This article analyzes the structure of the wireless sensor circuit, considering the balance of power consumption, integration, area, noise, etc., and adopts a radio frequency wireless sensor circuit with a low‐IF structure. Through the analysis and comparison of traditional analog current trigger and digital current trigger structure, the feed‐forward current trigger structure is selected, which is composed of received signal strength indicator (RSSI) and variable gain amplifier (VGA), which achieves low power consumption, fast stabilization time, and wide dynamic range design. The received signal strength indicator adopts the form of approximate logarithmic amplifier, five‐stage double feedback loop structure, and realizes lower power consumption. In order to prevent the load current trigger from entering the speed saturation zone, a gain unit structure in which the superimposed current trigger is connected to the NMOS tube as the load is proposed. The test results show that the circuit has a good power consumption performance (1 mW) and at the same time 56.8 dB/m sensitivity. In this paper, through the analysis of the current trigger system and the analysis and comparison of the existing variable gain amplifiers, the variable gain amplifier structure composed of the folded wireless sensing unit and the index control unit is adopted. In order to reduce the power consumption of the circuit and increase the output swing, a structure in which the two‐stage folding wireless sensor unit shares the controlled voltage‐to‐current part of the circuit is proposed. Aiming at the design requirements of the system, this article discussed in detail the architecture of the entire temperature measurement node and the design parameters of the chip and completed the overall architecture design of the chip. The simulation results of the steady‐state temperature rise of the electric heating field show that the circuit has achieved an input dynamic adjustment range of more than 60 dB, the maximum power consumption is 1 mW, and the linearity error is less than 0.5 dB. The designed automatic gain control circuit is implemented in SMIC 0.18 cape CMOS process. The simulation results of the steady‐state temperature rise of the electric heating field show that the circuit has a 56 dB input dynamic adjustment range within a linear error of 1.25 dB, and the time constant is 7.55 ms, and power consumption is 2.84 mW. Through the steady‐state temperature rise simulation and test results of the electric heating field, the correctness of the design is verified and it meets the system requirements.