Diffusion-limited Agglomeration Research Articles

From the Au nano-clusters to the nanoparticles on 4H-SiC (0001).

The control over the configuration, size, and density of Au nanoparticles (NPs) has offered a promising route to control the spatial confinement of electrons and photons, as a result, Au NPs with a various configuration, size and density are witnessed in numerous applications. In this work, we investigate the evolution of self-assembled Au nanostructures on 4H-SiC (0001) by the systematic variation of annealing temperature (AT) with several deposition amount (DA). With the relatively high DAs (8 and 15 nm), depending on the AT variation, the surface morphology drastically evolve in two distinctive phases, i.e. (I) irregular nano-mounds and (II) hexagonal nano-crystals. The thermal energy activates adatoms to aggregate resulting in the formation of self-assembled irregular Au nano-mounds based on diffusion limited agglomeration at comparatively low annealing temperature, which is also accompanied with the formations of hillocks and granules due to the dewetting of Au films and surface reordering. At high temperature, hexagonal Au nano-crystals form with facets along {111} and {100} likely due to anisotropic distribution of surface energy induced by the increased volume of NPs. With the small DA (3 nm), only dome shaped Au NPs are fabricated along with the variation of AT from low to elevated temperature.

Defectivity Avoidance in Chemical Mechanical Planarization: Role of Multi-Scale and Multi-Physics Interactions

A multi-physics model encompassing chemical dissolution and mechanical abrasion effects in CMP is developed. This augments a previously developed multi-scale model accounting for both pad response and slurry behavior evolution. The augmented model is utilized to predict scratch propensity in a CMP process. The pad response delineates the interplay between the local particle level deformation and the cell level bending of the pad. The slurry agglomerates in the diffusion limited agglomeration (DLA) or reaction limited agglomeration (RLA) regime. Various nano-scale slurry properties significantly influence the spatial and temporal modulation of the material removal rate (MRR) and scratch generation characteristics. The model predictions are first validated against experimental observations. A parametric study is then undertaken. Such physically based models can be utilized to optimize slurry and pad designs to control the depth of generated scratches and their frequency of occurrence per unit area.

Understanding Multi Scale Pad Effects in Chemical Mechanical Planarization

AbstractA multi-physics model encompassing chemical dissolution and mechanical abrasion effects in CMP is developed. This augments a previously developed multi-scale model accounting for both pad response and slurry behavior evolution. The augmented model is utilized to predict scratch propensity in a CMP process. The pad response delineates the interplay between the local particle level deformation and the cell level bending of the pad. The slurry agglomerates in the diffusion limited agglomeration (DLA) or reaction limited agglomeration (RLA) regime. Various nano-scale slurry properties significantly influence the spatial and temporal modulation of the material removal rate (MRR) and scratch generation characteristics. The model predictions are first validated against experimental observations. A parametric study is then undertaken. Such physically based models can be utilized to optimize slurry and pad designs to control the depth of generated scratches and their frequency of occurrence per unit area.

Diffusion-Limited Agglomeration and Defect Generation during Chemical Mechanical Planarization

Chemical mechanical planarization (CMP) of copper involves removal of surface asperities with abrasive particles and polishing processes. This leads to copper-containing nanoparticles extruded into the solution. We model the diffusion-limited agglomeration (DLA) of such nanoparticles which can rapidly grow to large sizes. These large particles are detrimental because they can participate in polishing, causing scratches and surface defects during CMP. The agglomeration is much slower in the reaction-limited agglomeration process. Under realistic conditions the defect generation probability can increase significantly over time scales of to 20 min from DLA, unless prevented by slurry rejuvenation or process modification measures.

Prediction of scratch generation in chemical mechanical planarization

A multi-scale model encompassing pad response and slurry behavior is developed to predict scratch propensity in a chemical mechanical planarization (CMP) process. The pad response delineates the interplay between the local particle level deformation and the cell level bending of the pad. The slurry agglomerates in the diffusion limited agglomeration (DLA) or reaction limited agglomeration (RLA) regime. Various nano-scale slurry properties significantly influence the spatial and temporal modulation of the material removal rate (MRR) and scratch generation characteristics. The model predictions are first validated against experimental observations. A parametric study is then undertaken. Such physically based models can be utilized to optimize slurry and pad designs to control the depth of generated scratches and their frequency of occurrence per unit area.