Abstract Layer resonance induced by ultrasonic wave incidence is applied to monitor the viscoelastic properties of a curing adhesive layer between metal plates. The theoretical analysis shows that when the adhesive layer is modeled as a linear viscoelastic material, the ultrasonic reflection spectrum takes local minima at the layer resonance frequencies depending on the wave velocity of the adhesive. On the other hand, the local minima of the reflection spectrum can be expressed as a function of the loss factor of the adhesive. Based on these results, a characterization technique for the wave velocity and the loss factor of a curing adhesive layer is proposed. This technique enables the evaluation of the viscoelastic properties even if the reflected waves from both faces of a bond layer cannot be separated. The proposed method is employed to investigate the curing behavior of bi-component epoxy adhesives. As a result, it is shown that the bonding condition affects the variation of the wave velocity and loss factor. The estimated wave velocity increases as the curing proceeds, while the loss factor sometimes takes a local maximum depending on the bonding condition and the frequency range. When the mixing ratio of the main and curing agents is imbalanced, the variation of the wave velocity becomes gradual. Furthermore, the increase in the curing temperature leads to fast changes in the wave velocity and loss factor. The proposed technique has the potential to provide insight into the curing behavior of the adhesive layer by incorporating it into other measurement methods and theories.