Consumer Electronic Products Research Articles

Supply and demand of lithium in China based on dynamic material flow analysis

Lithium demand in China has grown rapidly with the popularization of computer, communication and consumer electronic (3C) products, electric vehicles (EVs), and other products. As an important part of the global processing of lithium products, China still relies on importing a vast majority of raw lithium materials, which significantly affects the supply fulfillment of China's lithium market. Therefore, this study used MFA to analyze the supply and demand characteristics of China's lithium trading market from the trade material flow between 2000 and 2021 and industrial material flow between 2017 and 2021 by quantizing trade and industry data. The results showed that the import of lithium in China is mainly concentrated on lithium carbonate, which is the raw material for power batteries, and the import of lithium accounts for 72.5 % of the consumption in China, about 75.2 % of carbonate lithium is used for batteries. Given the expanding EV market, the demand for lithium in China increases rapidly. In addition to a stable supply of lithium imports, secondary lithium recovered from EoL batteries is expected to become an important lithium supply source.

Advanced Manufacturing Transformation: A Strategic Framework for the Smart Factory

This paper presents a comprehensive strategy for implementing advanced manufacturing operations within a Smart Factory framework for a large consumer electronics manufacturer. By leveraging digital twin technology, additive manufacturing, robotics, automation, and advanced materials, this strategy aims to enhance operational efficiency, implement advanced analytics, integrate smart technologies, and sustain competitive advantage. The approach includes ecosystem partner identification, technology integration, process optimization, data management, continuous improvement, governance, and compliance.

Summary of MEMS Capacitive Accelerometer

Micro-Electro-Mechanical System (MEMS) accelerometer (MEMS accelerometer), as an important MEMS device, has been widely used in the field of high-precision electronic technology and consumer electronic products. At present, the technology of MEMS accelerometer has been mature, and the sensor based on capacitance principle, piezoelectric effect, piezoresistive effect and other principles has been widely used in many aspects of national life and production and sustainable development. Combined with and according to all kinds of references, this paper briefly describes the shape composition and sensing principle of the MEMS capacitive accelerometer, enumerates the design and error optimization research of each research group for the sensor, and explains it with the relevant research data.

FPGA-enhanced IoT methods for disease pre-screening and prediction: An energy optimization approach

The research paper has introduced a system based on the Internet of Things (IoT) that has the potential to contribute to the creation of a Consumer Electronics (CE) product. In the event that any health-related measure deviates from the normal range, this system, which is based on IoT technology, will send a notification to the user. The data collected by this system is sent to an analysis system based on a Field Programmable Gate Array (FPGA) through a mobile application, and then transferred to the cloud for storage. To display this raw data, a wearable IoT device can be utilized, and the system will process the data accordingly. The major innovation of this proposed project lies in the development of a fuzzy classifier that can accurately predict the pathological condition of an illness. By implementing a fuzzy classifier using FPGA, the execution time is greatly reduced i.e. 57.7μs compared to other algorithms. Ans also the accuracy of the proposed model is 98.8 %, which higher then other machine learning model such as 97 %, 96.5 %, 93.2 % respectively for SVM, KNN and DT models.previous models like KNN, DT, SVM, and NB (Naive Bayes).

The synergy mechanism of CsSnI3 and LiTFSI enhancing the electrochemical performance of PEO‐based solid‐state batteries

AbstractLithium metal solid‐state battery is the first choice of batteries for electromobiles and consumer electronic products because of the specific capacity of 3860 mAh g−1 and high electrochemical potential (−3.04 V) of Li metal. Flexible polymer solid electrolytes have become the optimal solution to produce high energy density lithium batteries with arbitrary size and shape. In this work, we introduce a halide perovskite, CsSnI3, into the polyethylene oxide/lithium bis‐(trifluoromethanesuphone)imide (PEO–LiTFSI) polymer matrix. The CsSnI3 could form a LixSn alloy with Li, leading to homogenization of the electric field and Li+‐flux at the interface, Sn atom also bonds with the TFSI− anion to provide more dissociated Li+. Besides that, the I atom could interact with Li to form an electronic insulation with a strong blocking effect on electron tunneling. As a proof of concept, the synergy mechanism of the PEO–LiTFSI–CsSnI3 electrolyte improves the stable cycle life of the symmetric battery to more than 500 h, and the Li+ conductivity raised to 6.1 × 10−4 S cm−1 at 60°C. The application of the “zwitter ions analog” halide perovskite in PEO–LiTFSI provides a new choice among various methods to improve the electrochemical performance of polymer solid‐state batteries.

Sustainable Electronics: A Blockchain-Empowered Digital Twin-Based Governance System for Consumer Electronic Products

Sustainable Electronics: A Blockchain-Empowered Digital Twin-Based Governance System for Consumer Electronic Products

Hybrid Distribution Model and Market Penetration of Consumer Electronics in Nigeria

In a geographically large and diverse market like Nigeria, gaining full-scale market penetration for consumer goods can be a herculean task due to inadequate transportation infrastructure, and lack of robust channel structure. This study sought to mitigate this challenge by investigating the causality between hybrid distribution model and market penetration. It specifically aimed to determine the influences of direct and indirect distribution on market penetration of consumer electronics in Nigeria. The study adopted cross-sectional research design. Primary data were obtained from 384 major distributors of consumer electronics in Port Harcourt, Calabar and Ikeja through a structured questionnaire. Snowball and quota sampling techniques were applied to recruit respondents for the survey. The data obtained were analyzed using descriptive statistics and the hypotheses of the study were tested using multiple linear regression. The findings of the study revealed that even though both direct and indirect distribution strategies had significant positive influences on market penetration of consumer electronics in Nigeria, the indirect distribution approach had a higher contribution to market penetration. Hence, the study concluded that hybrid distribution model strategically enhances the ability of manufacturers of consumer electronics to achieve extended market penetration in Nigeria. Therefore, we recommended that: manufacturers of consumer electronics should establish direct distribution outlets in Nigeria such as company warehouses, manufacturer-owned retail stores, corporate online stores, and direct sales representatives in order to effectively sell products to customers while eliminating the prospects of third-party adulterations, counterfeiting and other unwholesome practices of middlemen; and there is need for manufacturers of consumer electronics to collaborate and strategically partner with capable intermediaries like wholesale distributors, retail chain stores, independent retailers, online marketplaces, authorized dealers and market traders to achieve extended market coverage and ensure their products are extensively available in the Nigerian market.

Development of Wafer Level Package Platform for High Reliability Crossover MCUs

Fan in and fan out wafer level packages are primarily used in the industry for applications in handheld consumer electronic products. The key benefits of wafer level package (WLP) are small form factor, reduced cost, improved electrical and thermal performance. WLP investigated in this study are directly surface mounted on PCB and have no intermediate substrate. Direct mount of package on PCB, leads to significant CTE mismatch between the package and board which stresses the package solder joint, leading to cyclic fatigue induced solder joint cracking. To overcome the solder joint cracking, stiffer solder alloys have been evaluated. However, higher stiffness of the solder alloy shifts the cyclic stress induced failure, from the solder joint to the package metal interconnect layers. Moreover, WLP on advanced silicon node have fragile low-k and extremely low-k back end of line dielectric layers that also crack or delaminate in cyclic fatigue. In this work extensive WLP platform development has been done with following DOE variables; multi-layer package routing, dielectric materials, solder alloys, solder ball pitch and diameter. Developed packages passed and outperformed the following product reliability qualification conditions: high temperature storage life (150°C, 2000 hours), highly accelerated stress test (110°C / 85%RH / Bias, 528 hours), application level temperature cycling ((-40 °C to 125 °C, 600 cycles), board level temperature cycling (-40 °C to 125 °C, 500 cycles) and board level drop test (1500g/0.5ms, 30 drops). Excellent reliability, functional performance, and successful chip package integration was achieved for WLP for crossover MCU products.

Secure and efficient communication approaches for Industry 5.0 in edge computing

With the rapid development of the new generation of information technology and the deep integration with industry, Industry 5.0 systematically puts forward the consumer-centric industrial production core, and emphasizes the sustainable and resilient technologies. Industry 5.0 considers the development of industry not only from the technical aspect, but also from the economic, social and environmental aspects, and studies how to use technological innovation to support the production of consumer electronics. In order to achieve interconnection, collaboration and sustainable communication, the integration of Industry 5.0 and edge computing not only reduces the computing bottleneck and communication bottleneck, but also reduces the delay, which helps to transform the industrial process model from centralized to distributed. However, a large number of privacy sensitive data in Industry 5.0 need to interact through the network, which also makes it possible for malicious network attackers to take advantage of it. Therefore, this paper proposes a secure and effective communication approach based on edge computing in Industry 5.0. This approach introduces three-factor authentication and elliptic curve cryptography to ensure the anonymity, confidentiality and integrity of the message. Based on the security proof, the proposed approach meets the security requirements. Through performance analysis, compared with other related schemes, this approach provides better security, and has obvious advantages in computation and communication efficiency.

Multi-View Comprehensive Graph Clustering

Multi-view clustering algorithms have been successfully used in different consumer electronic products, such as common digital cameras and unmanned vehicles. Currently, existing multi-view graph clustering (MVGC) methods learn the similarity of directly connected samples for clustering. However, these MVGC methods can not fully consider the indirect relation among samples and high-order relation across multi-view data. In this paper, a new multi-view comprehensive graph clustering (MCGC) method is devised, which can fully learn the similarity based on (1) first-order proximity (FOP) (i.e. the direct relation of pairwise samples); (2) second-order proximity (SOP) (i.e. the indirect relation of pairwise samples); and (3) third-order proximity (TOP) (i.e. the three-order relation of multiple views). Since the operations of these three components are iteratively carried out, the interaction between similarity learning can be encouraged and the comprehensive graph can be generated effectively for clustering. In-depth experiments on six commonly benchmark datasets show the superiority of the MCGC method.

CFedDT: Cross-Domain Federated Learning in Digital Twins for Metaverse Consumer Electronic Products

cFedDT: Cross-Domain Federated Learning in Digital Twins for Metaverse Consumer Electronic Products

A Brain-Inspired Spiking Network Framework Based on Multi-Time-Step Self-Attention for Lithium-Ion Batteries Capacity Prediction

Lithium-ion (Li-ion) batteries have gained widespread usage in numerous consumer electronic products and have significantly contributed to the growth of related industries. Due to the instability issues which might cause explosion or fire, it is critical to ensure the safety and reliability of Li-ion batteries via health monitoring. While artificial neural networks (ANNs) have proven successful in battery health monitoring, they suffer from drawbacks such as high energy consumption and poor generalization. Alternatively, a recent well-developed highly bionic model, i.e., brain-inspired spiking neural networks (SNN), has an excellent simulation of the spatiotemporal feature learning abilities and low power consumption characteristics of biological brains. In this study, we propose a multi-time-step self-attention spiking network framework (MSSA-SNN) for battery monitoring. In particular, the SNN architecture-based self-attention module enables a fully encoding of the global spiking features while optimizes the synaptic weights from a global perspective. This study conducts experiments on two coin Li-ion battery datasets. The results demonstrate that the brain-inspired MSSA-SNN can accurately detect battery degradation trends with an extremely low energy consumption rate, which makes it well-suited for energy-constrained consumer electronics.

Digital Media Steganography Based on Spatial Distortion Model Is Used to Encrypt Consumer Electronic Product Data

Digital Media Steganography Based on Spatial Distortion Model Is Used to Encrypt Consumer Electronic Product Data

Intelligent Recommendation Algorithm of Consumer Electronics Products With Graph Embedding and Multi-Head Self-Attention in IoE

Intelligent Recommendation Algorithm of Consumer Electronics Products With Graph Embedding and Multi-Head Self-Attention in IoE

The policy development and current situation of information technology education in Taiwan

With the development of science and technology, almost everyone uses 3C (Computer, Communication, and Consumer Electronics) products and can search for information online, play games, chat with others, etc. at any time. Coupled with the impact of the pandemic, school teachers and students cannot go to school and can only use online teaching and distance learning. This requires teachers to quickly learn the relevant knowledge of using information technology for teaching, such as the operation of equipment, online teaching, etc. Establishment of meeting rooms. To this day, the Ministry of Education actively promotes digital teaching in primary and secondary schools based on international trends and domestic policy developments. The paper introduced the policy and current state of the application of educational technology in Taiwan.

Vision-Language Interaction via Contrastive Learning for Surface Anomaly Detection in Consumer Electronics Manufacturing

Vision-Language Interaction via Contrastive Learning for Surface Anomaly Detection in Consumer Electronics Manufacturing

Information Entropy Evaluation Method for the Disassemblability of Smartphones

Smartphones are a vast category of consumer electronic products. Design For Disassembly (DFD) is a methodology that can effectively reduce the disassembly, recycling, and maintenance costs of smartphones. However, due to the diverse constraints posed by the connections among smartphone components, the variability of disassembling tools makes it challenging to objectively characterize the disassemblability of the smartphone. Therefore, information entropy is introduced to characterize the complex state of the system. Disassemblability can be expressed by calculating the operating time of the disassembling tool through information entropy. After multiplying by a constrained quantity factor, the Improved Disassembling Tool Entropy (IDTE) responds to changes in disassemblability as the structural level changes. According to the structure and recycling direction, the disassembling level of smartphones can be divided into module level, part level, and hybrid part-module level. Based on the Maynard Operational Sequencing Technique (MOST), the basic unit of operating time of the disassembling tool is calculated. For the hybrid selective Disassembly Sequence Planning (DSP) of the part and module levels, the Improved Double Genetic Algorithm (IDGA) model is established to compute the optimal disassembly sequence corresponding to each program level. This model calculates the IDTE corresponding to the optimal disassembly sequences at each disassembling level. The validity of IDTE was verified by a coupled comparison test between IDTE and theoretical disassembly time. Finally, an analysis of the disassemblability variations was conducted for two different models of smartphones based on their structure.

Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology

Ball Grid Array (BGA) packaging method has been widely used in microelectronic devices, and electromigration (EM) in BGA is a crucial reliability issue, determining the performance of the products. Herein, we report a new failure mode induced by a coupling effect of EM and Joule heating in BGA structure. The test sample consists of a roll of 500 μm-BGA solder joints with upper and lower Cu under-bump-metallization (UBM) of different thicknesses, 16 μm, and 68 μm, respectively. Open failures of the thinner cathodic Cu UBM at the contacting area with solder joint were observed under four different EM conditions (130 °C-3000 A/cm2, 160 °C-2300 A/cm2, 160 °C-3000 A/cm2, and 160 °C-4600 A/cm2). Infrared (IR) results reveal the temperature at the thinner Cu UBM is higher than that in the solder joint as well as at the thicker Cu UBM. Simulation results elucidate the current density at the contacting area is about 22 times higher than the average density in the solder joint, so the effect of current crowding can be very serious in the failure site. Furthermore, severe current crowding and Joule heating promote the nucleation rate of voids at the joint location, which can further increase the current density and temperature, leading to a positive feedback effect until an open failure occurs in the circuitry. Our analysis enables the discussion of a coupling failure mode of EM and Joule heating in BGA, and provides a valuable guide of device design against EM failure in consumer electronic products.

Facile Solid-State Synthesis to In Situ Generate a Composite Coating Layer Composed of Spinel-Structural Compounds and Li3PO4 for Stable Cycling of LiCoO2 at 4.6 V.

Due to its high energy density, high-voltage LiCoO2 is the preferred cathode material for consumer electronic products. However, its commercial viability is hindered by rapid capacity decay resulting from structural degradation and surface passivation during cycling at 4.6 V. The key to achieving stable cycling of LiCoO2 at high voltages lies in constructing a highly stable interface to mitigate surface side reactions. In this study, we present a facile in situ coating strategy that is amenable to mass production through a simple wet-mixing process, followed by high-temperature calcination. By capitalizing on the facile dispersion characteristics of nano-TiO2 in ethanol and the ethanol dissolubility of LiPO2F2, we construct a uniform precoating layer on LiCoO2 with nano-TiO2 and LiPO2F2. The subsequent thermal treatment triggers an in situ reaction between the coating reagents and LiCoO2, yielding a uniform composite coating layer. This composite layer comprises spinel-structured compounds (e.g., LiCoTiO4) and Li3PO4, which exhibit excellent chemical and structural stability under high-voltage conditions. The uniform and stable coating layer effectively prevents direct contact between LiCoO2 and the electrolyte, thereby reducing side reactions and suppressing the surface passivation of LiCoO2 particles. As a result, coated LiCoO2 maintains favorable electronic and ionic conductivity even after prolonged cycling. The synergistic effects of spinel-structured compounds and Li3PO4 contribute to the superior performance of LiCoO2, demonstrating a high capacity of 202.1 mA h g-1 (3.0-4.6 V, 0.5 C, 1 C = 274 mA g-1), with a capacity retention rate of 96.7% after 100 cycles.

Optimum Scheduling of a Multi-Machine Flexible Manufacturing System Considering Job and Tool Transfer Times without Tool Delay

In order to minimize makespan (Cmax) without causing tool delay with the fewest copies of each tool type, this study investigates the concurrent scheduling of automated guided vehicles (AGVs), machines (MCs), tool transporter (TT), and tools in a multi-machine flexible manufacturing system (FMS). The tools are housed in a central tool magazine (CTM), accessible to and utilized by several machines. AGVs and the tool transporter (TT) move jobs and tools between machines. Since it involves allocating tool copies and AGVs to job operations, sequencing job operations on machines, and related trip operations, such as AGVs’ and TT’s empty trip and loaded trip times, this simultaneous scheduling problem is highly complicated. This issue is resolved using the symbiotic organisms search algorithm (SOSA), based on the symbiotic interaction strategies that organisms adapt to survive in the ecosystem. This study proposes a mixed nonlinear integer programming formulation to address this problem. Verification is performed using an industrial problem from a manufacturing organization. The results show that employing two copies for two tool types out of 22 tool kinds and one copy for the remaining tool types results in no tool delay, which causes a reduction in the Cmax as well as cost. The industries that can benefit directly from this study are consumer electronics manufacturers, original equipment manufacturers, automobile manufacturers, and textile machine producers. The results demonstrate that the SOSA provides promising results compared to the flower pollination algorithm (FPA).