A new siloxane-containing monomer, 5,51- exo-(1,1,3,3,5,5-hexamethyl-trisiloxane -1,5-diyl) bisbicyclo[2,2,1]heptene-2,3- endo-dicarboxylic anhydride (3) was synthesized by the hydrosilylation reaction of 1,1,3,3,5,5-hexamethyl-trisiloxane (1) and cis-5-norbornene- endo-2,3-dicarboxylic anhydride (2). A series of organosoluble polysiloxaneimides (PI 5a-e) was prepared from the dianhydride 3 and several aromatic diamines 4 by a one-step high-temperature polycondensation method and the structures were characterized by IR and NMR. The effects of the main chain siloxane groups on the properties of PIs were evaluated by solubility, thermal stability and dielectric properties in addition to optical and water adsorption. The PIs were readily soluble in polar aprotic solvents such as NMP, DMAc and CHCl 3 at room temperature, except PI 5a, which was only soluble in polar amide type solvents at elevated temperature. PIs 5a-e had glass transition temperatures between 138 and 251°C in N2 and the 5% weight loss temperature ranged from 460 to 470°C under air. The PIs could be cast into flexible and tough films from DMAc solution. The films had tensile strengths of 44—52 MPa, tensile moduli of 0.56—0.68 GPa and elongations at break from 5.8—7.9%. The PI films exhibited good optical UV-vis transparency with wavelength cutoff of 269—289 nm and transmittances over 90% at 400 nm, and dielectric constants of about 2.76—2.65 with low water adsorption (0.3—0.4%).
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