DFM Solution Research Articles

DFM Challenges and Solutions for 14nm FinFET

DFM Challenges and Solutions for 14nm FinFET

Optimization of M1 to Contact Connection in Sub-40nm Node

This paper presents integration challenges associated with M1 to CT connection in Ultra low-k (ULK) Back-End-Of-Line (BEOL) interconnects for 40nm node and beyond. In advance IC fabrication, porous dielectric materials, such as BDII (related dielectric constant k about 2.5), are commonly used as insulator in copper interconnects for RC delay reduction. But the material of inter-dielectric layer is still high density SiO2-based. Hence, the difference in materials of PMD and IMD would potentially induce mismatch of physical properties of the two types of dielectric and cause deterioration of M1 to Contact connection, which would further impact product yield by contact open or other issues. Cross section pictures of failing M1 to CT connection were exhibited with a special spacer profile and investigated to illustrate the phenomenon. Solutions were proposed, through optimization of Etch, Wet clean and CMP to improve process window. Layout optimization is also suggested as OPC and DFM solution for related layers. Some of the solutions were examined by experiments with 40nm BEOL test masks. Results of physical and electric characterization were presented and discussed.

Four novel ketocoumarin-based chromophores: Synthesis, photoluminescent behaviors and theoretical studies

Abstract Four novel coumarin derivatives were synthesized and characterized via MS, 1 H NMR, FT-IR, and UV–vis absorption spectra. The fluorescence behaviors of the compounds in DFM solutions were observed. The compounds exhibited strong blue and green emissions under ultraviolet light excitation. Calculations performed using a combined time-dependent density functional theory (TD-DFT) and conductor-like polarizable continuum model (C-PCM) reproduced the π → π * type absorption bands of the four compounds. Resonance frequency calculations were also performed to study the IR spectra of the compounds. The calculated results are in good accordance with the experimental values.

Design for manufacturability for fabless manufactuers

When a company designs and sells ICs but outsources their manufacture, design for manufacturability poses special challenges. It is clear that these DfM solutions are very complex and require a series of fundamental new physical models and design practices. Practical deployment of DfM solutions requires development of an entire incremental infrastructure on both the process and design sides of the technology integration spectrum. Optimizing the various DfM methods involves complex, multi-faceted tradeoffs that are ultimately dependent on target technology and various product attributes. DfM is definitely not a one-size-fits-all panacea for all of the process manufacturability and variability challenges. Complete and successful DfM deployment is a true ecosystem that requires multiple tools using multiple models, potentially calibrated to multiple levels of accuracy, inserted at multiple points in the design flow.

Valor DFM solution brings shorter delivery times and increased quality to Siemens Bocholt

Valor DFM solution brings shorter delivery times and increased quality to Siemens Bocholt