Development Of Electronic Industry Research Articles

The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure

AlN ceramic is the potential substrate for high-performance printed circuit board with the rapid development of electronic industry due to the superior thermal and electrical property, while its metallization still faces the issues of thermal stress and weak interface bonding with existing technology. Herein, a convenient design is proposed to achieve the Cu deposition on the surface of AlN substrate, the TiO2 containing photocatalytic intermediate layer is prefabricated on AlN substrate with silica and titania mixed sol, and induces the autocatalytic deposition of electroless copper plating under ultraviolet irradiation. Compared with Cu deposition with Pd activation treatment, the bonding strength between Cu layer and AlN substrate is significantly enhanced with the intermediate layer, this is ascribed to the formed nano-porous microstructure of the sintered intermediate layer facilitating the penetration of plating bath, and the mechanical anchoring effect derived from the interlocking microstructure between Cu layer and intermediate layer contributes to the improved bonding strength. This new method realizes the metallization of AlN ceramic with high interfacial bonding strength and low cost compared with the traditional joining technology, and provides a potential reference for the surface metallization of inert material.

Hydrophobic Multilayered PEG@PAN/MXene/PVDF@SiO2 Composite Film with Excellent Thermal Management and Electromagnetic Interference Shielding for Electronic Devices.

With the rapid development of electronic industry, it's pressing to develop multifunctional electromagnetic interference (EMI) shielding materials to ensure the stable operation of electronic devices. Herein, multilayered flexible PEG@PAN/MXene (Ti3C2Tx)/PVDF@SiO2 (PMF) composite film has been constructed from the level of microstructure design via coaxial electrospinning, coating spraying, and uniaxial electrospinning strategies. Benefiting from the effective encapsulation for PEG and high conductivity of MXene coating, PEG@PAN/MXene composite film with MXene coating loading density of 0.70mg cm-2 exhibits high thermal energy storage density of 120.77 J g-1 and great EMI shielding performance (EMI SE of 34.409dB and SSE of 49.086dB cm3 g-1) in X-band (8-12GHz). Therefore, this advanced composite film can not only help electronic devices prevent the influence of electromagnetic pollution in the X-band but also play an important role in electronic device thermal management. Additionally, the deposition of nano PVDF@SiO2 fibers (289±128nm) endowed the PMF composite film with great hydrophobic properties (water contact angle of 126.5°) to ensure the stable working of hydrophilic MXene coating, thereby breaks the limitation of humid application environments. The finding paves a new way for the development of novel multifunctional EMI shielding composite films for electronic devices.

Роль организационно-управленческих инноваций в развитии электронной промышленности России

In modern world practice, there is an increasing interest in the application of organizational and managerial innovations, and there is also an accelerated development of the global electronics industry, which requires additional sources of improving the performance of Russian enterprises in this industry, which are mainly in catching up positions relative to global competitors. Therefore, the study of the impact of organizational and managerial innovations on the effectiveness of organizations of the electronic industry in Russia is an urgent scientific task. It is worth noting that there are no studies in Russian publications on the importance of organizational and managerial innovations in the development of the electronic industry in Russia. The purpose of this article is to determine the degree of importance of organizational and managerial innovations in the development of the electronic industry in Russia. The implementation of this goal required solving the following tasks: to analyze the possible transformation in the electronic industry of the Russian Federation and the prospects of the industry in the sixth technological order and the fourth industrial revolution; to determine the aspects of the impact of organizational and managerial innovations on the effectiveness of organizations during technological changes; to determine the impact of organizational and managerial innovations on the effectiveness of R&D in the electronic industry of Russia. As a result, the high importance of organizational and managerial innovations and the need for long-term intensification of the use of this type of innovation in the electronic industry of Russia are proved.

Numerical prediction of glass molding process for 3D curved screen

With the rapid development of consumer electronics industry, the demand for 3D curved screen in industry is also growing. At present, 3D curved screen is mass produced through glass molding process. However, due to the complex rheological properties of glass melt and the intricate deformation mechanism of glass molding process, the final geometry of the screen is difficult to predict. In this paper, the glass molding process for 3D curved screen is analyzed by finite element transient analysis. The trend of screen shape change is obtained and the final geometry of the screen is predicted. The results show that geometric fillet and rheological parameters have great influence on the flow of glass melt in glass molding process. This study is helpful for the selection of parameters of glass molding process and the design of 3D curved screen.

Intelligent Platform Research System for the Highly Integrated Development of My Country's Electronics Manufacturing Industry and Service Industry

With the help of normative analysis, empirical analysis and comparative analysis, this article combines the characteristic facts and empirical data of the development of China's producer service industry and electronic manufacturing industry to deeply analyze the internal and dynamic factors of the development of the producer service industry and the factors affecting the development of China's producer service industry. On the basis of theoretical and empirical analysis, to explore the underlying reasons for the low level of development and development quality of China’s producer service industry and the low level of interaction and integration with the electronics manufacturing industry, an intelligent platform for integrated development based on deep learning has been established, enabling both parties fusion efficiency increased by 7.3%.

Hydroxyl-group decreased dielectric loss coupled with 3D-BN network enhanced high thermal conductivity epoxy composite for high voltage-high frequency conditions

The rapid development of electrical and electronics industry puts forward new requirements for high thermal conductivity and low dielectric loss of insulating materials. However, the traditional strategies to improve thermal conductivity of insulating materials with high thermal additives quantity usually accompany with the huge increase in dielectric loss, which will eventually lead to thermal breakdown and cannot meet the real demand under high voltage-high frequency conditions. Herein, in-situ bubble-induced self-assembled strategy was used to fabricate 3D boron nitride (BN) network/epoxy composites. The cellulose with rich hydroxyl groups could both crosslink with epoxy group and form hydrogen bonding with the hydroxyl groups on BN, which restricts the polymer chain movement and ensures the low dielectric loss. Improved thermal conductivity (1.62 W/(m·K), 8 times higher than that of EP) and decreased dielectric loss (0.00597, 18.1% lower than that of EP at 46.4 kHz, 20 °C) of the as-prepared composites contribute to the significant extension of the thermal breakdown time (411.4% higher than that of EP at 44 kHz). In addition, the partial discharge inception voltage of the composites is 8.9% higher than that of EP. These advantages make it attractive to high reliability of thermal management applications in the electrical and electronics industry.

Thermal conductive nylon 6 composites with hybrid fillers prepared through reaction during extrusion

Currently, heat dissipation has become one of the key points to the development of novel electronic industry due to the process of miniaturization and integration, while the demand of heat dissipation could not be satisfied by the commonly used polymers. Plenty of methods to promote the thermal conductivity involve complicated steps, which hinder the feasibility of industrial application. In this work, a multi-level local thermal conductive network was designed through the reaction of amino group and epoxy group on the surface of specific fillers in the process of melt mixing to improve the thermal conductivity. The thermal conductivity of the composite prepared with reaction during extrusion was 2.121 W m−1 K−1 at 50 wt% filler content, which is better than similar combination without reaction (1.87 W m−1 K−1). Improved thermal conductivity can be attributed to the synergistic effect of glass fiber (GF) and boron nitride (BN) modified by γ-glycidoxypropyltrimethoxysilane (KH560) and aminopropyl-trimethoxysilane (KH550), respectively. This convenient strategy provides a promising method to further constructing thermal conductive network with enhanced industrial application.

Recent advances in lithiophilic materials: material design and prospects for lithium metal anode application

The rapid development of electronic technology and energy industry promotes the increasing desire for energy storage systems with high energy density, thus calling for the exploration of lithium metal anode. However, the enormous challenges, such as uncontrollable lithium deposition, side reaction, infinite volume change and dendrite generation, hinders its application. To address these problems, the deposition behavior of lithium must be exactly controlled and the anode/electrolyte interface must be stabilized. The deposition of lithium is a multi-step process influenced by multi-physical fields, where nucleation is the key to final morphology. Hence, increasing investigations have focused on the employment of lithiophilic materials that can regulate lithium nucleation in recent years. The lithiophilic materials introduced into the deposition hosts or solid electrolyte interphases can regulate the nucleation overpotential and facilitate uniform deposition. However, the concept of lithiophilicity is still undefined and the mechanism is still unrevealed. In this review, the recent advances in the regulation mechanisms of lithiophilicity are discussed, and the applications of lithiophilic materials in hosts and protective interphases are summarized. The in-depth exploration of lithiophilic materials can enhance our understanding of the deposition behavior of lithium and pave the way for practical lithium metal batteries.

Stable water-floating transistor with recyclability.

Electronic wastes from used devices containing environmentally hazardous materials are an immediate concern for the sustainable development of electronic and sensor industries. To address this, a highly controllable and dedicated electronic module should be devised, that allows systematic recollection of as many components from the original device for their reuse. Here, we report the total recycling of an electronic device, exploiting a water-floating system that is based on a water-compatible semiconductor as an active material. To do so, we developed a system for stable electronics on the water surface. The floating semiconductor features a tunable morphology on the water surface, and is constructed into a water-floating gated transistor (WFGT) and water floating sensor (WFS), exhibiting an on-current of 4.2 × 10-5 A and an on/off ratio of ∼103. The device showed high recyclability over 25 cycles, with an efficiency of 99 ± 0.9% within 1 cycle and 92 ± 0.7% within 30 cycles. Furthermore, the device was also found to be stable for over 10 days. Our system has the potential to be an eco-friendly, cost-effective, and scalable device that is fully recyclable, which can be applied in areas once thought of as being beyond the scope of current semiconductor technology.

Biopolymer‐Based Aerogels for Electromagnetic Wave Shielding and Absorbing

Comprehensive SummaryThe rapid development of communication technology and electronic industry has brought unprecedented serious electromagnetic interference (EMI) and electromagnetic wave (EMW) pollution. Although EMI shields and EMW absorbers based on metal or magnetic materials were used to solve these problems, they have long been criticized for their high price, high density and easy corrosion. In order to achieve low density and efficient dissipation of electromagnetic energy, aerogels stand out among manifold materials. However, constructing aerogels with good EMI shielding or EMW absorption performance and acceptable mechanical properties is not an easy task. Burgeoning biopolymers, such as cellulose, lignin, chitin/chitosan and alginate, breathe new life into aerogels for high‐efficiency EMW shielding and absorbing. Here, we reviewed the contributions of biopolymers in the fields of aerogels for EMW shielding and absorbing. At the same time, some challenges and outlook were also pointed out, aiming to promote the advance of aerogel‐based EMI shields and EMW absorbers as well as the rational utilization of biopolymers.

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation.

Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

Электронная промышленность в условиях санкций: Россия и Китай — партнеры или конкуренты?

The article presents an analysis of information on the state and prospects of the development of the electronic industry in Russia and China under sanctions. The factors hindering the development of the local electronics industry and integration into the global semiconductor value chain, the basic redistribution of the electronics industry, have been identified. The available technological and production capabilities of Russia and China in the field of electronic industry are considered. Potential conflict points between the two countries have been identified. It is concluded that when creating new regional value chains of electronic products in collaboration with friendly countries, it is necessary to reach agreements either on the delimitation of their segments between participants, or on quotas for the production of the similar products to reduce competition and increase the efficiency of interaction.

High Energy Density of Polyvinylidene Fluoride‐Based Composite Films Induced by Anisotropic PLZT Fillers

AbstractWith the rapid development of electronic industry, high‐energy storage density dielectric materials are urgently needed to meet electronic components equipment miniaturized demand. Polymer dielectric materials have the advantages of good flexibility and high breakdown field, however, the energy storage capacity of polymers is limited by its inherent low dielectric constant. To improve the dielectric constant and energy storage density of the polymer material, we synthesized 0D (zero dimension), 1D, 2D lanthanum modified lead zirconate titanate (PLZT) fillers which introduced into polyvinylidene fluoride (PVDF) matrix. The anisotropic of the fillers has obvious improvement on the properties of materials. Compared with 0D fillers, high anisotropic fillers are more effective in enhancing the dielectric performances and energy density of PVDF based composites. The high anisotropic ratios of 2D fillers limit the charge migration toward the electrodes and hold back the growing electric tree during breakdown. Consequently, high breakdown strength (430 MV/m) and high discharge energy density (13.9 J/cm3) for 2D PLZT/PVDF composite films were obtained. This work is of critical significance in making dielectric capacitors for energy storage devices and reveals the influence mechanism for different dimensions fillers on the dielectric and energy storage properties of PVDF based composites.

Improvement of dielectric and energy storage properties in Sr0.85Bi0.1ZrO3 modified (Bi0.5Na0.5)0.7Sr0.3TiO3 lead-free ceramics

In recent years, with the rapid development of electronic components industry, higher requirements are put forward for energy storage density and efficiency of pulse power capacitors. In this work, the improved energy storage density and efficiency of (Bi 0.5 Na 0.5 ) 0.7 Sr 0.3 TiO 3 (BNST)-based ceramics have been obtained by introducing the Sr 0.85 Bi 0.1 ZrO 3 (SBZ). The addition of SBZ reduced phase transition temperature to about 50 ºC, accompanied by relaxation enhancement. A high recoverable energy density ( W rec = 3.53 J/cm 3 ) and energy efficiency ( η = 87.15%) were synchronously achieved in 0.875BNST-0.125SBZ ceramic under 270 kV/cm. Moreover, excellent temperature stability (20–120 ºC) and frequency stability (5–200 Hz) for energy storage have been achieved at 150 kV/cm. A power density ( P D ) of 7.32 MW/cm 3 and the transitory discharge time ( t 0.9 = 0.86 μs) were achieved for 0.875BNST-0.125SBZ ceramics under 120 kV/cm. These characteristics indicate that 0.875BNST-0.125SBZ ceramic is expected to be applied in high-power equipment. • The addition of SBZ reduced phase transition temperature to about 50 ℃, accompanied by relaxation enhancement. • 0.875BNST-0.125SBZ ceramic possesses a high recoverable energy density of 3.53 J/cm³ and efficiency of 87.15%. • 0.875BNST-0.125SBZ ceramic exhibits good electrical stability in wide frequency (5–200 Hz) and temperature range (20–120 ℃). • A high power density ( P D ) of 7.32 MW/cm 3 and a transitory discharge time ( t 0.9 ~0.86 µs) can be achieved.

Hybrid Microchannel Heat Sink with Sustainable Cooling Solutions: Numerical Model Validation

Miniaturization and utilization of low-dimensional structures of recent electronic devices have witnessed some new micro cooling methods which can fulfil the cooling demand for the electronic devices. Microchannel heat sink (MCHS) is one of the micro cooling method which appears as a promising method that can provide high heat transfer rate due to small hydraulic diameter. Furthermore, microchannel heat sink is easy to be fabricated compare to other micro cooling device. Due to fast development in electronic industry, hybrid microchannel heat sink with optimal design has received a great deal of attention in order to provide sustainable cooling solutions. However, most of the studies of hybrid microchannel heat sink only provided the numerical analysis without any validation of the proposed design experimentally. This is very important since it also will determine whether the proposed hybrid microchannel heat sink can be fabricated or not. Therefore, the aim of this article is to validate the numerical model of hybrid microchannel heat sink (TC-RR-SC MCHS) experimentally. The validation result showed that the maximum discrepancy between both simulation and experimental analyses for Nusselt number and friction factor were 15.8% and 17.4%, respectively, which is less than 20%. The different number of microchannels between the simulated TC-RR-SC MCHS and fabricated TC-RR-SC MCHS is one of the factors that contribute to the data discrepancy. Furthermore, the poor finishing during the fabrication process also another factor because the burrs and debris at the top and bottom surface of microchannels affect the convective heat transfer area and the flow area of fluid.

Enhanced energy storage properties of Sr(Ti 0. 5 Zr 0 .5 ) O 3 modified (Na 0. 5 Bi 0 .5 ) TiO 3 ceramics

With the rapid development of electronic industry, the miniaturization and integration of components have become an irreversible development trend, which puts forward high requirements for lead-free ceramic materials with excellent recoverable energy storage density and efficiency. In addition, it is also a great challenge to sustain excellent energy storage performance under different environmental conditions. In this work, a combined design strategy was proposed to induce polar nano regions and reduce grain size by introducing SrTi0.5Zr0.5O3 (STZ). The addition of STZ reduced the grain size to submicron level, accompanied by relaxation enhancement. The high energy storage properties (Wrec = 1.85 J/cm3, η = 65.92%) were achieved in 0.80Bi0.5Na0.5TiO3-0.20SrTi0.5Zr0.5O3 (BNT-STZ) ceramics at 150 kV/cm. Excellent temperature stability (40°C-160°C) and frequency stability (1-500 Hz) of energy storage performance have been obtained under 100 kV/cm, with the fluctuations below 8%. Importantly, A high power density of 3.64 MW/cm3 and a transitory discharge time (t0.9 ~ 0.632 μs) were achieved for 0.80BNT-0.20STZ ceramic under 160 kV/cm. These characteristics indicate that 0.80BNT-0.20STZ ceramic is expected to be applied in high-power equipment. Highlights A combined design strategy was proposed to induce polar nano regions and reduce grain size by introducing STZ. 0.80BNT-0.20STZ ceramic possesses a recoverable energy density of 1.85 J/cm3 and efficiency of 65.92%. 0.80BNT-0.20STZ ceramic exhibits good electrical stability in wide frequency (1-500 Hz) and temperature range (40-160°C). A high power density (PD) of 3.64 MW/cm3 and a transitory discharge time (t0.9 ~ 0.632 μs) can be achieved.

Analysis on the innovation efficiency of China's electronic and communication equipment industry

The development of electronic and communication equipment industry is the driving force of economic growth, and innovation is the basic motivation for the development of electronic and communication equipment industry. The evaluation of innovation efficiency of electronic and communication equipment industry (IEEC) is conducive to economic growth and better development of electronic and communication equipment manufacturing industry. The existing researches mainly focus on the efficiency evaluation of high-tech industry, and there is few study on the IEEC. To fill the gap, based on DDF model and Global-Malmquist index, this paper estimates the IEEC in 20 provinces of China from 2009 to 2018. The results show that: (1) From the perspective of time dimension, China's IEEC shows an overall growth trend in the past decade from 2009 to 2018. (2) From the regional perspective, IEEC exists differences among regions. Under the meta-frontier and group frontier, the value of IEEC in the central region is higher than the value of IEEC in the eastern region and western region. (3) From the decomposition index, the growth of IEEC depends more on technological progress, rather than efficiency improvement. Combined with the above conclusions, some policy implications are proposed.

Hybrid Microchannel Heat Sink with Sustainable Cooling Solutions: Experimental Analysis

Miniaturization and utilization of low-dimensional structures of recent electronic devices have witnessed some new micro cooling methods which can fulfil the cooling demand for the electronic devices. Microchannel heat sink (MCHS) is one of the micro cooling method which appears as a promising method that can provide high heat transfer rate due to small hydraulic diameter. Furthermore, microchannel heat sink is easy to be fabricated compare to other micro cooling device. Due to fast development in electronic industry, hybrid microchannel heat sink with optimal design has received a great deal of attention in order to provide sustainable cooling solutions. However, most of the studies of hybrid microchannel heat sink only provided the numerical analysis without any validation of the proposed design experimentally. This is very important since it also will determine whether the proposed hybrid microchannel heat sink can be fabricated or not. Therefore, the aim of this article is to validate the numerical model of hybrid microchannel heat sink (TC-RR-SC MCHS) experimentally. The validation result showed that the maximum discrepancy between both simulation and experimental analyses for Nusselt number and friction factor were 15.8% and 17.4%, respectively, which is less than 20%.

Precision cutting of PDMS film with UV-nanosecond laser based on heat generation-diffusion regulation

Laser precision cutting of polydimethylsiloxane (PDMS) films technology will greatly promote development of flexible electronics industry. However, mechanism and optimization method of PDMS films laser cutting is still unclear. On one hand, mechanism of ultraviolet (UV) nanosecond laser precision cutting of PDMS films with laser ablation as the core was explored based on analysis of by-product components. On the other hand, laser cutting quality optimization method of heat generation- diffusion co-regulation was proposed based on the mechanism of laser ablation. The minimum width of the groove and the heat affected zone were obtained by regulating the heat generation process at room temperature, 67.1 ± 1.7 μm and 6.8 ± 0.8 μm, respectively. In addition, the heat diffusion process can be regulated by lowering ambient temperature to further optimize the quality of cut. Using this optimization method, a spring-shape flexible electrode was prepared, and circumferential stretch limit of this spring-shape flexible electrode has been increased from 10% to 150% compared with planar PDMS film flexible electrodes.

Textile-derived freestanding Fe3O4/Porous carbon cloth composite electrode for flexible Li-ion batteries with remarkable cycling stability

The flexible substrates commonly used (carbon cloth, CNT film, graphene film) as a current collector provide negligible capacity, the complicated preparation process and high cost further limit its practicality. Herein, a flexible Fe3O4/porous carbon cloth composite electrode with controllable structure was successfully prepared by utilizing the unique dyeing technique and subsequent pyrolysis. The analysis of lithium storage contribution confirmed that the carbon cloth matrix provides 0.53 mAh cm−2 capacity at a high current density of 1 mA cm−2 because the carbon fibers were partly etched by Fe-base species. As we expected, this composite electrode delivers a high areal capacity of 1.53 mAh cm−2 at a high current density of 1 mA cm−2 after 100 cycles. The excellent performance can be ascribed to that the carbon coated Fe3O4 electrode possesses several advantages, including rendering an efficient electron/ion transport network, relieving the volume expansion of Fe3O4 nanoparticles, and enabling superior kinetics with higher capacitive contribution. More importantly, the flexible electrodes with robust nature endow the pouch-cell with superior performance and excellent flexibility. In this regard, the low-cost and large-scale production methodology as well as the promising electrochemical results will bring a new dawn for the development of flexible electronic industry.