PurposeAlthough many studies have been conducted on the nanofluid flow in microtubes, this paper, for the first time, aims to investigate the effects of nanoparticle diameter and concentration on the velocity and temperature fields of turbulent non-Newtonian Carboxymethylcellulose (CMC)/copper oxide (CuO) nanofluid in a three-dimensional microtube. Modeling has been done using low- and high-Reynolds turbulent models. CMC/CuO was modeled using power law non-Newtonian model. The authors obtained interesting results, which can be helpful for engineers and researchers that work on cooling of electronic devices such as LED, VLSI circuits and MEMS, as well as similar devices.Design/methodology/approachPresent numerical simulation was performed with finite volume method. For obtaining higher accuracy in the numerical solving procedure, second-order upwind discretization and SIMPLEC algorithm were used. For all Reynolds numbers and volume fractions, a maximum residual of 10−6 is considered for saving computer memory usage and the time for the numerical solving procedure.FindingsIn constant Reynolds number and by decreasing the diameter of nanoparticles, the convection heat transfer coefficient increases. In Reynolds numbers of 2,500, 4,500 and 6,000, using nanoparticles with the diameter of 25 nm compared with 50 nm causes 0.34 per cent enhancement of convection heat transfer coefficient and Nusselt number. Also, in Reynolds number of 2,500, by increasing the concentration of nanoparticles with the diameter of 25 nm from 0.5 to 1 per cent, the average Nusselt number increases by almost 0.1 per cent. Similarly, In Reynolds numbers of 4,500 and 6,000, the average Nusselt number increases by 1.8 per cent.Research limitations/implicationsThe numerical simulation was carried out for three nanoparticle diameters of 25, 50 and 100 nm with three Reynolds numbers of 2,500, 4,500 and 6,000. Constant heat flux is on the channel, and the inlet fluid becomes heated and exists from it.Practical implicationsThe authors obtained interesting results, which can be helpful for engineers and researchers that work on cooling of electronic devices such as LED, VLSI circuits and MEMS, as well as similar devices.Originality/valueThis manuscript is an original work, has not been published and is not under consideration for publication elsewhere. About the competing interests, the authors declare that they have no competing interests.
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