance Model (TAM), this applied research reveals the process of designing electronic guidebooks that can be used as a means of interpretation for historical tourism visitors in The City of Bandung. The method of design with descriptive writing pattern is used to produce research reports on the design of electronic guidebook products in Bandung. This applied study has gathered opinions from 132 respondents through the dissemination of questionnaires about the components of travel guidebooks in accordance with the concept of Technology Acceptance Model (TAM) which is then analyzed descriptively. This applied research has resulted in a travel guidebook product and an understanding that tourists have a need for travel guidebooks that are easy to use and useful for themselves.

Application of Technology Acceptance Model on Electronic Book Design of Bandung City History Travel Guide

Historical tourism resources are one of the comparative and comparative advantages of Bandung city over other tourist destinations in Indonesia. The unique characteristic of historical tourism is that the power of narratives poses a broader need for means of interpretation in the form of travel guides. By applying the Technology Acceptance Model (TAM), this applied research reveals the process of designing electronic guidebooks that can aim to be used for the interpretation of historical tourism visitors in The City of Bandung. The design method with a descriptive writing pattern is used to produce research reports on the design of electronic guidebook products in Bandung. This applied study has gathered opinions from 132 respondents through questionnaires about the components of travel guidebooks following the Technology Acceptance Model (TAM) concept, which is then analyzed descriptively. This applied research has resulted in a travel guidebook product and an understanding that tourists require accessible travel guidebooks to use and value for themselves.

Research on EMC Optimization of Wireless Electric Field Sensor for Rail Vehicle

In order to improve the electromagnetic compatibility of railway vehicle wireless electric field sensor, a research on electromagnetic compatibility optimization of railway vehicle wireless electric field sensor is proposed. The results show that the optimized RF radiation energy is greatly reduced from 60 to 20, which is completely lower than the standard limit of radiation disturbance, and meets the requirements of EMC design of electronic products. The feasibility and effectiveness of the optimal design are proved. The experimental results show that the test results meet the requirements of general technical conditions of electromagnetic compatibility of speed sensor, which indicates that the electromagnetic compatibility design proposed can be popularized and applied.

A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities

The introduction of 3D printing technology has revolutionised the manufacturing and electronic product design in the past few years, where it is used to even produce printed circuit boards. Printed electronics is one of the fastest-growing additive manufacturing technologies and is becoming invaluable to various industries. The evolution of several contact and non-contact types of fabrication techniques have been reported in the recent past. Leveraging these technologies, various types of printed electronic components have been realized. One method is inkjet printing technology, which has been widely accepted for printed electronics manufacturing. As 3D printing uses only those materials which are essential to create the product, it eliminates waste production, with a smaller equipment cost and minimizes the number of process steps, resulting in lower manufacturing costs with reduced turnaround time. Various kinds of conductive and non-conductive materials have emerged in the recent past in conjunction with many manufacturing techniques for printed electronics. Herein, we review the most commonly used substrates, electronic printing materials, and the widespread printing techniques employed at the industrial level, giving an overall vision for a better understanding and evaluation of their different features. The technical challenges of several contact and non-contact techniques with corresponding solutions are also presented. Finally, status on advances in the production of various kinds of materials employed in 3D printed electronics and the methods for producing them, shortcomings, technical challenges, applications, benefits, and the future opportunities pertaining to printed electronics are discussed in detail.

Novel hierarchical structure of MoS2/TiO2/Ti3C2Tx composites for dramatically enhanced electromagnetic absorbing properties

In order to prevent the microwave leakage and mutual interference, more and more microwave absorbing devices are added into the design of electronic products to ensure its routine operation. In this work, we have successfully prepared MoS2/TiO2/Ti3C2Tx hierarchical composites by one-pot hydrothermal method and focused on the relationship between structures and electromagnetic absorbing properties. Supported by comprehensive characterizations, MoS2 nanosheets were proved to be anchored on the surface and interlayer of Ti3C2Tx through a hydrothermal process. Additionally, TiO2 nanoparticles were obtained in situ. Due to these hierarchical structures, the MoS2/TiO2/Ti3C2Tx composites showed greatly enhanced microwave absorbing performance. The MoS2/TiO2/Ti3C2Tx composites exhibit a maximum reflection loss value of −33.5 dB at 10.24 GHz and the effective absorption bandwidth covers 3.1 GHz (13.9–17 GHz) at the thickness of 1.0 mm, implying the features of wide frequency and light weight. This work in the hierarchical structure of MoS2/TiO2/Ti3C2Tx composites opens a promising door to the exploration of constructing extraordinary electromagnetic wave absorbents.

Application of Human-Computer Interaction Based on Big Data Technology in Electronic Product Design

With the development of information technology and the improvement of people’s living standards, people’s requirements for product design are becoming higher and higher. As the necessary equipment in people’s work and life, electronic products occupy a very important position on the way forward of the society. In the contradiction between product and human demand, human-computer interaction technology comes into being, which provides a solution to this problem. This technology builds a bridge between the product and the demand, so that the product can really serve people, rather than people to adapt to the design of the product. Accordingly, this study discusses the basic situation of human-computer interaction technology, the concept of electronic product design and the application of human-computer interaction technology in electronic product design.

Sustainable electronics product design and manufacturing: State of art review

ABSTRACT The paper reviews the studies on sustainable electronics reported in the literature and determines opportunities through which the expansion of sustainable electronic products is possible. The sustainable growth of electronics products from product, process and material dimensions, and modelling of sustainable electronics were reviewed based on 57 papers from the literature. The review findings were used to identify the methods for improvement of the sustainability of electronic products. The study proposes a sustainability framework for electronic product design. The significant finding of the investigation reported in this review is that the deployment efforts of sustainability in electronics design and manufacturing are in the nascent stages and the attempts enhance the effectiveness of the implementation of sustainable manufacturing. The study investigates research studies from the viewpoint of implementing sustainable electronics product design and manufacturing. Besides, the deployment of the proposed framework to other organisations could also be validated. The findings of this literature investigation specified the need for enhancing the usefulness of sustainable electronics design and manufacturing approach. This study logically presents sustainable electronics product design and manufacturing under four critical perspectives. The study recognises research gaps and proposes methods for improvement.

Research Analysis of PCB Design’s Influence on DDR4 Highspeed Signal Integrity

With the increase of the signal transmission rate of electronic devices and the increase of the PCB wiring density, PCB design has a growing influence on signal integrity. To reduce the number of the problems concerning signal integrity at the initial stage of electronic product design and increase the success rate of the designing of electronic products, some interference signals of PCB are canceled to improve the accuracy of signal integrity test, with the high-speed parallel bus of DDR4 as an example. Analysis is done through measurement of various simulation tools to change the PCB design parameters of DDR4 data transmission line, hence the optimum wiring method will influence the signal quality. Meanwhile, RC parallel impedance matching optimization is carried out to deal with the impedance mismatch at the network load end. In this way, the problem concerning DDR4 high-speed signal integrity is effectively solved.

Calculation and design of mechanical transmissions with the help of various computer-aided design in conditions of educational process

The field of application of computer-aided design (CAD) is an integral part of the design of real-world products of construction, lifting-and-transportation, road vehicles, as well as the design of electronic products. Computer-aided design allow you to solve the most time-consuming and time-consuming tasks, carry out calculations, help you to represent the most accurate visualization of an object (3D visualization). The calculation and design of mechanical transmissions using CAD, which form the basis of most working machines, is an important component of the educational process in the training of future specialists in technical areas. In this work, some modules of computer-aided design have been analyzed to apply them to the educational process in the calculation of mechanical transmissions.

Metoda i oprogramowanie do analizy niezawodności urządzeń elektronicznych oparte na połączeniu metodologii fizyki uszkodzeń i symulacji komputerowej

Electronics, such as those used in the communication, aerospace and energy domains, often have high reliability requirements. To reduce the development and testing cost of electronics, reliability analysis needs to be incorporated into the design stage. Compared with traditional approaches, the physics of failure (PoF) methodology can better address cost reduction in the design stage. However, there are many difficulties in practical engineering applications, such as processing large amounts of engineering information simultaneously. Therefore, a flexible approach and a software system for assisting designers in developing a reliability analysis based on the PoF method in electronic product design processing are proposed. This approach integrates the PoF method and computer-aided simulation methods, such as CAD, FEM and CFD.The software system integrates functional modules such as product modeling, load-stress analysis and reliability analysis, which can help designers analyze the reliability of electronic products in actual engineering design. This system includes software and hardware that validate the simulation models. Finally, a case study is proposed in which the software system is used to analyze the filter module reliability of an industrial communication system. The results of the analysis indicate that the system can effectively promote reliability and can ensure the accuracy of analysis with high computing efficiency.