Dimensional Electromagnetic Analysis Research Articles

GPU-accelerated fem solver for three dimensional electromagnetic analysis

A new Graphics Processing Unit (GPU) parallelization strategy is proposed to accelerate sparse finite element computation for three dimensional electromagnetic analysis. The parallelization strategy is employed based on a new compression format called sliced ELL Four (sliced ELL-F). The sliced ELL-F format-based parallelization strategy is designed for hastening many addition, dot product, and Sparse Matrix Vector Product (SMVP) operations in the Conjugate Gradient Norm (CGN) calculation of finite element equations. The new implementation of SMVP on GPUs is evaluated. The proposed strategy executed on a GPU can efficiently solve sparse finite element equations, especially when the equations are huge sparse (size of most rows in a coefficient matrix is less than 8). Numerical results show the sliced ELL-F format-based parallelization strategy can reach significant speedups compared to Compressed Sparse Row (CSR) format.

The closed-form solution of vector finite element integral equations for three dimensional electromagnetic analysis

In this paper, a set of closed-form formulas for vector Finite Element Method (FEM) to analyze three dimensional electromagnetic problems is presented on the basis of Gaussian quadrature integration scheme. By analyzing the open region problems, the first-order Absorbing Boundary Condition (ABC) is considered as the truncation boundary condition and the equation is carried out in a closed-form. Based on the formulas, the hybrid Expanded Cholesky Method (ECM) and MultiFrontal algorithm (MF) is applied to solve finite element equations. Using the closed-form solution, the electromagnetic field of three dimensional targets can be studied sententiously and accurately. Simulation results show that the presented formulas are successfully and concise, which can be easily used to analyze three dimensional electromagnetic problems.

Novel techniques for millimeter-wave packages

A new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wideband RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost. Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite-difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883. >

Practical Design of Superconducting Generator. Electrical Characteristics Equations.

A superconducting generator (SCG) consists of a non-magnetic cryogenic rotor, which contains a superconducting field winding cooled by liquid helium, and an airgap armature winding, which makes it possible to get a high magnetic field in the airgap. Since the SCG construction differs from that of the conventional generator, practical application requires that its electrical and mechanical design methods be established.This paper describes electrical characteristics equations of the SCG, electromagnetic shield characteristics of double dampers and proof test results of a 50 MVA experimental SCG. Equations for the generator parameters (voltages, output capacity, reactances, time constants, flux densities), which are useful for practical design of the SCG, are derived from two dimensional electromagnetic analysis considering winding thickness and the edge effect. From comparison with measured and calculated values of no-load, sudden 1-3 phase short-circuit and slip extended tests, these equations were confirmed as valid.