Effects Of Slurry Temperature Research Articles

磁場中配向成形におけるスラリー温度の影響

磁場中配向成形におけるスラリー温度の影響

Effect of Flow Rate of Slurry in Micro-Channels on the Consistency of Polishing Rate

According to the Bernoulli equation and Darcy formula, the flow model of slurry in micro-channels was established, it indicated that slurry viscosity is the main factor affecting the slurry mean velocity. According to the characteristics that liquid viscosity is mainly determined by the liquid temperature and the property that mechanical friction can improve the liquid temperature, the effects of slurry temperature, working pressure and polishing speed on the heterogeneity of polishing rate were investigated. The results showed that the effect of removal rate of each parameter on the central part of the copper film can be described as: slurry temperature > working pressure > polishing speed. In order to obtain the best planarization process, through the central composite experimental method, the technological parameters were optimized regarding the heterogeneity of polishing rate as response value. It was finally concluded that: when the slurry temperature was 21.60°C, the working pressure was 8.83kpa, the system speed was 43.92rpm, the predicted minimum value of the heterogeneity of polishing rate (HOPR) was 0.0574.

Filling ability of semi-solid A356 aluminum alloy slurry in rheo-diecasting

The effects of slurry temperature, injection pressure, and piston velocity on the rheo-filling ability of semisolid A356 alloys were studied by the reho-diecasting methods. The results show that the slurry temperature of the semi-solid A356 aluminum alloy has an important effect on the filling ability; the higher the slurry temperature, the better is the filling ability, and the appropriate slurry temperature for rheo-filling is in the range of 585–595°C. The injection pressure also has a great effect on the filling ability, and it is appropriate to the rheo-filling when the injection pressure is in the range of 15-25 MPa. The piston velocity also has a great effect on the filling ability, and it is appropriate to the rheo-filling when the piston velocity is in the range of 0.072-0.12 m/s. The filling ability of the slurry prepared by low superheat pouring with weak electromagnetic stirring is very good and the microstructural distribution in the rheo-formed die castings is homogeneous, which is advantageous to the high quality die casting.

Improvement of TEOS-chemical mechanical polishing performance by control of slurry temperature

Effects of slurry temperature on the chemical mechanical polishing (CMP) performance of tetra-ethyl ortho-silicate (TEOS) film with silica and ceria slurries were investigated. The change of slurry properties as a function of different slurry temperatures was also studied to obtain higher removal rates and smoother surface morphology. The changes observed with increasing temperature are as follows: the pH showed a slight tendency to decrease, the conductivity of the slurry showed a tendency to increase, the particle size in the slurry decreased, and the zeta potential of the slurry decreased with temperature. The removal rates linearly increased and maintained at the temperature of about 40 °C. The hydroxyl (OH −) groups increased in the slurry as the slurry temperature increased and then they diffused into the TEOS film. The surface of the TEOS film became hydro-carbonated by the diffused hydroxyl groups. The hydro-carbonated surface of TEOS film could be removed more easily. Better surface morphology of TEOS films could be obtained at 40 °C of silica slurry and at 90 °C of ceria slurry. It is found that the CMP performance of TEOS film could be significantly improved or controlled by change of slurry temperature with the same slurry.

Effect of Slurry Temperature on Cu Chemical Mechanical Polishing with Different Oxidizing Agents

AbstractChemical Mechanical Planarization (CMP) has evolved as one of the most critical and significant process in the manufacturing of semiconductor devices. Copper has become the material of choice for the interconnect wiring. The effect of heat generation at the interface is realized to be significant on copper CMP process. The increase in the oxidation rate of the chemical reaction and viscoelastic properties of polishing pads due to increase in temperature at the surface results in increased removal rates and change in planarization performance. In this research, the effect of temperature on the CMP performance using two most common oxidizing agents, KIO3 and H2O2 has been investigated using the CETRTM bench-top CMP tester. The coefficient of friction at the interface of polishing using both the oxidizers at different temperatures was monitored. The generated surface roughness post CMP was evaluated for samples polished using different oxidizing agents at different slurry temperatures. The AFM study was carried out using Digital InstrumentsTM D3100 instrument. This study is aimed at understanding the effect of temperature on the CMP process performance and the relative sensitivity of two most common oxidizers used in copper CMP towards temperature.

High gradient magnetic separation II: Single wire studies of shale oils

The single wire high gradient magnetic separation (HGMS) technique was used to investigate the buildup process of solid particles found in several different types of shale oils. The effects of slurry temperature, magnetic field, flow velocity, and solvent concentration on solid removal were determined. The results indicate that the HGMS technique is effective in removing solid particles from shale oil fluids. The efficiency can be further improved by reducing the viscosity of the shale oil slurry by heating and/or solvent dilution.