Ferroelectric thin films have attracted attention because of their possible applications in new microelectronic devices. In particular, the BaTiO3 thin films, a material with a high dielectric constant, low leakage current and the quality of the change of its ferroelectric properties by adding and modifying the concentration of a doppand [1], can be used for a wide range of functional purposes, from simple capacitors to complicated microwave devices [2–6]. BaTiO3 films have been grown by many deposition techniques [1, 4,7, 8] but RF sputtering is known to be one of the best because it preserves the stoichiometry under the right deposition conditions. A major disadvantage of BaTiO3 is that it possesses a mechanical fragility, therefore, one of the main technological challenges for this material is to find an electrode-substrate that could offer mechanical stability. Also, this electrode-substrate must have a good thermal stability, low electrical resistance, high resistance to oxidation and good adherence for the film. Pt/TiO2/SiO2/Si is commonly used because it posseses the mentioned characteristics [2]. Nevertheless, it has many problems because titanium can migrate to the platinum surface during the annealing process, adding electrical resistively to electrode [9–12]. It also generates cracking in by thermal stress in the BaTiO3 thin films. The nichrome is suggested for a suitable electrode because it fulfills the requirements mentioned above [13–17] and, in contrast to Pt/TiO2/SiO2/Si, its commercial availability and its low price. Therefore, in this work, BaTiO3 films were grown on nichrome substrates by RF-sputtering, and their structural and ferroelectric properties were measured and improved in comparison with those deposited on Pt/TiO2/SiO2/Si substrates using the same method and under same deposition conditions. BaTiO3 thin films on nichrome substrates were prepared by RF magnetron sputtering in an off-axis geometry at room temperature. A 50.8 mm diameter. BaTiO3 target, 99.9% pure, from SCI Engineered Materials, Inc., was used. The nichrome was obtained from a commercial strip, nichrome 80, with 0.127 mm thickness from H. Cross Company, Inc. The films were also grown over Pt/TiO2/SiO2/Si substrates in order to com-
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