Connector Pins Research Articles

Left Bundle Branch Optimized Implantable Cardioverter Defibrillator (LOT-ICD) implantation in a Patient with Myotonic Dystrophy

Left bundle branch (LBB) optimized implantable cardioverter defibrillator (LOT-ICD) is a recently emerged alternative to the standard biventricular pacing - ICD (BiVp-ICD). The IS-1 connector pin of the ICD lead was closed with a protective cap and the LBB pacing (LBBP) lead was inserted into the ICD generator at the ventricular P/S hole. Herein, we presented a myotonic dystrophy patient who underwent LOT-ICD device implantation because of a high degree of atrioventricular block and heart failure with mid-range ejection fraction. A DDD-ICD (DF-1) was implanted in our patient which has been attached to the atrial lead (RA hole), the LBBP lead (ventricular IS-1 hole), and the ICD lead (ventricular DF-1 hole). The IS-1 pin of the ICD lead was closed accordingly. The LOT-ICD should be considered an option to standard BiVp-ICD associated with lower cost, lower procedure time, and no phrenic nerve capture.

Calibration of Connector Pins via Dynamic Deformation

The demand for increased reliability in automotive connector pin-end positions, which are press-fit to printed circuit boards, crucial for self-driving and driver assistance functionalities, has led to progressively tighter tolerance zones. Traditional manufacturing methods, such as cutting, bending and plastic injection, inherit limitations in achieving these tight tolerances. Connector suppliers have thus searched for innovative pin calibration methods, one of which involves correcting pins by means of permanent deformation. However, this approach exhibits challenges, including complicated processes and substantial investments due to vectorial deformation variations among different pin shapes and the necessity for spring-back control, leading to extended calibration times for individual connectors. In response to these challenges, manufacturers have explored methods utilizing the dynamic deformation properties of conductors exploiting the inertia of the components. As a viable method, it was found that vibrations with restricted amplitudes encompassing the theoretically determined pin shape could be the solution. In other words, walls around the pins vibrating up to the theoretically determined shape would force the pins to straighten.
 
 The current project initiated as a collaboration between Aksan Kalıp and Yildiz Technical University (YTU), focuses on developing a similar pin correction method. To achieve this, one of the existing connectors in production was selected, and extensive studies were conducted. Through collaborative efforts with the university, the natural frequencies and mode shapes of the pins were determined with the finite element method by keeping the plastic body of the connector constant, and the directions in which they could be subjected to bending over their structural weaknesses were determined. It was found that position correction was achieved with the effect of limited vibrations applied at natural frequencies and harmonics. It was determined, using the finite element method, that by applying limited vibrations at the natural frequency harmonics of the pins while keeping the connector's plastic body fixed, position correction could be achieved. Geometries optimizing the vectoral vibration motion applied to the pins were subsequently identified, and a cam mechanism was designed to facilitate controlled vibration. 
 
 The first phase of the project, including all activities and results, has been presented in detail with various figures and graphs. Following the promising outcomes of the dynamic deformation-based method, it was concluded that achieving the required high vibration frequencies, as identified in the study, through the commonly used cam mechanism might not be optimal. Consequently, the design and manufacturing of an ultrasonic vibration actuator, capable of producing required vibrations with high frequencies, are also planned for the second phase of the project.

Research on the examination technology of connector pin skewing according to Blob analysis *

Pin skew detection is an important means to ensure the reliable operation of connectors. To address the issues of low accuracy and limited applicability in existing research, this paper proposes a connector pin skew detection method based on Blob analysis. Firstly, the image is segmented by incorporating the dimensional features of the tested connector to retain the effective information region in the image, reducing the computational workload for subsequent image processing. The image is preprocessed using an improved median filtering algorithm to effectively mitigate the interference of noise on the detection process. Secondly, a locally adaptive approach is employed to dynamically adjust the threshold, and morphological processing is applied to the pin image to enhance the pin speckle features. Subsequently, Blob analysis is utilized to analyze the connector pin speckles, obtaining data on the pin skew. Different evaluation criteria for pin skew data of various connectors are established to achieve quantitative assessment. Finally, experiments are conducted for pin skew detection of single-hole rectangular, double-hole rectangular, and single-hole circular connectors. The experimental results demonstrate that the proposed connector pin skew detection method can effectively detect various types of pin skew in connectors, with a detection accuracy better than 0.05 mm and a repeatability better than 0.03 mm. This method is suitable for automatic detection scenarios of connector pin skew.

Efficient Recycling of Gold and Copper from Electronic Waste by Selective Precipitation.

The recycling of metals from electronic waste (e-waste) using efficient, selective, and sustainable processes is integral to circular economy and net-zero aspirations. Herein, we report a new method for the selective precipitation of metals such as gold and copper that offsets the use of organic solvents that are traditionally employed in solvent extraction processes. We show that gold can be selectively precipitated from a mixture of metals in hydrochloric acid solution using triphenylphosphine oxide (TPPO), as the complex [(TPPO)4 (H5 O2 )][AuCl4 ]. By tuning the acid concentration, controlled precipitation of gold, zinc and iron can be achieved. We also show that copper can be selectively precipitated using 2,3-pyrazinedicarboxylic acid (2,3-PDCA), as the complex [Cu(2,3-PDCA-H)2 ]n ⋅ 2n(H2 O). The combination of these two precipitation methods resulted in the recovery of 99.5 % of the Au and 98.5 % of the Cu present in the connector pins of an end-of-life computer processing unit. The selectivity of these precipitation processes, combined with their straightforward operation and the ability to recycle and reuse the precipitants, suggests potential industrial uses in the purification of gold and copper from e-waste.

Efficient Recycling of Gold and Copper from Electronic Waste by Selective Precipitation

AbstractThe recycling of metals from electronic waste (e‐waste) using efficient, selective, and sustainable processes is integral to circular economy and net‐zero aspirations. Herein, we report a new method for the selective precipitation of metals such as gold and copper that offsets the use of organic solvents that are traditionally employed in solvent extraction processes. We show that gold can be selectively precipitated from a mixture of metals in hydrochloric acid solution using triphenylphosphine oxide (TPPO), as the complex [(TPPO)4(H5O2)][AuCl4]. By tuning the acid concentration, controlled precipitation of gold, zinc and iron can be achieved. We also show that copper can be selectively precipitated using 2,3‐pyrazinedicarboxylic acid (2,3‐PDCA), as the complex [Cu(2,3‐PDCA‐H)2]n ⋅ 2n(H2O). The combination of these two precipitation methods resulted in the recovery of 99.5 % of the Au and 98.5 % of the Cu present in the connector pins of an end‐of‐life computer processing unit. The selectivity of these precipitation processes, combined with their straightforward operation and the ability to recycle and reuse the precipitants, suggests potential industrial uses in the purification of gold and copper from e‐waste.

System-Level ESD-Induced Voltage Fluctuation to the Power of Integrated Circuits on System Board

Based on the voltage and current waveforms, the mechanism of the system-level electrostatic-discharge (ESD) induced the voltage fluctuation to the power of integrated circuits (ICs) on system board is studied. When a contact discharge ESD test is performed at a connector pin, which is terminated with an I/O pin of an IC, not all the current from the system-level ESD may flow through the IC to the ground of the system board. So, the remaining currents can only flow through the power line of the ICs and the connection wire into the power supply to the ground. The power supply has the feedback and pulsewidth modulation circuits to regulate its output voltage. Therefore, the output current of the power supply will interact with the remnant current from the ICs on system board, resulting in the current flowing through the connection wire in the microelectronics system back and forth. Hence, the power of system board will be pulled up and down by the connection wire based on L·(dI/dt), since it acts as an inductor during the alternating current. With the voltage swinging up and down, the p-n junctions in the power domain seems to be driven into the avalanche breakdown or forwarded to generate a lot of electrons and holes inside the ICs, leading to the latch-up event at the low latch-up immunity region.

Thermal Performances of Hybrid Pin Fin with Connector Heat Sink Under Natural Convection

Heat transfer in engineering applications has shown progress, especially in electronic devices that raise the need for better heat sink designs. In addition, the generation of heat in devices and electronic circuits has also augmented, leading to the problem of heat dissipation. This study investigates the thermal and fluid flow characteristics of different geometrical configurations of pin fin heat sink under natural convection. The heat sink models studied are Hybrid Pin Fin with Connector Heat Sink (HPFWC HS) and Pin Fin with Connector Heat Sink (PFWC HS). All heat sinks models were simulated using CFD Ansys to analyse each heat sink’s thermal performances and flow fields. The results show that adding wings to the HPFWC HS significantly increased heat dissipation. In terms of heat transfer characteristics, the HPFWC HS has about a 5.78% increase in Nusselt number compared with HPFWC HS. The reason is that the heat sink HPFWC HS has wings around it, and these wings help to promote vortex formation around the fins, which leads to a higher heat transfer coefficient. A fin spacing of 15mm is the best spacing for the heat sink compared to other fin spacing.

Automatic Detection of Avionics Electrical Connector Pins

Avionics electronic connectors have a wide use and play a significant role in instrumentation and aerospace system. To substitute manual detection, we propose an automatic in-station connector pin detection system based on computer vision, machine vision, deep learning, and industrial robots. This system provides a high-reliable, high-accuracy, traceable, quantifiable, and real-time detection for connector pins.

Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering

Mini wave soldering is a common method for soldering through-hole components on printed circuit boards (PCB). With PCB design becoming increasingly complex and copper layer thickness rising, the vertical hole fill of through-hole solder joints becomes a serious problem during manufacturing. At the same time, the process window is limited by limited material heat resistance of the PCB and the through-hole components. Especially critical is latent damage inside the PCB and the through-hole component which must not exceed its specific maximum core temperature because this would compromise reliability over lifetime. The choice of soldering parameters is critical to reaching sufficient vertical fill to achieve a reliable connection according to IPC-A-610. The dedicated description of the interaction between PCB design and vertical fill has the potential to considerably improve the understanding of the basics of design for manufacturing (DfM). In this paper, the essential process parameters of the selective wave soldering process are examined by design of experiment (DoE) with respect to hole fill, which determines mechanical and thermal reliability as well as current carrying capacity. The results show the individual effects of the copper layer design parameters including layer count, layer thickness, hole copper plating attachment and solder alloy on vertical hole fill, in combination with the solder process parameters. The copper layer design parameters, solder bath temperature and preheating temperatures show the strongest effects. The soldering time has the lowest impact within the tested process parameters. For a given solder joint with its defined heat capacity, the benefit of solder time diminishes the longer the contact time is. Component surfaces and connector pin material and machine parameters like pump power as well as environmental conditions show little to no impact within a reasonable operation window.

Sn-Cu intermetallic compound laminated film with excellent friction coefficient, contact resistance, and solder wettability

ABSTRACT The connector used for electronic parts of automobiles is a type with Sn plating on the copper surface. In recent years, as the number of connector pins has increased and the insertion force has increased, problems have arisen in the insertion and removal operations. In addition, the reliability of the connection in high temperature environments needs to be improved. Various Sn plating alternative processes have been developed to meet these demands. Tha authors have previously reported on Sn-Cu plating processes that can provide more stable properties. 1 Using Sn-Cu plating and Sn plating, a Cu6Sn5 intermetallic compound layer with low roughness formed just below the surface. A pure Sn layer is formed on it. The authors have previously reported that the formation of a pure Sn layer with high connection reliability and a stable hard intermetallic compound layer can be expected to improve various properties. In this study, as a result of investigating the solder wettability of this plating film, which has excellent low friction coefficient and low contact resistance, it was clarified that good connector characteristics can be obtained.

Left bundle branch area pacing guided by continuous uninterrupted monitoring of unipolar pacing characteristics.

During left bundle branch area pacing (LBBAP) lead implantation, intermittent monitoring of unipolar pacing characteristics confirms LBB capture and can detect septal perforation. We aimed to demonstrate that continuous uninterrupted unipolar pacing from an inserted lead stylet (LS) is feasible and facilitates LBBAP implantation. Thirty patients (mean age 76 ± 14 years) were implanted with a stylet-driven pacing lead (Biotronik Solia S60). In 10 patients (comparison-group) conventional implantation with interrupted unipolar pacing was performed, with comparison of unipolar pacing characteristics between LS and connector-pin (CP)-pacing after each rotation step. In 20 patients (uninterrupted-group) performance and safety of uninterrupted implantation during continuous pacing from the LS were evaluated. In the comparison group, LS and CP-pacing impedances were highly correlated (R2 = 0.95, p < .0001, bias 12 ± 37 Ω) with comparable sensed electrograms and paced QRS morphologies. In the uninterrupted group, continuous LS-pacing allowed beat-to-beat monitoring of impedance and QRS morphology to guide implantation. This resulted in successful LBBAP in all patients, after a mean of 1 ± 0 attempts, with mean threshold 0.81 ± 0.4 V, median sensing 6.5 mV [IQR 4.4-9.5], and mean impedance 624 ± 101 Ω. Positive LBBAP-criteria were seen in all patients with median paced QRS duration of 120 ms [IQR 112-152 ms] and median pLVAT 73 ms [IQR 68-80.5 ms]. No septal perforation occurred. Unipolar pacing from the LS allows accurate determination of pacing impedance and generates similar paced QRS morphologies and sensed electrograms to CP pacing. Continuous LS pacing allows real-time monitoring of impedance and paced QRS morphology, which facilitates safe and successful LBBAP lead implantation.

SIMULATION OF THE CIRCUITS FOR ELECTRIC VEHICLES CHARGING SYSTEMS

This paper examines the charging system of electric vehicles and tries to explain the process involved in the operation of an electric vehicle supply equipment and the electric vehicle onboard charging module. The simulation carried out in this paper were done using the power electronics simulation software PSIM. It presents the electric schematic of the proximity pilot connection and the control pilot connection. It also presents the voltage waveforms for both connector pins.

Impact of Thermal Cycling on Cu Press-Fit Connector Pin Interconnect Mechanical Stability

Impact of Thermal Cycling on Cu Press-Fit Connector Pin Interconnect Mechanical Stability

Discharge current analysis with charged connector pins

Electrical connectors can get static charges during handling and discharge on a printed circuit board when assembled. The rise time and shape of the discharge current waveform is studied with simulation and measurement methods. Results show that the ESD current rise time can be less than 10 ps.

Selective acid leaching of connector pins removed from waste central processing units with focus on gold recovery

This paper evaluates the recovery of gold through selective acid leaching of connector pins removed from waste central processing units (WCPU) of computers. The exclusive treatment of this electronic component appears as a promising alternative since it minimizes gold losses. The experimental approach consisted by leaching steps of different types of pins aiming at dissolving all the metals that make up them, except the precious one. Analysis of the pins (2–6 mm length and ~ 1 mm diameter) by scanning electron microscopy coupled to energy dispersive spectrometry indicated (i) substrates made by copper, iron‑nickel alloy or iron‑nickel‑cobalt alloy; (ii) thin external gold coating; and (iii) thin nickel or nickel‑cobalt sub-coatings. Chemical analysis by inductively coupled plasma optical emission spectrometry revealed that the prepared sample consists mainly by copper (43 wt%), iron (26 wt%) and nickel (20 wt%); attractive contents of cobalt (4.6 wt%) and gold (1.4 wt%) were also determined. Due to the complex geometry of the pins and distinct reactivity of the different alloys, leaching stages were conducted in H2SO4-H2O2 media (1st step), HCl-H2O2 media (2nd step) and HCl media (3rd step). Under promising leaching conditions at 25 °C, all the metals were dissolved and then fine particles and thin foils of high purity gold (~99%) were recovered. Gold losses around 2–4 wt% were observed, mainly as result of its oxidation in the HCl-H2O2 media. The approach used in this work for treating the secondary source allowed the recovery of the precious metal with minimal losses, and it has potential to recover other valuable metals from the leach liquors.

Mechanical and microstructure characteristics of heat-treated of high-Cr WI and AISI4140 steel bimetal beams

Heat treatments are considered as one of the most important methods used to make significant changes in the microstructure of the metallic materials and their alloys, which makes it possible to change the external behavior and properties of these materials. The effect of heat treatment at 900°C on the microstructure, hardness and flexural behavior of bimetal beams has been studied in the present work. The bimetal beams composed of a high-Cr WCI as a wear-resistant part and an AISI4140 steel as a ductile part were fabricated. The two parts of bimetal castings are joined together by means of dovetail joint and/or connector pins. The present experimental and numerical results revealed that all bimetal beams exhibited flexural strength, toughness and maximum deflection higher than those of high-Cr WI specimen and lower than those of AISI4140 specimen in heat treated conditions. Heat treatment of the bimetal casting beams produced significant improvements in both hardness and flexural strength of high-Cr WI and AISI4140 steel. This is due to the formation of secondary carbides in the martensitic matrix surrounded by a network of M7C3 carbides in high-Cr WI, and formation of fine pearlite with proeutectoid α at grain boundaries for AISI4140 steel as revealed by SEM and an optical metallography. Bimetal beam with 12-connector pins (BI12CONN) as a mechanical joint exhibited the highest flexural strength and toughness compared with the other bimetal beams after heat treatment.

Charge distribution and discharge current analysis with charged connector pins

Electronic components and electromechanics can get static charges during handling and discharge on a printed circuit board when assembled. This study focuses on charged connector metal pins with less than 2 pF source capacitance. A charge distribution, rise time, and shape of the discharge current waveform is studied by using co-simulations between frequency domain finite element method and SPICE time domain circuits. Results show that the current rise time can be less than 10 ps and mainly depends on the inductance of the discharge path when the initial charging voltage is constant. The frequency response of the 3D object defines the shape of the discharge current waveform together with the series inductance and resistance of the discharge path.

Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding

Ultrasonic joining is a common industrial process. In the electronics industry it is used to form electrical connections, including those of dissimilar materials. Multiple influencing factors in ultrasonic joining are known and extensively investigated; process parameters like ultrasonic power, bond force, and bonding frequency of the ultrasonic vibration are known to have a high impact on a reliable joining process and need to be adapted for each new application with different geometry or materials. This contribution is focused on increasing ultrasonic power transmitted to the interface and keeping mechanical stresses during ultrasonic bonding low by using a multi-dimensional ultrasonic transducer concept. Bonding results for a new designed connector pin in IGBT-modules achieved by multi- and one-dimensional bonding are discussed.

Chemical mapping and analysis of electronic components from waste PCB with focus on metal recovery

Abstract This paper describes a detailed chemical characterization of connector pins separated from diverse electronic components removed from waste printed circuit boards (WPCB) of computers. Chemical maps by SEM-EDS (Scanning Electron Microscopy - Energy Dispersive Spectroscopy) indicated that the substrates of all connector pins are made by Cu-Sn, Cu-Zn or Cu-Sn-Zn alloys, which are covered by thin Ni and Au layers. The ICP-OES (Inductively Coupled Plasma - Optical Emission Spectrometry) analysis of the different connector pins revealed that these materials are mostly constituted by Cu (62–88% w/w) and very attractive Au contents were found (up to 1273 g/t). For all pins, intermediate contents of Zn, low contents of Ni, Sn and Pb and very low contents of Pd and Fe were determined. A heterogeneous, 100% metallic sample was prepared by mixing all individual connector pins aiming at contribute to the development of feasible technologies for recovering valuable metals. The mixed sample contains about 73% w/w Cu and 168 g/t Au, which are higher than the contents reported in the literature for samples obtained after grinding assembled or disassembled WPCB. The leaching of the mixed sample without grinding and concentration steps will reduce operating costs and maximize metals recovery avoiding mass losses.

Spacecraft Charging Related Risk of Floating Connector Pins

Every national spacecraft charging related design guideline or design standard includes prohibitions against floating, or ungrounded, connector pins. The rationale is obvious. A floating connector pin represents ungrounded metal with a propensity to accumulate charge from the space plasma environment and, upon breakdown, effectively couple the discharge energy directly into sensitive system electronics by virtue of adjacent pins and cables. Satellite designers may recognize that, seemingly as common as the rationale is obvious, there are instances in violation of this clear guideline and impassioned arguments for permissions to do so. This paper represents a comprehensive effort to quantitatively, theoretically, analytically, and empirically assess the risk associated with ungrounded connector pins in the selected (geostationary earth orbit and medium earth orbit) orbits.