The DC sputtering power (DCSP) effect on the chemical composition, structural and electrical properties of Ag/AlN/Si Schottky diode was studied. The AlN films grown on Si substrate were examined by X-ray diffraction (XRD), Fourier Transformed Infra-Red (FTIR), and Raman spectroscopy. The analyzes by XRD, FTIR and Raman show stability at the level of the structure and the qualitative chemical composition of the AlN layer for DCSP of 200 W and 400 W. However, the quantity of chemical compounds on the surface of AlN is affected by this variation. From Current-Voltage (I-V) measurements, the ideality factor (n), barrier height (φb), and series resistance (Rs) were extracted by adopting Cheung functions. Diodes with an AlN interlayer elaborated at 400 W have good rectifying behavior with n, Rs and φb of 3.11, 1930 Ω, and 0.93 eV, respectively. The enhancement of the Ag/AlN/Si diode performance was attributed to the reduction of undesirable impurities in the Ag/AlN interface as well as the morphological improvement of the AlN layer. Capacitance-Voltage (C-V) measurements showed that carrier donor concentrations are strongly affected by DC sputtering power. The elaborate structures may provide new materials with electrical properties having a wide range of applications in electronics and photovoltaic field.