Development Of Microwave Circuits Research Articles

Substrate Integrated Transmission Lines: Review and Applications

This paper presents a general overview of substrate integrated transmission lines, from the perspective of historical background and progress of guided-wave structures and their impacts on the development of microwave circuits and integration solutions. This is highlighted through a technology roadmap involving the categorized five generations of microwave circuits. In particular, the substrate integration technologies are reviewed and discussed with focus on technical features, design highlights, component developments, structures evolution, and systems integration. A number of examples are presented to showcase some of the selected milestone research and development activities and accomplishments in connection with substrate integrated transmission line technologies, with particular focus on substrate integrated waveguide (SIW) techniques. Practical applications and industrial interests are also presented with key references and technical results, which show more and more product developments in the end-user sectors. It can be found that the popularity of SIW techniques is closely related to the achieved seamless integration of planar and non-planar structures into a unified design space, thereby allowing the possibility of combining major advantages of all the structures while alleviating their potential drawbacks. The future perspectives of the substrate integration technology are discussed through five major research directions, which suggest potential impacts in the development of future generations of circuits and systems such as system-on-substrate (SoS).

Electromagnetic Amplification of Microwave Phonons in Nonlinear Resonant Microcavities

In this paper, we report on the numerical simulation of a multiphysic electromagnetic/mechanical problem, as a further step toward the development of microwave circuits based on phonon propagation at micro and nanoscale. In the future, this kind of circuits is likely to integrate optomechanically pumped phonon sources and detectors, as well as phonon processing components (waveguides, splitters, and memories) to process information by means of phonons. In particular, we propose a rigorous approach for the solution of the electromagnetic/mechanical system of equations governing light behavior in optomechanical cavities, with the help of the transformation optics method. Such a kind of calculation allows the development of an efficient generation of microwave coherent phonon sources, by engineering their propagation or coupling with phonon waveguides.

Introduction To The Special Issue On Microwave Circuits On Silicon Substrates

This article discusses the development of microwave circuits on silicon substrate. Silicon, even though inexpensive, did not provide the performance required for microwave circuits. Instead the development of microwave circuits used GaAs and InP substrates. With the development of commercial usages for microwave circuits, the costs of microwave circuits became an issue. The importance of cost, and the development of Si-device capabilities and fabrication techniques, such as molecular beam epitaxy, and ultra-high chemical vapor deposition. provided the circumstances where the development of microwave circuits on silicon is now possible.

An electrical engineering review: printed-wiring techniques

Printed wiring was first introduced during World War II. The various processes developed for its production are briefly described. (Printed wiring is distinguished from printed circuits where components are deposited as part of the process.) The etched-foil wiring technique is studied in some detail and recent plating processes are discussed. Some base materials are examined, p.t.f.e. impregnated glass-fibre laminates having the best electrical properties of materials developed so far.Printed-wiring systems form the basis of automatic component-assembly techniques, which themselves require the development of suitable components and involve the standardization of certain parameters such as body size, axial design, lead diameter, and finishes for easy soldering. Several automatic soldering systems are in use.The development of microwave circuits is mentioned and special techniques for high-temperature operation of printed wiring up to 500°C are explained.The reliability of present-day printed wiring is examined. Trends towards future developments include progress in the microminiaturization field—where true printed circuits are involved.