AlGaN-based Deep-ultraviolet Light-emitting Diodes Research Articles

Significant improvement of n-contact performance and wall plug efficiency of AlGaN-based deep ultraviolet light-emitting diodes by atomic layer etching

The reactive ion etching (RIE) process is needed to fabricate deep ultraviolet (DUV) light-emitting diodes (LEDs). However, the n-contact performance deteriorates when the high-Al n-AlGaN surface undergoes RIE, leading to decreased LED performance. In this study, we employed an atomic layer etching (ALE) technology to eliminate surface damage generated during the mesa etching process, thus enhancing the n-Al0.65Ga0.35N ohmic contact. The improved contact performance reduced LED operation voltage and mitigated device heat generation. It was observed that DUV LEDs treated with 200 cycles of ALE showed a reduction in operating voltage from 8.3 to 5.2 V at 10 mA, with a knee voltage of 4.95 V. The peak wall plug efficiency (WPE) was approximately 1.74 times that of reference devices. The x-ray photoelectron spectroscopy (XPS) analysis revealed that ALE removed the surface damage layer induced by plasma etching, eliminating surface nitrogen vacancies and increasing surface electron concentration. Consequently, it facilitated better ohmic contact formation on n-Al0.65Ga0.35N. This study demonstrates that the ALE technology achieves etching with minor surface damage and is suitable for use in III-nitride materials and devices to remove surface defects and contaminations, leading to improved device performance.

Enhanced light extraction efficiency for the inclined-sidewall-shaped AlGaN-based DUV LED by using an omni-directional reflector with a thin hybrid dielectric layer.

In this Letter, an omni-directional reflector (ODR) with a thin hybrid dielectric layer (hybrid-ODR) is proposed to enhance the light extraction efficiency (LEE) for inclined-sidewall-shaped AlGaN-based deep ultraviolet light-emitting diode (DUV LED) by inserting a thin diamond with high refraction index into a conventional Al/Al2O3-based ODR. The three-dimensional finite-difference time-domain (3D FDTD) simulation results show that the LEE of TM-polarized light for the DUV LED with hybrid-ODR is enhanced by 18.5% compared with Al/Al2O3-based ODR. It is because the diamond can transform the evanescent wave in Al2O3 into the propagating light wave in diamond, thereby preventing effective excitation of the surface plasmon polariton (SPP) on the surface of the metal Al. Moreover, the Brewster's angle effect causes the TM-polarized light in diamond to propagate effectively into AlGaN. Furthermore, decreasing the total thickness of the dielectric layer also improves the scattering effect of the inclined sidewall. However, the utilization of hybrid-ODR results in a slight reduction in the LEE for transverse electric (TE) polarized light because the light is confined to the diamond layer and eventually absorbed by the metal Al.

Highly reflective Ni/Pt/Al p-electrode for improving the efficiency of an AlGaN-based deep ultraviolet light-emitting diode.

In this work, we propose a highly reflective Ni/Pt/Al p-electrode for AlGaN-based deep ultraviolet (DUV) light-emitting diodes (LEDs) with a wavelength of 276 nm. AlGaN-based DUV LEDs with traditional Al-based reflectivity electrodes suffer from device degradation and wall-plug efficiency (WPE) droop due to the Al diffusion during electrode annealing. By inserting a Pt layer between the Ni contact layer and the Al reflective layer, the contact characteristics of the p-electrode can be optimized by blocking the diffusion of the O and Al atoms, maintaining a high reflectivity of over 80% near 280 nm. Compared to the AlGaN-based DUV LEDs with Ni/Au traditional p-electrodes and Ni/Al traditional reflective p-electrodes, the WPE of the LED with a highly reflective Ni/Pt/Al p-electrode is improved by 10.3% and 30.5%, respectively. Besides, compared to the other novel reflective p-electrodes using multiple annealing or evaporation processes reported for the AlGaN-based DUV LEDs, we provide a new, to the best of our knowledge, optimization method for single evaporation and annealing p-type reflective electrodes, featured with a simpler and more convenient process flow.

Effects of Electron Blocking Layer Thickness on the Electrical and Optical Properties of AlGaN-Based Deep-Ultraviolet Light-Emitting Diode

Effects of Electron Blocking Layer Thickness on the Electrical and Optical Properties of AlGaN-Based Deep-Ultraviolet Light-Emitting Diode

On the origin of the enhanced light extraction efficiency of DUV LED by using inclined sidewalls.

It is known that light extraction efficiency (LEE) for AlGaN-based deep ultraviolet (DUV) light-emitting diodes (LEDs) can be enhanced by using an inclined sidewall of mesa. However, the reported optimal inclined angles are different. In this work, to explore the origin for enhancing the LEE of DUV LED by using inclined sidewalls, we investigate the effect of an inclined sidewall angle on the LEE for AlGaN-based DUV LEDs with different mesa diameters by using ray tracing. It is found that when compared to large-size DUV LEDs with inclined sidewall, the LEE of small-size DUV LEDs with inclined sidewall is enhanced from both the bottom and side surfaces due to the reduced scattering length and material absorption. Additionally, the optimal inclined sidewall angle is recommended within the range of 25°-65°, and the optimal angle for DUV LEDs decreases as the chip size increases. It can be attributed to the fact that there are two scattering mechanisms for the inclined sidewall. For smaller chip sizes, most of the light is directly scattered into escape cones by the inclined sidewall, resulting in a larger optimal angle. For larger chip sizes, the light firstly experiences total internal reflections by the out-light plane and then is scattered into escape cones by the inclined sidewalls, leading to a smaller optimal angle.

Enhancing the performance of AlGaN-based DUV-LEDs with multifocal laser stealth dicing

In this study, AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) processed via standard laser dicing (SLD) and multifocal laser stealth dicing (MFLSD) were investigated. Adopting the MFLSD technology would generate a roughing surface rather than the V-shaped grooves on the sidewall of 508 × 508 µm2 DUV-LEDs, which would reduce the forward operating voltage and increase the wall-plug efficiency, light output power, and far-field radiation patterns of these devices. In addition, the wavelength shift, far-field patterns, and light-tracing simulation results of the DUV-LEDs processed with SLD and MFLSD were clearly demonstrated and analyzed. Accordingly, it was observed that the MFLSD process provided more possibilities for photon escape to increase the light extraction efficiency (LEE) of DUV-LEDs, thus decreased the wavelength-redshift and junction temperature in DUV-LEDs. These results provide a reference for advanced nano-processing practices implemented during the fabrication of semiconductor devices.

Enhancing the Hole Injection in AlGaN-Based Deep Ultraviolet Light-Emitting Diodes With Engineered p-AlGaN Hole Supplier Layer

Enhancing the Hole Injection in AlGaN-Based Deep Ultraviolet Light-Emitting Diodes With Engineered p-AlGaN Hole Supplier Layer

Improving AlGaN-based deep-ultraviolet light-emitting diodes: SiO2 passivation and size optimization for enhanced optoelectronic performance

Improving AlGaN-based deep-ultraviolet light-emitting diodes: SiO2 passivation and size optimization for enhanced optoelectronic performance

Deep ultraviolet AlGaN-multiple quantum wells with photoluminescence enhanced by topological corner state

The AlGaN-based deep ultraviolet light-emitting diode (DUV LED) has advantages of environmentally friendly materials, tunable emission wavelength, and easy miniaturization. However, an increase in Al composition leads to a decline in the lattice quality, thereby reducing the internal quantum efficiency (IQE). In addition, the light extraction efficiency (LEE) is limited due to the strong transverse magnetization polarization emission from the multiple quantum wells. Here, we designed the topological corner structure in AlGaN-MQWs, and the high electric field intensity in a tiny space at the corner results in an extremely high local density of optical states (LDOS), which could shorten the luminescence decay time of the emitter and increase the radiative rate by 26 times. Meanwhile, because the excited topological corner state resonance mode is a transverse-electric mode, enhancing only the transverse-electric luminescence without any gain for transverse-magnetic luminescence, thereby significantly improving the light extraction efficiency. Finally, according to theoretical calculations, the IQE could reach 68.75% at room temperature.

Ring geometric effect on the performance of AlGaN-based deep-ultraviolet light-emitting diodes.

In this study, we fabricated and characterized various parallel flip-chip AlGaN-based deep-ultraviolet (DUV) micro-ring LEDs, including changes in ring dimensions as well as the p-GaN-removed region widths at the outer micro-ring, respectively (PRM LEDs). It is revealed that the LED chips with smaller mesa withstand higher current density and deliver considerably higher light output power density (LOPD), under the same proportion of the hole to the entire mesa column (before it is etched into ring) within the limits of dimensions. However, as the ring-shaped mesa decreases, the LOPD begins to decline because of etching damage. Subsequently, at the same external diameter, the optical performance of micro-ring LEDs with varied internal diameters is studied. Meanwhile, the influence of different structures on light extraction efficiency (LEE) is studied by employing a two-dimensional (2D)-finite-difference time-domain (FDTD) method. In addition, the expand of the p-GaN-removed region at the outer micro-ring as well as the corresponding effective light emission region have some influence to LOPD. The PRM-23 LED (with an external diameter of 90 µm, an internal diameter of 22 µm, and a p-GaN-removed region width of 8 µm) has an LOPD of 53.36 W/cm2 with a current density of 650 A/cm2, and an external quantum efficiency (EQE) of 6.17% at 5 A/cm2. These experimental observations provide a comprehensive understanding of the optical and electrical performance of DUV micro-LEDs for future applications.

Influence of the thickness of p-GaN ohmic contact layer on the performance of AlGaN-based deep-ultraviolet light-emitting diodes

276 nm AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) with varying p-GaN thicknesses were investigated. The simulation results demonstrate that DUV-LEDs with an ultra-thin 4 nm p-GaN layer exhibit a 96.9% increase in full-angle total radiant intensity compared to those with a 350 nm p-GaN layer. Meanwhile, the total radiant intensity of the DUV-LEDs with 4 nm p-GaN were all elevated during the degree of polarization (DOP) transition from 1 to −1. The experimental results demonstrate that the maximum external quantum efficiency (EQE) and wall-plug efficiency (WPE) values of 5.3% and 4.0%, respectively, at 4 A/cm2 for the DUV-LEDs with a 4 nm p-GaN layer. These figures represent remarkable improvements of 60.6% and 42.8% when compared to DUV-LEDs featuring a 350 nm p-GaN layer. Nevertheless, it's worth noting that the adoption of an ultra-thin p-GaN ohmic contact layer introduced some surface irregularities, potentially affecting the ohmic contact of the p-type layer and resulting in a slight voltage increase, thus tempering the WPE improvement. The light extraction efficiency (LEE) values of 10.0%, 7.4%, 6.7% and 6.3% were extracted for the four samples after fitting the experimental EQE curves by the ABC model.

Investigation of highly reflective p-electrodes for AlGaN-based deep-ultraviolet light-emitting diodes.

We proposed a "Ni sacrifice" method to fabricate Al-based highly reflective p-electrode in the ultraviolet spectral region for AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs). The "Ni sacrifice" p-electrode could have a high optical reflectivity of around 90% at the DUV spectral region below 300 nm. Compared to Ni/Au, indium tin oxide (ITO), and Pd p-contacts, the "Ni sacrifice" led to a higher resistivity of p-contacts and a slightly higher operated voltage of the DUV-LEDs (within 0.6 V at 20 mA). Although the electrical performance was degraded slightly, the light output power and external quantum efficiency of the DUV-LEDs could be improved by utilizing the "Ni sacrifice" p-electrode. Besides, we introduced a grid of vias in the device mesa and reduced the diameter of the vias to achieve an enhanced peak external quantum efficiency (EQE) up to 1.73%. And the wall-plug efficiency (WPE) of DUV-LEDs with a "Ni sacrifice" p-electrode was higher than that of Ni/Au p-electrode DUV-LEDs at low currents. These results highlight the great potential of the proposed "Ni sacrifice" reflective p-electrode for use in DUV-LEDs.

AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes With Varied Thickness of Sidewall Passivation via Atomic Layer Deposition

AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes With Varied Thickness of Sidewall Passivation via Atomic Layer Deposition

Performance Enhancement of AlGaN-based Deep Ultraviolet Light-emitting Diodes with AlxGa1-xN Linear Descending Layers

Performance Enhancement of AlGaN-based Deep Ultraviolet Light-emitting Diodes with AlxGa1-xN Linear Descending Layers

Enhanced hole injection in Ga-polar 290 nm AlGaN-based DUV LEDs with a p-n junction hole accelerator

The limited kinetic energy of holes in AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) poses a challenge in their transportation into the active region across the Al-rich electron blocking layer (EBL) and significantly restricts the electrical and optical performance of DUV LEDs. In this work, we propose a hole accelerator structure composing a p-AlxGa1-xN/n-AlxGa1-xN junction to improve the hole injection efficiency and explore the mechanism behind the enhanced performance with the Advanced Physical Models of Semiconductor Devices software (APSYS). The built-in electric field of the p-n junction distributes along the [000-1] direction, which can enhance the hole drift velocity and improve the hole injection into the active region. Moreover, with an optimum Al composition of 50%, [000-1] oriented polarization-induced electric field can be generated at the vicinity of both the p-EBL/accelerator and accelerator/hole supplier interfaces, which further boosts the holes into the active region. Besides, the original steep barrier for holes at the EBL/hole supplier interface can be splited into a two-step barrier which is more favorable for hole transportation. As a result, an enhanced optical power by 49.4% and alleviated efficiency droop by 76.3% can be achieved with the proposed p-n junction-based hole accelerator. The results can pave the way for AlGaN-based DUV LEDs towards high-power and high-efficiency applications.

Improving the hole injection efficiency in AlGaN DUV LEDs by minimizing the band offset at the p-EBL/hole supplier interface

In AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs), the large valence band offset between the Al-rich electron blocking layer (EBL) and p-AlGaN hole supplier weakens the chance of holes being injected into the active region. Only holes with kinetic energy larger than the barrier height at the EBL/p-AlGaN interface are allowed to climb over the EBL before entering the active region, limiting the hole injection efficiency and thus reducing the external quantum efficiency (EQE). In this work, we incorporate a thin AlGaN insertion layer between EBL and the p-AlGaN hole supplier to enhance the hole injection efficiency of DUV LEDs via regulating the energy band at the p-EBL/p-AlGaN interface. By systematically investigating and analyzing the effects of aluminum components in the insertion layers on the hole injection and the electron confinement, we found that the insertion layer with an Al composition of 45% can effectively enhance the EQE of DUV LEDs by 40.5% and suppress efficiency droop by 65.5%. The design strategy provides an effective approach to boost the hole injection efficiency for AlGaN-based DUV LEDs.

Simultaneously improved hole injection and current uniformity in 293 nm AlGaN-based deep ultraviolet light-emitting diodes

Insufficient hole injection and current nonuniformity caused by the nature of the p-AlGaN hole injection layer (HIL) are two issues impeding the advances in the optical and electrical properties of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs). To simultaneously improve the hole injection efficiency and current uniformity, an Al-linearly-decreasing AlGaN PN junction (ALD AlGaN PN junction) is proposed to replace the conventional p-AlGaN HIL with a constant Al component. The barrier height for holes at the interface between the p-type electron blocking layer (p-EBL) and HIL as well as the hole concentration and resistance in the p-AlGaN HIL can be modulated at the same time by the proposed ALD AlGaN PN junction. As a result, the hole injection efficiency is enhanced due to the reduced barrier height at the p-EBL/HIL interface and the polarization-induced three-dimensional hole gas (3DHG) induced in the proposed ALD AlGaN PN junction HIL. In addition, the lateral current uniformity is improved by the properly regulated resistance in the p-AlGaN HIL, which can be ascribed to the additional barrier for holes in the valence band because of the incorporated ALD AlGaN PN junction. The proposed DUV LED with ALD AlGaN PN junction exhibits enhanced EQE by a factor of 39.2% at 100 A/cm2 and simultaneously improved current uniformity in the active region. This designed ALD AlGaN PN junction structure provides a promising strategy for achieving high-performance DUV LEDs.

High Hole Injection for Nitrogen-Polarity AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes

High hole injection is desired for improving the performance of AlGaN-based deep-ultraviolet (DUV) light-emitting diodes (LEDs). In this work, we adopted a compositionally graded p-Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y1</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1-y1</sub> N/Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.85</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.15</sub> N superlattice (SL) structure in a nitrogen-polarity DUV LED. Our numerical simulation results show that this SL structure is very beneficial to the hole injection into the active region, and leads to a low turn-on voltage and device resistance. This is significant because a low device resistance means a low power consumption and a high wall-plug efficiency. Meanwhile, a DUV LED with compositionally graded SL has a peak internal quantum efficiency (72%) that is much higher than that of the reference DUV LED without an SL (56%). This work provides an attractive approach to effectively injecting holes into the active region of a nitrogen-polarity AlGaN-based DUV LED.

Plasmonic-enhanced efficiency of AlGaN-based deep ultraviolet LED by graphene/Al nanoparticles/graphene hybrid structure.

The AlGaN-based deep ultraviolet light-emitting diode (DUV LED) has advantages of environmentally friendly materials, tunable emission wavelength, and easy miniaturization. However, the light extraction efficiency (LEE) of an AlGaN-based DUV LED is low, which hinders its applications. Here, we design a graphene/Al nanoparticles/graphene (Gra/Al NPs/Gra) hybrid plasmonic structure, where the strong resonant coupling of local surface plasmons (LSPs) induces a 2.9-times enhancement for the LEE of the DUV LED according to the photoluminescence (PL). The dewetting of Al NPs on a graphene layer by annealing is optimized, resulting in better formation and uniform distribution. The near-field coupling of Gra/Al NPs/Gra is enhanced via charge transfer among graphene and Al NPs. In addition, the skin depth increment results in more excitons being coupled out of multiple quantum wells (MQWs). An enhanced mechanism is proposed, revealing that the Gra/metal NPs/Gra offers a reliable strategy for improving the optoelectronic device performance, which might trigger the advances of LEDs and lasers with high brightness and power density.

Optical power degradation mechanisms in 271 nm AlGaN-based deep ultraviolet light-emitting diodes.

The degradation of AlGaN-based UVC LEDs under constant temperature and constant current stress for up to 500 hrs was analyzed in this work. During each degradation stage, the two-dimensional (2D) thermal distributions, I-V curves, optical powers, combining with focused ion beam and scanning electron microscope (FIB/SEM), were thoroughly tested and analyzed the properties and failure mechanisms of UVC LEDs. The results show that: 1) the opto-electrical characteristics measured before/during stress indicate that the increased leakage current and the generation of stress-induced defects increase the non-radiative recombination in the early stress stage, resulting in a decrease in optical power; 2) the increase of temperature caused by the deterioration of the Cr/Al layer of p-metal after 48 hrs of stress aggravates the optical power in UVC LEDs. The 2D thermal distribution in conjunction with FIB/SEM provide a fast and visual way to precisely locate and analyze the failure mechanisms of UVC LEDs.