Corrosion Of Aluminum Metallization Research Articles

Study of The Inhibition Corrosion of Aluminum Metal Using Peppermint Oil in An Acidic Medium

This study included the study of the efficiency of peppermint oil inhibition of aluminum corrosion in acidic medium HCl at concentrations (0.5, 1, 1.5, 2 M) on the corrosion rate in the presence and absence of the inhibitor peppermint oil at different concentrations (1000, 2000, 3000, 4000 ppm).In order to study the effect of changing the temperature (303, 313, 323, 333 K) on the corrosion rate in the absence and presence of the inhibitor, different concentrations of the inhibitor were chosen in addition to the acid concentration (1M). The experiments were carried out using the weight loss method to calculate the erosion rate. The expected heat of adsorption enthalpy was (-29.913 KJ/mol), with a negative sign indicates that the process is exothermic. The value of the free energy of adsorption ranged from (11.086-15.067 KJ/mol. (The results showed that Freundlich adsorption isotherm equation is the best fit to examine the adsorption process, also a scanning electron microscope. Showed the surface of aluminum before and after corrosion according to the results of the study, it was found that the used inhibitor reduces corrosion in acidic media. Its anti-corrosion efficacy also improves with increasing inhibitor concentration and with decreasing temperature.

Elektrohemijska istraživanja o korozijskom ponašanju aluminijuma u alkalnoj sredini

Corrosion of Aluminum metal at pH 10 has been controlled by dicarboxylic acids such as oxalic acid (OA) and adipic acid (AA).The Inhibition efficiency (IE) has been determined by the classical weight loss method. The maximum inhibition efficiency (IE) offered by the oxalic acid (OA) and adipic acid (AA) 250 ppm and Zn2+ 50 ppm system are 88 and 96%. To determine the values of Linear Polarization Resistance (LPR) and corrosion Current (Icorr), potentiodynamic polarization study has been used.

Tetrahydro-dibenzo[a,d] Annulene-5, 11-Dihydrazone and Magnesium Oxide Used to Control the Corrosion of Aluminium in Chloride Ions Environment

Chloride ions interact with aluminium in marine atmosphere to form corrosion cell. Due to this corrosion reaction occurs on their surface, aluminium is oxidized into Al3+. The corrosion reaction accelerates deterioration in metal and it produces galvanic, pitting, stress, crevice, intergranular corrosion. Chloride ions decrease internal and external strength of aluminium metal. It is a very important metal so used in different appliances for e.g. road, water, air transports, housing, railways and other fields. Nanocoating and electrospray techniques used to check the corrosion of aluminium metal. For nanocoating and electrospray materials applied tetrahydro-dibenzo[a,d] [7] annulene-5, 11-dihydrazone and MgO. Both materials formed composite barrier and developed a passive surface for Cl- ions. This barrier reduced the corrosion rate of aluminium. Nozzle spray and chemical vapour deposition technique used for coating process. The corrosion rate of metal was determined by gravimetric method. Corrosion potential and current density were calculated by potentiostat. The composite barrier formation was confirmed by activation energy, heat of adsorption, free energy, enthalpy and entropy. These thermal parameters were obtained by Arrhenius equation, Langmuir isotherm and Transition state equation. The adsorption of tetrahydro-dibenzo[a,d] [7] annulene-5,11-dihydrazone and MgO electrospray on aluminium surface was depicted by Langmuir, Frundlich and Temkin isotherm. The results of surface coverage area and coating efficiency were noticed that both materials were mitigated the corrosion rate of aluminium in chloride ions environment

Corrosion of aluminium metal in OPC- and CAC-based cement matrices

Corrosion of aluminium metal in ordinary Portland cement (OPC) based pastes produces hydrogen gas and expansive reaction products causing problems for the encapsulation of aluminium containing nuclear wastes. Although corrosion of aluminium in cements has been long known, the extent of aluminium corrosion in the cement matrices and effects of such reaction on the cement phases are not well established. The present study investigates the corrosion reaction of aluminium in OPC, OPC-blast furnace slag (BFS) and calcium aluminate cement (CAC) based systems. The total amount of aluminium able to corrode in an OPC and 4:1 BFS:OPC system was determined, and the correlation between the amount of calcium hydroxide in the system and the reaction of aluminium obtained. It was also shown that a CAC-based system could offer a potential matrix to incorporate aluminium metal with a further reduction of pH by introduction of phosphate, producing a calcium phosphate cement.

Theory of aluminum metallization corrosion in microelectronics

We present a time-dependent numerical model for corrosion in microelectronics, focusing on aluminum bondpads, which can be very beneficial for the design as well as the interpretation of reliability data of microelectronics. The model includes charge transport through the polymer microelectronics encapsulant as well as the formation of layers of space charge at all polymer interfaces, which strongly influences the electrochemical charge transfer rate at the polymer–metal interfaces via the generalized Frumkin–Butler–Volmer equation. The system we consider consists of two parallel gold bondwires that are each electrically connected to two aluminum bondpads, which are assumed to contain weak spots in the protective native oxide layer, i.e. pits. This system is encapsulated in an epoxy molding compound, which is the usual low-conductive, and slightly hydrophilic, microelectronic encapsulant. We assume that a cathodic reaction takes place at the gold wires, and an anodic reaction at the weak spots of the aluminum bondpads. Furthermore, we assume the presence of a large excess of inert supporting salt compared to the reactive hydroxyl ions. Numerical calculations were made in a two-dimensional geometry as function of the applied voltage difference between the two wires, the concentration of absorbed moisture in the encapsulation, and the ambient temperature. We show that the model results predict trends similar to the empirical industrial standards for failure of microelectronic products due to corrosion.

Potentiostatic testing of thin film aluminum corrosion propagation under plasma-enhanced chemically vapor deposited silicon nitride protective films

A potentiostatic method has been developed for use in studying the corrosion of aluminum metallization under inorganic thin protective films. Metallized silicon substrate test articles were coated with 200–10 000 Å of plasma-enhanced chemically vapor deposited silicon nitride and then immersed in a solution of 0.02 M NaCl and 0.1 M Na 2SO 4 at a constant electrical potential. The resulting anodic corrosion current was measured as a function of time. Artificial defects were made in the protective films by mechanical scratching in order to observe the propagation of corrosion from these sites. The extent of corrosion calculated from the current passed agreed well with the observed amount of missing metal. The results suggest that changes in the protective film's mechanical properties as a function of thickness are a major factor in the corrosion rate of the underlying metal film.

A model for moisture induced corrosion failures in microelectronic packages

As integrated circuit geometries become smaller and package sizes and I/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion. To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure-rate model is presented. The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Alkaline corrosion of aluminium in water-organic solvent mixtures

The corrosion of aluminium metal was studied in 0.5 M and 0.1 M NaOH in water-methanol, water-ethanol and water-(ethylene glycol) solutions with various compositions (from 0.0 to 60 vol.% of the organic solvent component). The rate of dissolution of aluminium was measured chemically by collecting the hydrogen gas evolved and electrochemically by recording the polarization curves. The results obtained show that the corrosion of aluminium is inhibited by the organic components in the medium. It is suggested that the organic solvents inhibited the corrosion of aluminium by increasing the viscosity of the medium, which leads to a decrease in the coefficient for diffusion of the corrosion products of aluminium, and by decreasing the dielectric constant of the medium, which lowers the basicity of the solution.

CF 4/O 2 plasma accelerated aluminum metallization corrosion in plastic encapsulated ICs in the presence of contaminated die attach epoxies : R. Jay Ritchie and D. Marshall Andrews. IEEE/Proc. IRPS 88 (1981)

CF 4/O 2 plasma accelerated aluminum metallization corrosion in plastic encapsulated ICs in the presence of contaminated die attach epoxies : R. Jay Ritchie and D. Marshall Andrews. IEEE/Proc. IRPS 88 (1981)

The effect of impurities on the corrosion of aluminum metallization : W. M. Paulson and R. P. Lorigan. Proc. IEEE Reliab. Phys. 42 (1976)

The effect of impurities on the corrosion of aluminum metallization : W. M. Paulson and R. P. Lorigan. Proc. IEEE Reliab. Phys. 42 (1976)