Deep-acceptor Density Research Articles

Degradation behavior of CIGS solar Cells: A parametric analysis

A parametric study of the effect of bulk and interface properties on device characteristics as a function of heat and light stress under open-circuit and short-circuit conditions is developed for Cu(In,Ga)(S,Se)2 solar cells using SCAPS-1D simulator. The variables and interdependencies modeled include: (1) conduction band offset (CBO) between buffer and absorber; (2) buffer ionized donor density; (3) CIGS shallow acceptor density; (4) CIGS deep acceptor density; (5) CIGS shallow donor density; (6) ionized acceptor concentration in the ordered vacancy compound (OVC) CIGS/buffer interface; and (7) back contact work-function. An increase in absorber shallow acceptor or a decrease in shallow donor density results in an increase in net carrier density and open-circuit voltage (VOC). A decrease in VOC is observed with an increase in the deep acceptors or neutral midgap defects in the CIGS due to higher charge carrier recombination. A change of CBO from spike to cliff condition is a dominant mechanism of decreasing VOC with an interface defect density of 1012 cm−2. The minimum depletion width is found to be specifically sensitive to CBO and interface defect density. An inflection in the capacitance–voltage curves (in reverse bias) is observed with simultaneous increase in bulk deep acceptor density and shallow donor density near the back contact.

Crystal orientation dependence of deep level spectra in proton irradiated bulk β-Ga2O3

The effects of 20 MeV proton irradiation with fluences of 5 × 1014 and 1015 p/cm2 on electrical properties of lightly Sn doped n-type (net donor concentration 3 × 1017 cm−3) bulk β-Ga2O3 samples with (010) and (−201) orientation were studied. Proton irradiation decreases the net donor density with a removal rate close to 200 cm−1 for both orientations and similar to the electron removal rates in lightly Si doped β-Ga2O3 epilayers. The main deep electron traps introduced in the β-Ga2O3 crystals of both orientations are near Ec−0.45 eV, while in Si doped films, the dominant centers were the so-called E2* (Ec−0.75 eV) and E3 (Ec−0.1 eV) traps. Deep acceptor spectra in our bulk –Ga2O3(Sn) crystals were dominated by the well-known centers with an optical ionization energy of near 2.3 eV, often attributed to split Ga vacancies. These deep acceptors are present in a higher concentration and are introduced by protons at a higher rate for the (010) orientation. Another important difference between the two orientations is the introduction in the surface region (∼0.1 μm from the surface) of the (010) of a very high density of deep acceptors with a level near Ec−0.27 eV, not observed in high densities in the (−201) orientation or in Si doped epitaxial layers. The presence of these traps gives rise to a very pronounced hysteresis in the low temperature forward current–voltage characteristics of the (010) samples. These results are yet another indication of a significant impact of the orientation of the β-Ga2O3 crystals on their properties, in this case, after proton irradiation.

Analysis of Dependence of Breakdown Voltage on Gate–Drain Distance in AlGaN/GaN HEMTs With High-k Passivation Layer

A 2-D analysis of OFF-state breakdown characteristics of AlGaN/GaN HEMTs with a high- k passivation layer is performed as a function of gate-to-drain distance L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> . The relative permittivity of the passivation layer ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> is changed from 1 to 60, and L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> is changed from 1.5 to 10 μ\textm. It is shown that, in all cases with different L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> , the breakdown voltage V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> increases as ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> increases. When a deep-acceptor density in an Fe-doped buffer layer N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DA</sub> is 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">17 </sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> and the gate length is 0.3 μm, V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> is determined by buffer leakage current at ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> ≥ 30 before impact ionization dominates. Hence, V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> is similar at L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> = 3-10 μm, and the increase rate in V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> from L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> = 1.5 μm is about 50% even at ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> = 60. However, when N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DA</sub> is 2×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">17</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> , V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> is determined by impact ionization of carriers even at ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> ≥ 30 because the buffer leakage current is reduced. V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> becomes about 500, 930, 1360, and 1650 V for L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> = 1.5, 3, 5, and 7 μm, respectively, at ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> = 60. These voltages correspond to gate-to-drain average electric fields of about 3.3, 3.1, 2.7, and 2.3 MV/cm, respectively. Particularly, for short L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> , the electric field profiles between the gate and the drain are rather uniform. However, in the case of L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> = 10 μm, V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> is about the same as that (1650 V) of L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> = 7 μm, suggesting that the electric field at the drain edge of the gate becomes a critical value before the high electric field region extends to the drain enough. This may be a limitation to increase V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> by using a high- k passivation layer in this case. However, it can be said that, to improve V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">br</sub> further at long L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GD</sub> , such as 10 μm, the combination of field plate or using a higher ε <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">r</sub> material may be effective because both of them decrease the electric field at the drain edge of the gate.

Photosensitivity of Ga2O3 Schottky diodes: Effects of deep acceptor traps present before and after neutron irradiation

The photocurrent produced by 259 nm wavelength excitation was measured in β-Ga2O3 Schottky diodes before and after neutron irradiation. These samples differed by the density of deep acceptors in the lower half of the bandgap as detected by capacitance–voltage profiling under monochromatic illumination. Irradiation led to a very strong increase in photocurrent, which closely correlated with the increase in deep trap density and the decrease after illumination of the effective Schottky barrier height due to hole capture by acceptors. A similar effect was observed on an as-grown βs-Ga2O3 film with a high density of deep acceptors. Electron beam induced current measurements indicated a strong amplification of photocurrent, which is attributed to the Schottky barrier lowering by holes trapped on acceptors near the surface. Photocurrent build-up and decay curves show several time constants ranging from several milliseconds to many seconds. These characteristic times are attributed to tunneling of electrons into the hole-filled acceptors near the surface and to thermal emission of holes from deep acceptors.

Enhancement of Breakdown Voltage in AlGaN/GaN HEMTs: Field Plate Plus High-&lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;${k}$ &lt;/tex-math&gt; &lt;/inline-formula&gt; Passivation Layer and High Acceptor Density in Buffer Layer

We make a 2-D analysis of breakdown characteristics of field-plate AlGaN/GaN HEMTs with a high- ${k}$ passivation layer, and the results are compared with those having a normal SiN passivation layer. As a result, it is found that the breakdown voltage is enhanced particularly in the cases with relatively short field plates because the reduction in the electric field at the drain edge of gate effectively improves the breakdown voltage in the case with the high- ${k}$ passivation layer. In the case with the moderate-length field plate, the enhancement of breakdown voltage due to the high- ${k}$ passivation layer occurs because the electric field profiles between the field-plate edge and the drain become more uniform. It is also studied how the breakdown voltage depends on a deep-acceptor density in the Fe-doped semi-insulating buffer layer when a high- ${k}$ passivation layer is used. It is shown that the breakdown voltage increases with increasing the relative permittivity of the passivation layer $\varepsilon _{\text{r}}$ and with increasing the deep-acceptor density NDA. When $\varepsilon _{\text{r}} = 60$ and $N_{\mathrm {DA}} = 2$ – $3 \times 10^{17}$ cm−3 at the gate length of $0.3~\mu \text{m}$ , the breakdown voltage becomes about 500 V at a gate-to-drain distance of $1.5~\mu \text{m}$ , which corresponds to an average electric field of about 3.3 MV/cm between the gate and the drain.

Analysis of Reduction in Lag Phenomena and Current Collapse in Field-Plate AlGaN/GaN HEMTs With High Acceptor Density in a Buffer Layer

We make a 2-D transient analysis of field-plate AlGaN/GaN HEMTs with a semi-insulating buffer layer, where only a deep acceptor above the midgap is considered. The deep-acceptor density is varied between 1017 cm−3and $8 {\times 10}^{{17}}$ cm−3. It is studied how the deep-acceptor density and the field plate affect the buffer-related drain lag and gate lag, and current collapse. It is shown that the lags and current collapse are reduced by introducing a field plate. This reduction occurs because electron trapping by the deep acceptors is weakened by the field plate. It is also shown that without a field plate, the drain lag and current collapse increase with increasing the deep-acceptor density as expected, although the gate lag decreases when the deep-acceptor density becomes high in the region between $2{\times 10}^{{17}}$ cm−3and $8 {\times 10}^{{17}}$ cm−3. On the other hand, with a field plate, surprisingly, the lags and current collapse decrease when the deep-acceptor density becomes high. This is attributed to the fact that the reduction in drain lag and current collapse by introducing a field plate becomes more significant when the deep-acceptor density becomes higher.

Computational analysis of breakdown voltage enhancement for AlGaN/GaN HEMTs through optimal pairing of deep level impurity density and contact design

Simulations are used to explore the possibility of achieving breakdown voltage scaling using deep acceptors in the buffer for AlGaN/GaN HEMTs. The existence of an optimal range of deep level acceptor density (1017cm−3), for which the electric field shows the most uniform distribution over the entire Lgd is demonstrated. The peak electric field can be capped off at a certain value, which can be engineered using deep level defects to be less than the critical electric field for GaN or the critical field for punch-through, whichever is lower. Following the saturation in peak electric field, the additional applied voltage spreads across the device access region. Thus, precise control of defect incorporation in the GaN buffer is shown to be a key factor in achieving high breakdown voltage HEMTs with improved unipolar figure of merit. A novel scheme for the source and drain contacts, using shallow mesa etch and partial mesa sidewall oxidation to increase the allowed range of variation in optimal acceptor density to achieve uniform electric field distribution is presented.

Numerical Analysis of Buffer-Trap Effects on Gate Lag in AlGaN/GaN High Electron Mobility Transistors

Two-dimensional analysis of turn-on characteristics in AlGaN/GaN high electron mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer. Effects of buffer traps on gate lag are studied. It is shown that relatively large gate lag arises due to buffer traps, and it is correlated to large source access resistance in AlGaN/GaN HEMTs. The dependences of buffer-related gate lag on the gate length and buffer-trap parameters such as a deep-acceptor density and a deep donor's energy level are also studied. It is shown that the gate lag becomes smaller for a longer gate length because electron injection into the buffer layer occurs at the drain edge of the gate and normalized trapping effects become smaller. It is also shown that the gate lag becomes more significant when the deep-acceptor density in the buffer layer becomes higher, because the trapping effects become larger. In addition, the gate-lag rate is shown to be not so dependent on the deep-donor's energy level. Effects of surface states on gate lag are also described briefly.

Numerical Analysis of Buffer-Trap Effects on Gate Lag in AlGaN/GaN High Electron Mobility Transistors

Two-dimensional analysis of turn-on characteristics in AlGaN/GaN high electron mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer. Effects of buffer traps on gate lag are studied. It is shown that relatively large gate lag arises due to buffer traps, and it is correlated to large source access resistance in AlGaN/GaN HEMTs. The dependences of buffer-related gate lag on the gate length and buffer-trap parameters such as a deep-acceptor density and a deep donor's energy level are also studied. It is shown that the gate lag becomes smaller for a longer gate length because electron injection into the buffer layer occurs at the drain edge of the gate and normalized trapping effects become smaller. It is also shown that the gate lag becomes more significant when the deep-acceptor density in the buffer layer becomes higher, because the trapping effects become larger. In addition, the gate-lag rate is shown to be not so dependent on the deep-donor's energy level. Effects of surface states on gate lag are also described briefly.

Reduction in Majority-Carrier Concentration in Lightly-Doped 4H-SiC Epilayers by Electron Irradiation

The mechanisms for the reduction in the hole concentration in lightly Al-doped p-type 4H-SiC epilayers by electron irradiation as well as in the electron concentration in lightly N-doped n-type 4H-SiC epilayers by electron irradiation are investigated. In the p-type 4H-SiC epilayers, the temperature dependence of the hole concentration, , is not changed by 100 keV electron irradiation, while the is decreased by 150 keV electron irradiation. The density of Al acceptors with energy level eV decreases with increasing fluence of 150 keV electrons, whereas the density of deep acceptors with energy level eV increases. In the n-type 4H-SiC epilayers, the temperature dependence of the electron concentration, , is decreased by 200 keV electron irradiation. The density of N donors located at hexagonal C-sublattice sites decreases significantly with increasing fluence of 200 keV electrons, whereas the density of N donors located at cubic C-sublattice site decreases slightly.

Physical Mechanism of Buffer-Related Current Transients and Current Slump in AlGaN/GaN High Electron Mobility Transistors

Two-dimensional transient analyses of AlGaN/GaN high electron mobility transistors (HEMTs) are performed in which a deep donor and a deep acceptor are considered in a buffer layer. Quasi-pulsed current–voltage (I–V) curves are derived from the transient characteristics. When the drain voltage is raised abruptly, electrons are injected into the buffer layer and captured by deep donors, and when it is lowered abruptly, the drain currents remain at low values for some periods and begin to increase slowly as the deep donors begin to emit electrons, showing drain-lag behavior. The gate lag could also occur due to deep levels in the buffer layer, and it is correlated with relatively high source access resistance in AlGaN/GaN HEMTs. It is shown that the current slump is more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because the trapping effects become more significant. The drain lag could be a major cause of current slump in the case of higher off-state drain voltage. It is suggested that to minimize current slump in AlGaN/GaN HEMTs, an acceptor density in the buffer layer should be made low, although there may be a trade-off relationship between reducing current slump and obtaining sharp current cutoff.

Buffer-trapping effects on current slump in AlGaN/GaN HEMTs

Two-dimensional transient analyses of GaN MESFETs and AlGaN/GaN HEMTs are performed in which a deep donor and a deep acceptor are considered in a semi-insulating buffer layer. Calculated transient characteristics are compared between the two FETs, and it is shown that the deep levels affect the results essentially in a similar way. Quasi-pulsed I–V curves are derived from the transient characteristics, and are compared with steady-state I–V curves. It is shown that so-called current slump is more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because trapping effects become more significant. It is suggested that to minimize current slump in GaN-based FETs, an acceptor density in a semi-insulating GaN layer should be made low.

Analysis of buffer‐related lag phenomena and current collapse in GaN FETs

Drain-current responses of GaN MESFETs with a semi-insulating buffer layer are calculated when the drain voltage and/or the gate voltage are changed abruptly, and pulsed I-V curves are derived from them. It is shown that so-called current collapse or current slump is not so dependent on the gate length LG (0.3 μm – 1 μm), and this is essentially determined by a deep-acceptor density NDA in the buffer layer. LG and NDA dependence of gate lag is also studied, indicating that the gate lag is weaker for longer LG and the lag rate becomes high with NDA, although it may show a saturation behaviour. (© 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

Physics-based simulation of buffer-trapping effects on slow current transients and current collapse in GaN field effect transistors

Two-dimensional transient analyses of GaN metal-semiconductor field effect transistors (MESFETs) are performed in which a three level compensation model is adopted for a semi-insulating buffer layer, where a shallow donor, a deep donor, and a deep acceptor are included. Quasipulsed current-voltage (I-V) curves are derived from the transient characteristics and are compared with steady-state I-V curves. It is shown that when the drain voltage VD is raised abruptly, the drain current ID overshoots the steady-state value, and when VD is lowered abruptly, ID remains at a low value for some periods, showing drain-lag behavior. These are explained by the deep donor’s electron capturing and electron emission processes quantitatively. The drain lag could be a major cause of current collapse, although some gate lag is also seen due to the buffer layer. The current collapse is shown to be more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because the change of ionized deep-donor density becomes larger and hence the trapping effects become more significant. It is suggested that to minimize the current collapse in GaN-based FETs, an acceptor density in a semi-insulating layer should be made low, although the current cutoff behavior may be degraded.

Mechanisms of reduction in hole concentration in Al-doped 4H-SiC by electron irradiation

From the temperature dependence of the hole concentration in unirradiated lightly Al-doped 4H-SiC epilayers, an Al acceptor with E V + 0.2 eV, which is an Al atom (Al Si) at a Si sublattice site, and an unknown deep acceptor with E V + 0.35 eV are found, where E V is the top of the valence band. Both the densities are similar. With irradiation of 0.2 MeV electrons the Al acceptor density is reduced, while the unknown deep acceptor density is increased. Judging from the minimum electron energy required to displace a substitutional C atom (C s) or the Al Si, the bond between the Al Si and its nearest neighbor C s is broken due to the displacement of the C s by this irradiation. Moreover, the displacement of the C s results in the creation of a complex (Al Si–V C) of Al Si and a carbon vacancy (V C), indicating that the possible origin of the deep acceptor with E V + 0.35 eV is Al Si–V C.

Investigation of the parameters of deep centers in n-6HSiC epitaxial layers obtained by gas-phase epitaxy

Epitaxial layers of 6H-SiC obtained by gas-phase epitaxy have been investigated by capacitance spectroscopy methods. It is shown that deep centers are present in the test samples. Such centers were previously observed in SiC epitaxial layers obtained by sublimation epitaxy. However, the total density of deep acceptors in structures prepared by gas-phase epitaxy is two to three orders of magnitude lower than in epitaxial films obtained by sublimation epitaxy with the same value of Nd-Na. It is suggested that the conditions of growth of the epitaxial layers influence the density and the type of defects formed in them.

Realization of a heavily doped and fully compensated semiconductor state in a crystalline semiconductor with a deep impurity band

We use the data on the pressure (up to P=1.5 GPa) and field (up to H=17 kOe) dependence of the Hall coefficient and the resistivity at 77.6 and 300 K in p-CdSnAs2〈Cu〉 to calculate the effective kinetic characteristics of the charge carriers, the density and mobility of the conduction electrons and the holes of the deep acceptor and valence bands, in an interval of excess-acceptor densities Next ranging from 1010–1017 cm−3. We establish that in a heavily doped semiconductor with a deep impurity band at the tail of the density of states of the intrinsic band, with unequal donor and acceptor densities, a a heavily doped and fully compensated semiconductor state is realized under hydrostatic compression. The threshold value of the pressure that initiates the transition into such a state, Pc, depends on the extent to which the impurity band is populated. In p-CdSnAs2〈Cu〉 at Next=NA, where NA is the density of deep acceptors, and T⩽77.6 K the value of Pc amounts to 10−4 GPa. As the population of the deep acceptor band grows, Pc increases and in the limit becomes infinite. We discuss the special features of the electrophysical properties of p-CdSnAs2〈Cu〉 arising from the absence of an energy gap between the states of the conduction band and those of the deep acceptor band.

Effects of impact ionization on I-V characteristics of GaAs n-i-n structures including hole trap

Numerical simulations of GaAs n-i-n structures with Cr deep acceptors (hole trap) in the i-layer are performed by considering the impact ionization of carriers. At low voltages, I-V curves show sublinear or saturated features, because the voltage is entirely applied along the reverse-biased n-i junction. When the deep-acceptor density is low, a steep rise of current occurs due to trap filling, whereas when the deep-acceptor density becomes high, the steep current rise occurs due to impact ionization of carriers at the reverse-biased n-i junction. In this case, the voltage for current rise becomes lower as the acceptor density becomes higher.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

SHALLOW TRAPS AND THE APPARENT SUBLINEAR PHOTOCONDUCTIVITY OF PHOTOREFRACTIVE BARIUM TITANATE

We show that shallow acceptors reduce the lifetime of free holes and make the photoconducti-vity of barium titanate increase sublinearly with intensity both in the cw and pulsed illumination regimes. We also show that as-grown barium titanate crystals have quite different photorefractive properties depending on their relative density of deep donors and shallow acceptors, and we determine the depth of the shallow acceptors to be ~0.4 eV above the top of the valence bond.

Two-dimensional simulation of GaAs MESFETs with deep acceptors in the semi-insulating substrate

Numerical simulations of GaAs MESFETs with deep chromium acceptors in the semi-insulating substrate were made. The results were compared with those obtained for a case with deep donors such as EL2 centers and shallow acceptors. It was found that an acceptor density in the substrate is a predominant factor in determining current-voltage characteristics of GaAs MESFETs, whether the acceptor is deep or shallow. Potential profiles were, however, found to depend strongly on the nature of deep levels in the substrate, suggesting that different drain breakdown characteristics or different backgating effects may be observed between the two cases. To minimize short-channel effects in GaAs MESFETs, the substrate conduction must be reduced. For this purpose, the deep-acceptor density in the semi-insulating substrate should be made high.