Electronics Industry Research Articles

Similarity coefficient and TOPSIS methods for designing flexible machine cell layout: a case study of electrical and electronic industries

Similarity coefficient and TOPSIS methods for designing flexible machine cell layout: a case study of electrical and electronic industries

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Purpose This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2. Research limitations/implications Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly. Practical implications Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength. Social implications The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry. Originality/value The research shows the importance of the soldering technology used to assemble MOSFET devices.

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Purpose This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2. Research limitations/implications Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly. Practical implications Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength. Social implications The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry. Originality/value The research shows the importance of the soldering technology used to assemble MOSFET devices.

Multistate nonpolar resistive switching in nickel embedded polyoxovanadate for high density data storage

The evolution of the electronic industry constantly relies on downscaling of electronic devices and integrating novel materials in active regions to accomplish ever-higher speeds and new features in device structures. Employing materials that display multistate switching for resistive-random-access-memory or simply resistive memory could be a simple and effective way to realize high density data storage. In this context, we report multistate “nonpolar” resistive switching in a nickel embedded polyoxovanadate cluster, (K2H5[NiV14O40]) – a molecule that belongs to the larger polyoxometalate family. We observed unique and distinctive nonpolar resistive switching behaviour for the first time in a multi-redox polyoxometalate cluster. The switching characteristics were repeatable for more than 200 cycles. Our two terminal Al/K2H5[NiV14O40])/ITO memory cells exhibited considerably high resistance window (105) and also long retention time (2000 s). This work holds promise for a novel strategy in order to achieve multilevel storage by exploiting different varieties of polyoxometalate molecules as active switching element that can possibly connect memory with neuromorphic computing.

Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering

Purpose This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use. Design/methodology/approach This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys. Findings The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production. Research limitations/implications In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production. Practical implications In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy. Social implications Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change. Originality/value There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

Metabolite Identification and Disinfection By-product Formation in AAO-MBR System with Waste Liquid Isopropyl Alcohol as a Carbon Source

Carbon sources as a substrate can provide organic matter for denitrification and nitrification, facilitating the removal of pollutants. However, low-cost and efficient alternative carbon sources are an urgent problem to be solved for wastewater treatment processes globally. Isopropyl alcohol (IPA), as a waste liquid produced during the cleaning process in the electronics industry, can serve as the carbon source for microbial growth. Herein, the influence of conventional carbon sources (glucose-coupled sodium acetate) and IPA carbon source on denitrification performance, metabolite identification, microbial community composition, and disinfection by-product (DBP) formation was assessed by a denitrification system (AAO-MBR). Results showed that the nitrogen removal efficiency of IPA as a carbon source (69.2%) was similar to that of conventional carbon sources (72.6%). Notably, the results of the metabolites of the two carbon source effluents showed that CHO and CHNO compound classes were the most abundant species in terms of quantity, and lignin (59.5-60.1%) was the main component in two carbon source effluents. Additionally, the diversity of microbial communities at the genus level was significantly different, but organic matter degraded bacteria (i.e., Defluviicoccus and Rhizobacter) and denitrifying functional bacteria (i.e., Dinghuibacter and Amaricoccus) were dominant microorganism when using IPA and conventional carbon sources. Interestingly, the effluent dissolved organic matter (DOM) exhibited a lower susceptibility to transformation into DBP with an IPA carbon source, thus ensuring the safety of reused water. The findings provide valuable insights into utilizing wasted IPA as an effective carbon source in the wastewater treatment process.

An rGO/CoFe2O4 composite produced by the hydrothermal meth-od

Graphene and its derivatives, graphene oxide (GO) and reduced graphene oxide (rGO), are 2D materials of great interest thanks to excellent electromagnetic properties and high specific surface area, while spinel ferrites are ferrimagnetic ceramics extensively used in the electronics industry. A composite based on these two materials, cobalt ferrite (CoFe2O4) anchored in rGO sheets, is promising for electromagnetic shielding, since it combines the energy dissipation effects of magnetic and electric materials. The purpose of this work was to characterize, using X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and Fourier Transform Infrared Spectroscopy (FTIR), an rGO/CoFe2O4 composite produced by the hydrothermal method. The results showed that the composite was successfully manufactured and can be used for electromagnetic shielding.

A TOE-DCV approach to green supply chain adoption for sustainable operations in the semiconductor industry

Semiconductor industry plays a critical role for the global economy. Semiconductor industry provides various necessary technologies such as IoT, AI, modern fabrication technologies and so on to various industries including automotive industry, electronic and communication industry, healthcare industry, construction and building industry, space industry, and so on. However, semiconductor supply chain experiences various supply chain related risks and challenges because of its procedural complexities, global supply chain integrations, government policy and regulations, competitiveness, technological complexities, and so on. Not many studies available which investigated the risk, resilience, and complexities regarding green supply chain adoption by semiconductor industry. In this context, the objective of this study is to examine the risks, resilience, and complexities for managing the green supply chain adoption for higher sustainability in the semiconductor industry. Utilizing the TOE framework (Technology-Organization-Environment) and DCV (Dynamic Capability View), we developed a research model to achieve this purpose. Subsequently, this model was validated through structural equation modelling, involving 356 respondents affiliated with the semiconductor industry. This study highlights that technological risk aspects comprising of technological turbulence and risk, compatibility and complexity, organizational dynamic capabilities, and resilience along with appropriate policy and regulations could help successful adoption of green supply chain management in the semiconductor industry.

Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints

The Sn58Bi solder has gained significant attention in the electronic packaging industry owing to its low melting temperature and excellent mechanical properties. However, the brittleness of Sn58Bi solder presents challenges in practical applications. This study investigates the effect of adding titanium carbide (TiC) nanoparticles on the mechanical properties of Sn58Bi solder joints. The study examines the melting behavior, spreadability, microstructure, and mechanical properties of Sn58Bi-xTiC (x = 0, 0.05, 0.1, 0.2 wt%) composite solders. The results indicate that adding TiC nanoparticles has merely a minor effect on the melting point of the Sn58Bi solder. However, the presence of TiC nanoparticles refined the solder’s microstructure, reduced the thickness of the intermetallic compounds, and enhanced the spreadability and mechanical properties. The Sn58Bi-0.1TiC composite solder exhibits the most favorable properties, including a 28.6 % increase in fracture energy compared with that of Sn58Bi solder. Consequently, incorporating TiC nanoparticles enhances the performance of the Sn58Bi solder by improving its spreadability and reducing its brittleness. These results hold great potential for advancing the development of lead-free solders with improved reliability and performance in electronic applications. The findings of this study could pave the way for the practical and widespread use of Sn58Bi-xTiC composite solders, offering a viable alternative to lead-containing solders while maintaining excellent mechanical characteristics.

Thermoeconomic assessment of the air-cooled tropical data center through energy-saving strategies

Rapid developments in the electronic information industry drive the increased energy usage and carbon emission of data center buildings, prompting the focus on the energy efficiency and environmental sustainability. Expanded operation envelopes of tropical data centers is assessed to analyze the potential for the building energy savings and carbon emission reduction through collaborative analysis of operation modes (OMs), supply air temperature (SAT), and outdoor air temperature (OAT). The OMs of compression vary with the setpoints of SAT, in which the average exergy efficiency of compressors at alternate operation mode is 6.8 % and 8.0 % lower than that of double and single compression operations. As SAT rises from 20 °C to 32 °C, the system exergoeconomic factor increases from 5.4 % to 8.0 %, and the average carbon cost decreases by 36.5 %. Additionally, with just an 8.5 % increase in exergy cost (i.e., Case 8) at OAT rising from 30 to 34 °C, the high SAT and low refrigerant charges provide considerable exergy cost advantages versus resisting the OAT fluctuations. Dynamic operation strategies are also proposed and compared to cope with the impacts of tropical environments. Compared to the 26 °C SAT baseline, the average energy savings are 9.1–14.7 %, indicating the ability to fully utilize outdoor and indoor conditions.

Research on PCB layout optimization of vehicle controller based on electrothermal hybrid simulation

Abstract With the rapid development of the electronic industry, electronic equipment is more and more widely used in automobiles. The integration of electronic components on the Printed Circuit board (PCB) is getting higher and higher, the size is getting smaller and smaller, and the power is getting larger and larger, which leads to a sharp increase in the heat flow density of the whole PCB. The surface temperature of the chip is too high when it is working, which leads to a series of thermal failure problems. In order to improve the thermal characteristics between PCB and electronic components and improve the heat dissipation capability and reliability of PCB, this paper designed a vehicle controller PCB. PowerDC was used to conduct an electrothermal hybrid simulation analysis, and the temperature distribution of the whole board was obtained. Meanwhile, the structural layout of the PCB was optimized by increasing the heat dissipation hole, floor copper foil, and wiring width. Thus, the temperature of PCB and electronic components is reduced, which provides a vital reference for the thermal design of PCB.

Noise coupling reduction using temperature enhanced device for future integrated circuit integration applications

<p>Information technology-to-internet of things may have succeeded because of fast silicon chip capability expansion. Moore's law, which reduces device size, boosted integrated circuit (IC) performance. Delay rises with highdensity connection parasitic capacitance. Interconnect delays have surpassed transistor delays and slowed progress. An alternative is required now to reduce connection latency. The third dimension is used in popular 3D IC technology IC technology requires through silicon via (TSV) for signal integrity and heat mitigation. Noise coupling hinders electrical communication between signal-carrying TSVs (aggressive TSVs) and ground TSVs (victim TSVs), a 3D IC bottleneck. TSVs must be dielectrically insulated from Si substrates to avoid electrical signal interference. Additionally, first-order modelling will confirm the suggestions. This article proposes using the nanosheet field effect transistor (NSFET) to overcome 3D IC noise coupling and complementary metal oxide semiconductor (CMOS) technology nodes. After discussing the electronic industry and sub nm, several basic metrics and criteria for developing electronic components are presented. The first technique uses Perylene-N's exceptional noise-cancelling characteristics. Second technique uses electrical TSV (ETSV), thermal TSV (TTSV), and heat source models to measure noise coupling on numerous ICs. The third proposes many noise-reducing materials. The suggested structures outperform traditional approaches.</p>

IEEE Transactions on Industrial Electronics Information for Authors

IEEE Transactions on Industrial Electronics Information for Authors

Journal of Emerging and Selected Topics in Industrial Electronics Publication Information

Journal of Emerging and Selected Topics in Industrial Electronics Publication Information

IEEE Transactions on Industrial Electronics Information for Authors

IEEE Transactions on Industrial Electronics Information for Authors

Journal of Emerging and Selected Topics in Industrial Electronics Publication Information

Journal of Emerging and Selected Topics in Industrial Electronics Publication Information

Thoughts on the entanglement of electromagnetism and life: A theoretical study.

Dissection of the matter into its constituents leads us to the smallest particles that we know. These particles form a material structure that is determined by the electromagnetic field generated and carried by those particles. Changes in any of the two major constituents leads to changes in that material system, be it a living organism or a lifeless object. The latter statement carries the mystery of life that is born from a continuous and programmed series of system changes fuelled by an energy source with a yet unknown functioning mechanism. The present work is a theoretical approach towards the understandingand potential discovery of the aforementioned, not-yet-known cellular energetic mechanism. Understanding the energetic basis of intracellular biochemistry is equally important in human and animal therapeutics. Additionally, as all such discoveries offer novel solutions in various fields of the global industry, the final outcome of this theoretical work also brings about the idea of a new discovery in electronics industry.

Drivers of and Challenges Facing Adoption of Industrial Revolution 4.0 Technologies: A Study of the Electrical and Electronics Industry in Malaysia

This paper examines the main drivers and challenges of adopting Industrial Revolution (IR) 4.0 technologies in the electrical and electronics (E&E) manufacturing industry in Malaysia. The E&E industry is selected as a case study because it is Malaysia’s largest contributor to manufacturing employment, value added and exports. The empirical findings indicate that the two strongest drivers for adoption are internal benefits associated with improvements in production efficiency and cost reduction. The findings also suggest that the biggest challenges faced by the E&E industry are the shortage of necessary talents and skills, limited funds available for technological upgrading, and a lack of convincing business evidence to justify such investment.

Activated Carbon Based on Recycled Epoxy Boards and Their Adsorption toward Methyl Orange.

With the swift progress of the electronics industry, discarded circuit boards have become an important source of non-degradable waste. In this work, discarded epoxy resin was collected as a precursor to prepare activated carbon (AC) through stepwise carbonization/activation methods. The rough carbon materials with a certain graphite and amorphous structure reveal the multiple oxygen-containing groups on their surface. In the process of studying the adsorption of methyl orange by activated carbon, it is found that the adsorption is in accordance with the quasi-secondary kinetic model, and equilibrium adsorption amounts can reach 41.051 mg/g. The adsorption isotherm of AC is more in line with the Langmuir model, and the saturation adsorption amount at three different temperatures is 23.137 mg/g, 30.358 mg/g, and 37.202 mg/g, respectively. The enthalpy (ΔH) is 17.30 KJ/mol in the adsorption process, which indicates that is a physical process with heat-absorbing capabilities. This work is of great significance with regard to the recycling of waste to reduce pollution and in terms of gaining economic benefits.

Exploring the effects of quality signals on search advertising performance: the moderating role of keyword attributes

PurposeIn online exchange platforms' sponsored search advertising, the array of product quality signals within a keyword search results list plays a crucial role in shaping buyers' purchasing decisions. This research seeks to explore the impact of various quality signals – namely, ranking position, seller reputation and product price – on ad clicks. Additionally, it examines the role of keyword attributes, such as specificity and popularity, in modulating the effects of these quality signals on advertising clicks.Design/methodology/approachA total of 5,763 effective data points were collected from a leading B2B electronic platform company, and we employed negative binomial regression with Heckman correction methods to test the hypotheses.FindingsThe results indicate that in online exchange platforms, search ad clicks are significantly and positively affected by displayed signals such as ranking position, seller reputation and product price information. Notably, a U-shaped relationship emerges between product price and ad clicks. Furthermore, keyword specificity and popularity distinctly moderate the impact of these displayed signals on ad clicks within online exchange platforms.Originality/valueThis paper addresses the gap in existing research on search advertising by methodically analyzing the impact of various signals displayed in search results and how keyword attributes moderate ad clicks, all through a signaling theory lens.