AbstractIn response to the renewed interest in solute drag and solute trapping models fueled by their applications to additive manufacturing, a novel treatment is proposed to describe the diffusional behaviors of solute at a migrating solid–liquid interface during rapid solidification of multicomponent alloys. While the treatment is still built on irreversible thermodynamics and linear kinetic law, its novelty lies in breaking up the classical trans‐interface diffusional flux into two separate fluxes one is the transferred‐back flux with its ending point at the interface and the other is the bumping‐back flux with its starting point at the interface. This novel treatment entails three significant improvements in reference to the existing models. Firstly, it reveals that the degree of solute drag is dependent on the ratio of liquid diffusive speed over interface diffusive speed. Secondly, a novel relation between the distribution coefficient and interface velocity is derived. It amends the confusing behavior seen in Aziz’s without‐drag continuous growth model. Thirdly, the proposed treatment eliminates the need of prescribing the degree of solute drag parameter for the kinetic phase diagram calculation. The numerical solution to the proposed model is presented, and it is ready to be used for the kinetic phase diagram calculation.
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