Surfaces of (001) p-type silicon substrates were bombarded with either Ar or Kr ions prior to direct wafer bonding using an EVG© ComBond© high-vacuum wafer-bonding system.1 Previously, we showed that this ion bombardment treatment induces a thin ~nm amorphous region at the bonded interface.2 In this study, we extend upon this previous effort towards a fundamental understanding of this amorphous interfacial region by examining the dependence of the bonded interface’s properties with two different ion species. The ion energies used spanned from a factor of 0.5 to 2.5 times of a baseline energy E0. X-ray reflectivity measurements were performed on single unbonded wafers that were ion bombarded with either Ar or Kr to determine the thickness of the amorphous region as well as its mass density compared to bulk Si. Wafers treated with Ar showed no surface mass density dependence with ion energy, while wafers treated with Kr did show an ion energy dependence. While the Ar treatment reduces the surface density to ~80% of bulk Si density regardless of the energy used, the Kr treatment reduces the surface density to as low as ~70% of bulk Si density at 2.5⋅E0. Furthermore, for a given energy, the Ar treatment resulted in thicker layers than the Kr treatments, which is consistent with SRIM3 simulations because Kr is a heavier species than Ar. Current-voltage measurements were also used to probe the electrical properties of the bonded interfaces. Band structure modeling of the current-voltage measurements revealed that the amorphous region can be modeled with a step barrier that spans the thickness of the amorphous region.References Flötgen, et al., ECS Trans., 64(5), 103 (2014).E. Liao, et al., ECS Trans., 86(5), 55 (2018).F. Ziegler, et al., The Stopping Range of Ions in Solids vol. 1, (1985). Figure 1
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