Electrical Dielectric Properties Research Articles

Rapid In Situ Preparation of Conductive Graphite-like Films on Polymer Surfaces via Hydrogen Plasma Technology.

Many special polymer materials with high strength, low density, and high processability have been developed for the substitution of metal products in recent years; however, their electrical insulation properties sometimes limit their application in medicine, electronics, and aerospace fields. Constructing a conductive layer on polymers may be a promising strategy for conquering these problems, but simply obtaining a high-quality conductive layer remains a challenge. Here, we develop a universal strategy to in situ fabricate a conductive graphite-like film on various polymer surfaces based on a simple one-step gas plasma ion implantation method. Theoretical and experimental results confirm that the reducibility of free radicals and the electrophilicity of cations in plasma are critical for the formation of graphite-like films on polymer surfaces. Compared with argon and oxygen plasma, hydrogen plasma with strong reducing hydrogen radicals and weak electrophilic hydrogen cations can produce the highest degree of graphitization of graphite-like films. The as-prepared polymers treated by hydrogen plasma ion implantation presented good surface conductivity and reduced friction coefficient, which has great potential for application in medicine, electronics, and aerospace fields.

Enhanced Electrocaloric Effect of PVDF-based Polymer Composite with Surface Modified AlN.

Poly(vinylidenefluoride-trifluoroethylene-chlorotrifluoroethylene) (P(VDF-TrFE-CTFE)) relaxor ferroelectric polymer exhibits a modest electrocaloric effect (ECE) at a low electric field near room temperature and a low thermal conductivity. The low thermal conductivity causes poor heat transfer when the terpolymer is used as a cooling device, even when the ECE of the polymer is substantial. By incorporating aluminum nitride (AlN) nanoparticles, which possess high thermal conductivity and good electrical insulation properties, into polymer matrices, we can enhance both the thermal conductivity and the ECE. However, weak bonding at the AlN-polymer interface can lead to a reduced breakdown electric field. Therefore, surface modification of AlN nanoparticles is performed to strengthen the chemical bonding between AlN and the terpolymer, thereby increasing the breakdown electric field. Following the addition of surface-modified nanoparticles, the breakdown electric field of the composite films remained around 240 MV/m, which is comparable to that of the pristine polymer film. Furthermore, the ECE and thermal conductivity were improved by 44% and 55%, respectively. We found three factors influencing the ECE, including the interface effect, the change in ferroelectric-paraelectric phase transition behavior, and the Joule heating effect. To assess the interfacial effect on the ECE, composite films with AlN particles of four different sizes were prepared. It was found that as the size of the nanoparticles increased, which resulted in a decreased interface area, the ECE decreased correspondingly. This finding further confirms the significant impact of the interface area in the composites on the ECE.

Thermally Conductive Polydimethylsiloxane-Based Composite with Vertically Aligned Hexagonal Boron Nitride

The considerable heat generated in electronic devices, resulting from their high-power consumption and dense component integration, underscores the importance of developing effective thermal interface materials. While composite materials are ideal for this application, the random distribution of filling materials leads to numerous interfaces, limiting improvements in thermal transfer capabilities. An effective method to improve the thermal conductivity of composites is the alignment of anisotropic fillers, such as hexagonal boron nitride (BN). In this study, the repeat blade coating method was employed to horizontally align BN within a polydimethylsiloxane (PDMS) matrix, followed by flipping and cutting to prepare BN/PDMS composites with vertically aligned BN (V-BP). The V-BP composite with 30 wt.% BN exhibited an enhanced out-of-plane thermal conductivity of up to 1.24 W/mK. Compared to the PDMS, the V-BP composite exhibited outstanding heat dissipation capacities. In addition, its low density and exceptional electrical insulation properties showcase its potential for being used in electronic devices. The impact of coating velocity on the performance of the composites was further studied through computational fluid dynamics simulation. The results showed that increasing the coating velocity enhanced the out-of-plane thermal conductivity of the V-BP composite by approximately 40% compared to those prepared at slower coating velocities. This study provides a promising approach for producing thermal interface materials on a large scale to effectively dissipate the accumulated heat in densely integrated electronic devices.

Flexible silane‐functionalized boron nitride filled polymer composite with high thermal conductivity and electrical insulation

AbstractBoron nitride (BN) has excellent thermal conductivity (TC), however, it exhibits high surface energy, strong chemical inertness, poor interface compatibility with polymer matrices, and difficulty in even dispersion within‐polymer matrix, preventive effective construction of TC pathways. Four kinds of modified boron nitride/polyurethane composites (BTPUC) were prepared by different silane‐functionalized BN with polyurethane (TPU). Among them, 3‐trimethoxysilylpropylmethacrylate (TMSPMA)‐functionalized BN demonstrated better interface compatibility with TPU, significantly improving the mechanical properties and TC of the composites compared to the other three functionalized BN addition. The BN@TMSPMA/PU exhibited good TC and mechanical properties, with a TC of 0.865 W/mK, a tensile stress and a tensile strain of 9.65 ± 1.40 MPa and 759.88 ± 67.93%, respectively. It also showed good electrical insulation properties and mechanical durability. Therefore, the as‐prepared BN@TMSPMA/PU have broad prospects as flexible thermal‐management materials.Highlights The composites are constructed by TMSPMA‐modified BN and polyurethane by NIPS. The composites show good mechanical properties and cyclic failure resistance. The composites exhibit good thermal conductivity and electrical insulation.

Unlocking the Trade-off Between Intrinsic and Interfacial Thermal Transport of Boron Nitride Nanosheets by Surface Functionalization for Advanced Thermal Interface Materials.

The increasing computing power of AI presents a major challenge for high-power chip solution and heat dissipation. Boron nitride nanosheet-based thermal interface materials (BNNS-based TIMs) exhibit excellent electrical insulation property, ensuring the secure and stable operation of chips. However, the efficiency of micro/nano interfacial thermal transport is limited, impeding further enhancements in the thermal conductivity (TC) of BNNS-based TIMs. Here, a strategy of surface functionalization is reported to unlock the trade-off between the intrinsic and interfacial thermal transport of BNNS within TIMs. These results suggest that the surface functionalization maintains the intrinsic high TC of BNNS while significantly increasing binding energy between micro/nano interfaces in BNNS-based TIMs, effectively reducing interfacial thermal resistance of BNNS joint interfaces and interfaces between BNNSs and the matrix by 50% and 26.1%, respectively. The BNNS-based TIMs exhibit excellent TC (≈21-25W/(m·K)) and ultralow Young's modulus, which can promote the development of flexible high-performance chip cooling technology in the AI industry.

Performance of sandwich type fire-resistant flexible composite phase change material PEE@EBF for battery thermal management and runaway protection

To mitigate the risks of overheating and thermal runaway in lithium-ion batteries, this study proposes a novel sandwich-type fire-resistant flexible composite phase change material (CPCM), referred to as PEE@EBF. The core material (PEE) was created by melt-blending paraffin wax (PW), expanded graphite (EG), and ethylene–vinyl acetate copolymer (EVA). The outer layer, a fire-resistant coating (EBF), was applied to the surface of PEE and consists of epoxy resin (EP), boron nitride (BN), and the composite flame retardant (CFR). Test results demonstrated that PEE@EBF maintained structural integrity, exhibiting no significant deformation or leakage after being heated at 80 °C for 5 h. PEE@EBF also displayed a high latent heat of 166.6 J/g, thermal conductivity of 0.8 W/(m∙K), and excellent electrical insulation properties. Furthermore, it achieved a UL94 V-0 flame retardant rating, with notable reductions in peak heat release rate (PHRR) and peak smoke production rate (PSPR) by 67.8 % and 81.8 %, respectively. During long-term cycling at 4C, the peak temperature (PT) and maximum temperature difference (MTD) of batteries in the module incorporating PEE@EBF were reduced by 11.8 °C and 4 °C, respectively, compared to natural convection cooling. In addition, the heat generated during the battery thermal runaway was efficiently absorbed and transferred by PEE@EBF, delaying the irreversible thermal runaway process by 633 s. This indicated that the sandwich-type PEE@EBF was suitable for thermal management and fire protection in lithium-ion batteries or energy storage devices.

Effect and mechanism of phenyl content on the electrical insulation properties of silicone rubber

AbstractSilicone rubber is widely used in reinforced insulation of cable accessories due to its good electrical insulation and weather resistance. With the continuous improvement of high voltage transmission grade, higher requirements are put forward for the electrical insulation performance. The effect and mechanism of phenyl content on the electrical insulation properties of silicone rubber are investigated by the method of combination of experiments and molecular simulations. The experimental results show that the properties of silicone rubber are improved with the increase of phenyl content. Among them, the silicone rubber composite with phenyl content of 20 wt% has the best comprehensive performance. Compared with vinyl silicone rubber, the dielectric constant at 50 Hz decreases from 3.50 to 2.95, and the breakdown strength increases by 38.03%, from 56.59 to 78.11 kV/mm. In addition, the tensile strength and elongation at break are 5.44 MPa and 456%, respectively. The molecular simulation results show that with the increase of phenyl content, the glass transition temperature increases, the mean square displacement decreases, and the free volume decreases, which macroscopically leads to the change of electrical properties of the silicone rubber material. This work has a certain guiding significance for improving the electrical properties of silicone rubber for cable accessories.

Improving the Mechanical, Thermoelectric Insulations, and Wettability Properties of Acrylic Polymers: Effect of Silica or Cement Nanoparticles Loading and Plasma Treatment.

The acrylic polymer composites in this study are made up of various weight ratios of cement or silica nanoparticles (1, 3, 5, and 10 wt%) using the casting method. The effects of doping ratio/type on mechanical, dielectric, thermal, and hydrophobic properties were investigated. Acrylic polymer composites containing 5 wt% cement or silica nanoparticles had the lowest abrasion wear rates and the highest shore-D hardness and impact strength. The increase in the inclusion of cement or silica nanoparticles enhanced surface roughness, water contact angle (WCA), and thermal insulation. Acrylic/cement composites demonstrated higher mechanical, electrical, and thermal insulation properties than acrylic/silica composites because of their lower particle size and their low thermal/electrical conductivity. Furthermore, to improve the surface hydrophobic characteristics of acrylic composites, the surface was treated with a dielectric barrier discharge (DBD) plasma jet. The DBD plasma jet treatment significantly enhanced the hydrophobicity of acrylic polymer composites. For example, the WCA of acrylic composites containing 5 wt% silica or cement nanoparticles increased from 35.3° to 55° and 44.7° to 73°, respectively, by plasma treatment performed at an Ar flow rate of 5 L/min and for an exposure interval of 25 s. The DBD plasma jet treatment is an excellent and inexpensive technique for improving the hydrophobic properties of acrylic polymer composites. These findings offer important perspectives on the development of materials coating for technical applications.

Thermally conductive and electrically insulated DGEBA-epoxy nano-composite fabricated by integrating GO/h-BN and rGO/h-BN hybrid for thermal management applications: a comparative analysis

Abstract Thermal interface materials (TIMs) are prerequisite components of micro- and nano-electronics, as well as advanced semiconductor applications. A bisphenol-A epoxy-based thermal adhesive amalgamated graphene oxide (GO), reduced graphene oxide (rGO), and modified hexagonal boron nitride (h-BN/mh-BN) are fabricated. The advantages of adhesive TIMs compared to other TIMs encompass lower cost, process savings, reduced component weight, and prevention of vibration loosening the high-end electronics. Additionally, some parts are not suitable for soldering, as they may lack “legs” that go through holes in the PCBs, and adhesive TIMs help prevent short circuits. The thermal conductivity (TC) is measured at 1.653 ± 0.057 W/mK when incorporating 44.5 wt% mh-BN hybrid rGO into the epoxy matrix. However, substituting rGO with GO reduced the TC to 0.81 ± 0.0289 W/mK due to the lower phonon transfer of GO compared to rGO. The binding strength, in terms of lap shear, of the utmost TC composite adhesive was within the range of 6.26 ± 0.48 MPa, which is acceptable for effective end applications. The thermal stability of both optimized composites (mh-BN/rGO and mh-BN/GO) has demonstrated better results beyond 280 °C. The highest TC epoxy nanocomposite, termed mh-BN/rGO4/epoxy, also revealed electrical insulation properties.

Numerical characterizations of the thermomechanical response of power modules with ceramic substrates and lead-free bonds

PurposeThe present paper aims to study the influence of the substrate system on the thermomechanical response of various lead-free die attach materials used in power electronics using nonlinear finite element simulations.Design/methodology/approachParticularly, three ceramic substrate systems, including direct copper bonded (DCB) and aluminum nitride (AlN) – as well as silicon nitride (Si3N4) –based insulated metal substrate (IMS) configurations are examined in this study. Additionally, three die attach systems, namely, silver-tin transient liquid phase (TLP), sintered silver (Ag) and sintered copper (Cu) are included in the analysis. ANSYS software is employed to build the finite element models of the power modules and to conduct the nonlinear thermomechanical investigations.FindingsThe simulation results revealed that the IMS, Si3N4 and DCB-based power modules end up with significantly lower interconnect inelastic strains and inelastic strain energies suggesting better fatigue life performance. Additionally, the bonding layer stresses and expected failure mechanism are not influenced by the substrate configuration rather than the bond material. For instance, the silver-tin TLP joints develop high stresses and hence brittle failures are expected. Nonetheless, the sintered Ag and sintered Cu have significantly lower stresses which could lead to fatigue-induced failures.Originality/valuePower electronics use various ceramic-based substrate systems because of their improved thermal conductivity, electrical insulation and heat resistance properties. The proper selection of the substrate structure could highly enhance the thermal fatigue of the power modules. Markedly, the findings of this research are useful for designing highly reliable and effective power modules continuously subjected to thermomechanical loadings.

Improved Corona Resistance of Epoxy Resin for Gas‐Insulated Equipment in Nitrogen Gas by Direct Fluorination

Direct fluorination has demonstrated efficacy in modulating the surface electrical properties of epoxy insulators and preventing surface charge accumulation. Comparative corona treatments were conducted on both surface fluorinated (modified) epoxy samples and untreated (virgin/original) samples using a modified electrode setup in a nitrogen (N2) atmosphere. The purpose was to evaluate the resistance of the modified epoxy surface layer against corona discharge. The results of ATR‐IR analysis and SEM surface and cross‐sectional imaging indicate that corona treatment did not alter the chemical composition of the fluorinated sample or the thickness of the fluorinated layer. Based on assessments of potential decay and water contact angle measurements, the surface conductivity of the modified sample was decreased by corona treatment. The wettability of fluorinated sample remained unchanged after corona treatment, and no soluble degradation products were produced. Conversely, the surface conductivity of the virgin sample exhibited an increase following corona treatment, accompanied by the formation of soluble degradation products. These results confirm that direct fluorination improves the epoxy insulator's discharge resistance in N2 and provides technical support for enhancing the electrical performance of epoxy insulators in gas insulated equipment. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

Constructing piperazine pyrophosphate@LDH@rGO with hierarchical core-shell structure for improving thermal conductivity, flame retardancy and smoke suppression of epoxy resin thermosets

The integration and miniaturization development of electronic devices placed the great demand for epoxy resin (EP) thermosets with excellent thermal management, flame retardancy and electrical insulation. Herein, a multifunctional additive piperazine pyrophosphate@layered double hydroxide@reduced graphene oxide (PPAP@LDH@rGO) with hierarchical core-shell structure was constructed by solvothermal and electrostatic self-assembly methods to meet the above requirements. Profiting from the distinct structure of PPAP@LDH@rGO, the thermal conductivity of EP/PPAP@LDH@rGO reached 0.951 W m−1 K−1 at 7 wt% addition (3 wt% rGO containing), which is 320.8 % increment compared to pristine EP. Meanwhile, when 4 wt% PPAP@LDH@rGO was added, the EP thermoset reached UL-94 V-0 rating during vertical burning tests with the limiting oxygen index of 29.8 % due to the synergistic effect of PPAP, LDH and rGO. The release of hazard products including smoke and carbon monoxide for EP/PPAP@LDH@rGO visibly declined during combustion. Besides, the EP thermosets also well-maintained the electrical insulation and mechanical properties. This work provided an alternative approach for preparing high performance EP thermosets which was suitable to be applied in electronics and electrical fields.

Microwave absorber surface design for 5G energy harvesting applications

This study presents a high-efficiency microwave absorber for energy harvesting in 5G frequencies. Initially, a unit cell was designed in four stages to efficiently absorb in the targeted frequency region. The results obtained for each stage of the design were analyzed, and additional investigations were conducted for substrate material and thickness based on the optimum performance of the unit cell structure. A unit cell absorber designed on an FR4 a flame-resistant fiberglass/epoxy-based composite, commonly utilized in printed circuit boards due to its favorable electrical insulation properties and low cost. With a thickness of 1.5 mm, the absorber achieved a 98.04% absorption at 3.8 GHz according to simulation results. Subsequently, this unit cell was separately designed and simulated with different periodic arrays to transform into an absorber surface. As a result, high absorption rates of 98.94% and 98.35% were achieved at 3.8 GHz and 4.2 GHz, respectively, in the 2 × 2 array. It was observed that the structure absorbs over 85% within a 1 GHz bandwidth between 3.5 GHz and 4.5 GHz. Finally, a prototype of the absorber surface was manufactured, and measurements were taken in the laboratory environment. Significant agreement was found between the data obtained from these measurements and the simulation results. The results indicate that the suggested absorber surface is well-suited for energy harvesting within the n77 (3.3 GHz to 4.2 GHz) and n78 (3.3 GHz to 3.8 GHz) bands of 5G communication.

Functionalization of boron nitride with poly(catechol-polyamine) and bis(γ-triethoxysilylpropyl)tetrasulfide for preparing epoxy nanocomposites with enhanced thermal conductivity

Hexagonal boron nitride (hBN) has garnered significant interest as inorganic thermally conductive material in electronic packaging due to its high-efficiency thermal management capability and electrical insulation properties. However, the relatively inert chemical environment of the BN surface hinders phonon transfer at the interface. Additionally, the high content of inorganic components in the matrix leads to the deterioration of the composite’s mechanical properties. In this research, h-BN surface is modified using poly(catechol-polyamine) (PCPA) and bis (γ-triethoxysi-lylpropyl)tetrasulphide (Si69) (denoted as BN-PCPA-Si69). The noncovalent PCPA modification protects the endothermic properties of BN, Si69 provides covalent bonding between thermally conductive fillers and bisphenol A-type epoxy resin (Ep), and the interfacial compatibility between BN and epoxy resin is improved. The heat conductivity of final BN/Ep composite achieved 0.817 W/(m·K) containing 30 wt% BN. Correspondingly, the heat conductivity of the composite (mBN/Ep) achieved 0.881 W/(m·K) containing 30 wt% BN-PCPA-Si69. Compared to pure epoxy resin (0.200 W/(m·K), the thermal conductivity (TC) of the mBN/Ep composite increased by 364% while maintaining good electrical insulation properties. The proposed BN surface functionalization approach has potential applications in fields such as microelectronic packaging, where materials need to balance high thermal conductivity and electrical insulation.

Porous TiO2 microspheres containing MgO nanoparticles/epoxy composite with superior thermal conductivity, EMI shielding, and electrical insulation

With the continuous advancement of electronic devices, the amounts of heat as well as electromagnetic (EM) waves generated have increased. Materials with high thermal conductivity and excellent EM interference shielding effectiveness (EMI SE) can be utilized to address this issue. In this work, we synthesized hollow anatase TiO2 microspheres. Through a reaction, MgO nanoparticles were incorporated into the interior of TiO2 microspheres. (H-TiO2/MgO). The heterostructure of the fillers contributed to performance enhancement. TiO2 and MgO particles formed a dual thermal-conduction pathway. H-TiO2/MgO effectively weakened the energy of EM waves upon contact. Additionally, TiO2, MgO, and epoxy all exhibited hydrophilicity. Consequently, the interfacial compatibility between H-TiO2/MgO and epoxy was excellent. They formed strong interfacial interactions by hydrogen bonding. Because of the excellent electrical insulation properties of H-TiO2 and MgO, the composites exhibited superior insulation performance (over 1010 Ω·cm). Our H-TiO2/MgO/Epoxy composites exhibited a maximum thermal conductivity of 7.52 W/m·K, an EMI SE of 64.92 dB, and a tensile strength of 79.10 MPa. Our composites are expected to effectively manage heat and EM waves generated by electronic devices

Simulation of the effect of temperature on space charge transport in LDPE under DC electric field stress

Polymers are considered essential materials used in high-voltage direct current (HVDC) applications due to their excellent insulating properties. They are widely employed in various electrical equipment such as cables, transformers, and station insulators, providing effective protection against high currents and voltages. One of the main challenges in these applications is the effect of temperature on the performance of these insulators, as elevated temperatures can alter the electrical properties of polymers, potentially impacting the dynamics of electric charges within the material. In this work, bipolar charge transport (BCT) was used to study the effect of temperature on the dynamics of space charge in LDPE under a DC electric field. The model includes processes such as injection, migration, trapping, detrapping, and recombination. We applied a DC electric field of 50 kV/mm to low-density polyethylene (LDPE) films for 2 hours under different temperatures. The results indicate that higher temperatures significantly enhance charge mobility, leading to improved charge flux, reduced trapping, and increased detrapping of charges. This results in a more uniform distribution of the electric field within the material and a quicker transition to a steady-state condition. The increase in temperature within the applied electric field created a relative balance between trapped charge and mobile charge, indicating a positive effect of higher temperatures on the electrical insulation properties of LDPE.

The impact of LSM pretreatment on the growth behavior, electrical insulation and corrosion resistance properties of PEO coating on 6061 aluminum alloy

This work reported the influence of laser surface melting (LSM) pretreatment on the growth behavior, electrical insulation and corrosion resistance of plasma electrolytic oxidation (PEO) film on 6061 aluminum alloy. It is found that the LSM pretreatment refines the surface structure of original Al metal, generating defects that store excessive energy, thereby enhancing reaction kinetics and phase transition during the PEO process. By LSM pretreatment, uniform electrical discharge and film growth can be obtained, resulting in fewer defects and lower porosity in PEO layers. Additionally, a large amount of columnar crystals comprising of SiO2 phase are observed, which transformed from the SiO32− deposited on the surface, and the LSM pretreatment significantly improves the electrical insulation, corrosion resistance, and substrate adhesion of following PEO layer. Under the same PEO treatment duration, the breakdown voltage of coating increased by 100 V, and icorr decreased from 3.26 × 10−4 to 9.13 × 10−6 A cm−2. It is expected that the combination of LSM and PEO processes can not only enhance the surface properties of Al metal, but also expand the practical application of aluminum alloy in high-power electronic devices and related fields.

Electrical insulation properties in a cold plasma of alumina coating for the in-vessel stabilizing shell of the RFX-mod2 fusion device

This paper presents the results of experimental tests on samples made of copper coated with alumina layer, performed to assess the reliability of its dielectric properties for applications in the low temperature plasma at the edge of a fusion device. The cue of the study was related to the plasma facing components of the RFX-mod2 fusion device (Marrelli et al., 2019, Peruzzo et al., 2023, Peruzzo et al., 2019), devoted to the experimental study of the magnetic confinement of fusion plasmas in a variety of configurations, including the reversed-field pinch and the tokamak. In RFX-mod2 an in-vacuum copper shell for the passive stabilization of MHD modes will surround the plasma. To avoid potentially harmful electrical discharges, which could be induced by rapid transients of the plasma current, this structure must be covered with an electrically insulating layer. For RFX-mod2 an alumina coating was chosen, whose dielectric properties have been tested both in air and in the presence of weakly ionized plasma. Electrical tests, conducted on copper samples with alumina deposits of about 100μm thickness, revealed that the ceramic layer has a high electrical resistance value in air (>1GΩ), but electrical discharges can occur in presence of a weakly ionized plasma, depending on compactness and porosity of the alumina layer, causing local melting of the alumina and expulsion of copper droplets from the substrate. Scanning Electron Microscope (SEM) analyses revealed that in the failed samples the ceramic layer was irregular and rough, with interconnected cavities and cracks, which could reduce its effective thickness and explain the dielectric breakdown at relatively low voltages (<400V). The analyses also showed that samples with a more compact layer present a higher dielectric strength in the presence of the plasma, highlighting that compactness and porosity play crucial roles in ensuring good insulation for materials in a plasma. This study led the definition of the requirements for the insulating coating of the plasma facing components of the RFX-mod2 fusion machine, however the results can be useful for other fusion and non-fusion plasma applications requiring electrical insulation, which can span from industrial devices to spacecrafts.

An optimal design of battery thermal management system with advanced heating and cooling control mechanism for lithium-ion storage packs in electric vehicles

Battery thermal management is crucial for the efficiency and longevity of energy storage systems. Thermoelectric coolers (TECs) offer a compact, reliable, and precise solution for this challenge. This study proposes a system that leverages TECs to actively regulate temperature and dissipate heat using transformer oil, known for its excellent thermal conductivity and electrical insulation properties. A thermal management system utilizing liquid immersion cooling was developed, providing both cooling and heating functionalities. The system was tested on a 48 V 26 Ah NMC Li-ion battery pack at charging rates of 0.5C and discharging rates of 0.5C and 1C. Maximum temperatures recorded were: natural convection (NC) at 42.8 °C and 54.9 °C, forced convection (FC) at 33.2 °C and 45.2 °C, and liquid immersion cooling (LIC) at 29.3 °C and 37.7 °C. LIC significantly lowered temperatures compared to NC and FC, while maintaining acceptable misbalance and capacity levels. Additionally, the liquid immersion heating setup effectively heated the battery from −25 °C to 0 °C before charging, demonstrating the system's capability to maintain optimal battery performance.

Constructing highly thermally conductive polystyrene-based composites by introducing multi-walled carbon nanotubes into melamine foam-supported boron nitride network

High-density 3D thermally conductive nanofiller network plays a vital role in the fabrication of polymer-based composites with high thermal conductivity (TC) for thermal management systems. In this work, highly thermally conductive polystyrene (PS)-based composites were prepared by introducing boron nitride nanosheets-coated melamine foam (MF@BNNSs) and carboxylated multi-walled carbon nanotubes (MWCNT–COOH). In this unique structure, MF@BNNSs can provide a 3D thermally conductive network, while MWCNT–COOH is embedded into the MF@BNNSs skeleton to improve the network-density. Specifically, the TC of PS/MWCNT/MF@BNNSs composite with 0.6 wt% MWCNT–COOH loading reaches 5.33 W /m· K, about 4.4-fold as high as that of the PS/MF@BNNSs. Moreover, the PS/MWCNT/MF@BNNSs composite exhibits effective heat dissipation capacity after assembling the power LED chip. Due to the isolation effect of MF@BNNSs skeleton, the PS/MWCNT/MF@BNNSs maintain electrical insulation properties. Consequently, the design of the thermal conductive network based on MF@BNNSs and MWCNT–COOH offered a substantial potential avenue for the preparation of polymer-based composites with high TC and insulating properties.