The homogenization approach to topology optimization is promising for generating high-performance, liquid-cooled cold plates due to its ability to create sub-resolution features by optimizing the spatial distribution and porosities of physical microstructures. This optimization capability has been demonstrated for the design of compact microchannel heat sinks under uniform heating conditions. However, there is a need to understand its applicability for practical applications involving complex boundary conditions posed by modern electronics packaging requirements. This work performs the topology optimization, design for manufacturing, fabrication, and experimental testing of a liquid-cooled cold plate for an application-representative multi-chip module with eight devices. The cold plate design requirements and boundary conditions involve eight equally spaced heat generating sources and liquid inlet/outlet ports that are off-center, introducing flow distribution challenges to the thermal design. A topology optimization algorithm is developed using the homogenization approach with circular pin fins chosen as the microstructure. An empirical permeability correlation for pin fins is developed which is implemented in the porous media flow model of the topology optimization algorithm to simulate pressure drop across additively manufactured pin fins. In addition to the topology optimized designs, a benchmark cold plate design with uniformly distributed 1.2 mm diameter pin fins, representative of the feature dimensions currently adopted in applications for the investigated boundary conditions, is also evaluated. Comparison of the topology optimized cold plate generated using the design freedom brought by additive manufacturing to the benchmark design highlights the optimizer’s ability to uniformly distribute the coolant amongst the heated regions. The maximum base temperature rise is 35.5 °C for the benchmark design versus 6.6 °C for the topology optimized design. Flow uniformity combined with the high convective heat transfer of the sub-resolution fins and channels in the vicinity of the heated regions keep the device temperatures low. The topology optimized cold plate is additively manufactured and experimentally tested at various flow rates. The experimental results match well with the model predictions, with a mean absolute percentage error of 5.5 % and 9.7 % for pressure drop and thermal resistance respectively, indicating that the optimal performance promised by the algorithm can be realized using additively manufactured parts. The work presented here demonstrates the overall process flow for the homogenization approach in leveraging the capabilities of additive manufacturing to generate high-performance liquid cold plates for practical applications.
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