The process of mass transfer from target to substrate during single-target magnetron sputtering has been investigated. The deviation of the film stoichiometry from the target composition has been shown to arise because of film resputtering by neutral recharged atoms rather than ions. The scattering angle of such atoms is about 20°. Two sputtering systems of different geometries have been used to suppress the resputtering effect: one with a conical target and the other with two opposite targets. Films of stoichiometric composition and predictable thickness have been obtained on substrates of large diameter with the aid of these two systems.