Advanced Electronic Systems Research Articles

Transport and magnetic properties of [formula omitted]/Graphene nanoplatelets nanocomposites

A series of Zn0.5Co0.25Cu0.25Ho0.037Fe1.963O4 (ZCCHF)/Graphene nanoplatelets (GNPs) nanocomposites (where GNPs = 0 wt%, 1.25 wt%, 2.5 wt%, 3.75 wt%, 5 wt%) were prepared via sol-gel auto-combustion (SGAC) method followed by bath sonication and studied their structural, morphological, optical, dielectric, and magnetic properties. The structural analysis confirmed a single-phase crystal matrix of all the as-prepared nanocomposites. The optical analysis revealed that the energy bandgap (Eg) lies within the range of 1.57 eV–1.62 eV. The dielectric analysis showed that the improvement in the dielectric constant (ε′) and reduction in dielectric tangent loss (tan δd) with increasing GNPs concentration from 0 wt% to 5 wt%. The real part of permeability (μ′) was improved and magnetic tangent loss (tan δM) was reduced with the addition of GNPs. Magnetic properties were studied at different temperatures (5 K, 300 K, and 400 K), and observed high saturation magnetization (MS), and coercivity (HC) at a low temperature (at 5 K). The low MS, and HC values were observed at high temperatures (300 K and 400 K). The combination of improved dielectric and tunable magnetic properties makes ZCCHF/GNPs nanocomposites promising candidates for applications in spintronics, high-frequency magnetic devices, and advanced electronic systems.

Enhanced high-temperature energy storage performance in all-organic dielectric films through synergistic crosslinking of chemical and physical interaction

Advanced electronic devices and energy systems urgently require high-temperature polymer dielectrics that can offer both high discharge energy density and energy storage efficiency. However, the capacitive properties of most polymers sharply deteriorate at elevated temperatures, due to the significant rise in leakage current density and energy loss. Herein, a new design approach is adopted to fabricate high-temperature polyetherimide (PEI) dielectrics with chemical and physical cooperative crosslinking networks, the dual-crosslinked PEI dielectrics are prepared through amine crosslinking agent and the electrostatic interaction of oppositely charged phenyl groups between triptycene (TE) and PEI chain segments. Benefiting from the increased crosslinking sites, the dual-crosslinked PEI films achieve the simultaneously enhancement in Tg, modulus and bandgap compared to un-crosslinked and single-crosslinked polymers. Meanwhile, the PEI with dual-crosslinked network displays higher chain packing density, effectively reducing the mean motion pathways of charge carriers and the conduction loss inside polymer dielectric. Consequently, the dual-crosslinked PEI containing 0.25 wt% TE delivers an outstanding discharge energy density of 2.69 J/cm3 and retains excellent cyclability after 100,000 charge–discharge cycles at 200 ℃. Additionally, finite element analysis and molecular dynamics simulation further confirm that less Joule heat and tighter chain structure are formed in the dual-crosslinked polymer dielectric. This research offers a novel methodology to prepare high-performance polymer dielectrics for high-temperature applications.

Structural Design of Hybrid Fillers in a Polymer Matrix for Advanced Electromagnetic Interference Shielding

The rapid development of modern advanced electronic systems has created a pressing need for multifunctional polymer composites that can withstand external adversities such as electromagnetic waves, flames, and mechanical stresses. Although these requirements can be satisfied by incorporating different types of fillers, high filler loadings often lead to issues such as poor processability and increased material costs. Herein, a multifunctional polyamide‐6 composite is introduced using a carbon‐fiber flame‐retardant hybrid filler to design a next‐generation electromagnetic interference (EMI) shielding system. Based on the synergistic effect of the functionality and structural arrangement of these fillers in the composite, the EMI shielding system demonstrates high EMI shielding performance, improved mechanical properties, and excellent flame retardancy despite the low filler content. The scalability and multifunctionality of the proposed system highlight its potential for use in next‐generation applications, such as electric vehicles, aerospace, and 5G/6G telecommunications.

Achieving ultra-high energy storage performance in simple systems through minimal element substitution

Dielectric capacitors are essential components of modern advanced electronic devices and power systems based on their ultra-fast charging and discharging speeds and supreme power densities. Nevertheless, how to comprehensively boost their energy storage density and storage efficiency is still an insurmountable challenge. Here, we report a simple micro-chemical polarizability modulation strategy that enables SrTiO3-based dielectric materials to achieve excellent energy storage properties. The energy density and energy efficiency are increased to as high as 76 J∙cm−3 and 72 % from 0.4 J∙cm−3 and 46.7 % of pure STO, respectively, which is the largest value in micro-substitution (less than 3 %). Our results show that the introduction of trace amounts of elements with high ionic polarizabilities (Mn, V) facilitates the increase of chemical disorder and the formation of stable and highly dynamic polar nanoregions (PNRs), which reduces the hysteresis of the polarization switching and improves the polarization at the breakdown field strength, synergistically fostering the energy storage performance. The results of X-ray photoelectron spectroscopy and scanning electron microscopy reveal that the micro-substitution of Mn and V promote the reduction of oxygen vacancies and grain size, improving the breakdown resistance and stability of the capacitor. This present approach is expected to be widely used in the development of high-performance dielectrics.

Numerical analysis of mono and hybrid nanofluids-cooled micro finned heat sink for electronics cooling-(Part-II)

This study investigates the thermal and hydraulic performance of heat sinks with micro pin-fins in circular and rectangular configurations using mono and hybrid nanofluids. Motivated by the need for efficient cooling solutions in high-performance electronic devices, the research explores novel combinations of metallic oxide (Ag, MgO) and carbon-based nanoparticles (GNP, MWCNT) in nanofluids. A constant volume fraction of micro pin-fins and nanoparticles was maintained to assess their effects on thermohydraulic performance. The method involved experiments with aqueous nanofluids as coolants, measuring pressure drops (Δp) at the inlet and outlet. Thermal performance was evaluated using metrics like thermal resistance (Rth), Nusselt number (Nuavg), pumping power (PP), volumetric flow rate (Q), overall performance (OP), and performance evaluation criterion (PEC). Results showed that GNP-based mono nanofluids significantly reduced Rth by 46.41 % and increased Nuavg by 60.54 % and PEC by 62 % in rectangular heat sinks compared to conventional water cooling. Comparisons between rectangular and circular configurations revealed minimal Rth differences of 2.54 % and 3.57 %. GNP-dispersed nanofluids outperformed other coolants, with the rectangular configuration achieving a higher PEC of 1.62 versus 1.52 for the circular configuration at 820 Pa. The conclusions suggest that rectangular pin-fins with GNP-based nanofluids offer superior thermohydraulic performance. The key outcomes from current study have significant contribution in enhancing the cooling efficiency of advanced electronic systems.

Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis

Abstract In advanced electronic systems, achieving top-tier interconnect interfaces with fine-pitch integration is of paramount importance. Among interconnect options, hybrid bonding is the preeminent choice given its exceptional capacity for accommodating a high input/output (I/O) count, which facilitates high-density memory integration, increased power delivery, and enhanced signal speed. One key technique for ensuring utmost quality in hybrid bonding involves embedding Cu interconnects within the dielectric layer. Equally pivotal is surface planarization, accomplished through chemical mechanical polishing (CMP), which encompasses a meticulous two-step procedure, commencing with copper bulk CMP and culminating in barrier CMP. The latter step is particularly critical, yielding the indispensable surface finish required for a successful hybrid bonding process. Several crucial surface properties significantly influence overall bond yield, including a copper recess (“dishing”) in the vias, erosion and roughness of the dielectric layer, and surface topography changes from high-density to low-density copper vias. To optimize these parameters, a comprehensive understanding of the interconnect layer's design is essential. Here, we delve into the ramifications of via scaling, ranging from 5 to 1 µm, on dishing and roll-off, and the effects of copper via density variation, spanning from 16% to 13%, on topography. Furthermore, we explore how incorporation of dummy vias impacts the final surface finish, potentially leading to improved bond yie

Magnetic-assisted alignment of nanofibers in a polymer nanocomposite for high-temperature capacitive energy storage applications.

Flexible polymer-based dielectrics with high energy storage characteristics over a wide temperature range are crucial for advanced electrical and electronic systems. However, the intrinsic low dielectric constant and drastically degraded breakdown strength hinder the development of polymer-based dielectrics at elevated temperatures. Here, we propose a magnetic-assisted approach for fabricating a polyethyleneimine (PEI)-based nanocomposite with precisely aligned nanofibers within the polymer matrix, and with Al2O3 deposition layers applied on the surface. The resulting polymer nanocomposite exhibits simultaneously increased dielectric constant and enhanced breakdown strength at high temperatures compared to pristine PEI. The enhanced dielectric constant is contributed by the depolarization effect of out-of-plane orientated nanofibers in composite films, while the surficial Al2O3 layers, with a wide bandgap, effectively prevent charge injection and transport at the electrode/dielectric interface. The optimally aligned composite films exhibit a significantly enhanced discharged energy density of 6.5 J cm-3 at 150 °C, with approximately 41% and 132% enhancement compared to random films and pristine PEI films, respectively. Additionally, a metalized multilayer polymer-based capacitor utilizing this composite film produces a high capacitance of 88 nF, while demonstrating excellent cyclability and flexibility at 150 °C. This work offers an effective strategy for developing polymer-based composite dielectrics with superior capacitive performance at elevated temperatures and demonstrates the potential of fabricating high-quality flexible capacitors.

Investigation of Electric Field Tunable Optical and Electrical Characteristics of Zigzag and Armchair Graphene Nanoribbons: An Ab Initio Approach.

Graphene nanoribbons (GNRs), categorized into zigzag and armchair types, hold significant promise in electronics due to their unique properties. In this study, optical properties of zigzag and armchair GNRs are investigated using density functional theory (DFT) in conjunction with Kubo-Greenwood formalism. Our findings reveal that optical characteristics of both GNR types can be extensively modulated through the application of a transverse electric field, e.g., the refractive index of the a zigzag GNR is shown to vary in the range of n = 0.3 and n = 9.9 for the transverse electric field values between 0 V/Å and 10 V/Å. Additionally, electrical transmission spectra and the electrical conductivities of the GNRs are studied using DFT combined with non-equilibrium Green's function formalism, again uncovering a strong dependence on the transverse electric field. For example, the conductance of the armchair GNR is shown to vary in the range of G = 6 μA/V and G = 201 μA/V by the transverse electric field. These results demonstrate the potential of GNRs for use in electronically controlled optoelectronic devices, promising a broad range of applications in advanced electronic systems.

Dipole Orientation Engineering in Crosslinking Polymer Blends for High-Temperature Energy Storage Applications.

Polymer dielectrics that perform efficiently under harsh electrification conditions are critical elements of advanced electronic and power systems. However, developing polymer dielectrics capable of reliably withstanding harsh temperatures and electric fields remains a fundamental challenge, requiring a delicate balance in dielectric constant (K), breakdown strength (Eb), and thermal parameters. Here, amide crosslinking networks into cyano polymers is introduced, forming asymmetric dipole pairs with differing dipole moments. This strategy weakens the original electrostatic interactions between dipoles, thereby reducing the dipole orientation barriers of cyano groups, achieving dipole activation while suppressing polarization losses. The resulting styrene-acrylonitrile/crosslinking styrene-maleic anhydride (SAN/CSMA) blends exhibit a K of 4.35 and an Eb of 670 MV m-1 simultaneously at 120°C, and ultrahigh discharged energy densities (Ue) with 90% efficiency of 8.6 and 7.4 J cm-3 at 120 and 150°C are achieved, respectively, more than ten times that of the original dielectric at the same conditions. The SAN/CSMA blends show excellent cyclic stability in harsh conditions. Combining the results with SAN/CSMA and ABS (acrylonitrile-butadiene-styrene copolymer)/CSMA blends, it is demonstrated that this novel strategy can meet the demands of high-performing dielectric polymers at elevated temperatures.

Nanoscale phase separation achieved through trace PVDF/PEI blending enhances mechanical and energy storage performance at high temperatures

Due to the development of advanced electronic systems, there is an urgent need for polymer dielectric film capacitors with high breakdown strength (Eb) and high discharge energy density (Ud) at elevated temperatures. Herein, an all-organic blend polymer composite is fabricated by blending polyetherimide (PEI) and a trace amount of Poly(vinylidene fluoride) (PVDF), achieving nanoscale phase separation and forming interfaces between PEI and PVDF grain. The real permittivity (εr) and Eb of blend composites are simultaneously enhanced after PVDF introduction. It is worth noting that increasing the temperature does not reduce the Eb of the PEI/xPVDF blend composite. Our Study shows that optimizing the plasticity and storage modulus of PEI/xPVDF significantly contributes to maintaining Eb at elevated temperatures. Additionally, high temperatures enhance the entanglement of molecular chains at the PVDF-PEI interface, further supporting the preservation of Eb. Finally, a high Eb of 540 MV/m, a high Ud of 5.92 J/cm3 are achieved for the PEI/0.5PVDF blend at 150 °C. This work presents a new approach to enhance the Eb of dielectric polymers by optimizing mechanical properties at high temperature, which providing a different strategy for enhancing the energy storage performance.

Assessing Electronics with Advanced 3D X-ray Imaging Techniques, Nanoscale Tomography, and Deep Learning

This paper presents advanced workflows that combine 3D X-ray microscopy (XRM), nanoscale tomography, and deep learning (DL) to generate a detailed visualization of the interior of electronic devices and assemblies to enable the study of internal components for failure analysis (FA). Newly developed techniques, such as the integration of DL-based algorithms for 3D image reconstruction to improve scan quality through increased contrast and denoising, are also discussed in this article. In addition, a DL-based tool called DeepScout is presented. DeepScout uses 3D XRM scans in targeted regions of interest as training data for upscaling high-resolution in a low-resolution dataset, of a wider field of view, using a neural network model. Ultimately, these workflows can be run independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy, and they will provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging and machine learning—perhaps complemented with some additional correlative microscopy investigations—can speed development time, increase cost efficiency, and simplify FA and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.

All-printed 3-dimensional micro-supercapacitors with homogeneous Ag interface: Achieving precision on curved surfaces through Electrohydrodynamic jet printing

Despite advancements in manufacturing techniques for micro-supercapacitors (MSCs), significant challenges remain in achieving on-chip miniature devices that conform to complex surfaces, which is crucial for the seamless integration in advanced electronic systems. This study utilizes direct electrohydrodynamic (EHD) 3-dimensional (3D) printing to fabricate all-printed MSCs on planar and curved surfaces, employing Ag as a base material for both current collectors and electrodes to ensure homogeneous interfaces throughout the printed structures. Our approach uniquely manipulates the applied nozzle voltage in the EHD 3D printing process to achieve finely controlled and uniform 3D structures on both flat and curved surfaces. The high-precision EHD jet printer produces MSCs with notably narrow electrode linewidths of approximately 144μm. A 3D MSC cell is then fabricated with 15 EHD 3D-printed stacked layers to achieve a remarkable electrode-line height/width (h/w) ratio of 4.2, which exhibits exceptional electrical performance with an areal capacitance of 763.1 mF cm−2 and energy density of 256.6 μWh cm−2. Additionally, multiple MSCs are EHD 3D-printed on a curved substrate to successfully energize an LED. These findings verify that EHD 3D printing can be utilized to fabricate scalable energy storage devices that can be easily integrated with the next generation electronic systems.

Ultrahigh energy storage performance in BNT-based binary ceramic via relaxor design and grain engineering

Dielectric capacitors attract much attention for advanced electronic systems owing to their ultra-fast discharge rate and high power density. However, the low energy storage density (Wrec) and efficiency (η) severely limit their applications. Herein, Bi0.5Na0.5TiO3-K0.5Na0.5NbO3 binary ceramic is developed to obtain excellent energy storage performance with strong relaxor behavior, together with large polarization and distorted lattice calculated by first-principles calculations. The atomic-scale local structure analysis of 0.75Bi0.5Na0.5TiO3–0.25K0.5Na0.5NbO3 ceramic reveals distorted polarization distribution and small polar nanoregion related with the enhanced relaxation and low hysteresis. Finite element analysis demonstrates ultrafine grain and increased grain boundary density following hot-pressing sintering are crucial factors in significantly enhancing the breakdown strength (Eb). As a result, ultrahigh Wrec of 12.39 J/cm3 and η of 87.1 % are achieved at a superhigh Eb of 713 kV/cm. Encouragingly, excellent performance of temperature, frequency and fatigue stability at 400 kV/cm are obtained, and high power density of ∼ 306 MW/cm3 as well as fast discharge speed of ∼ 23.3 ns are also realized. This work proposes a simple binary design with strong relaxor behavior, and highlights the potential of grain engineering to achieve outstanding energy storage performance with great stability and excellent charge-discharge property for pulse power devices.

Condition Monitoring System: A Flexible Hybrid Electronics Approach for Sealed Container Applications

A comparative study is presented between two advanced flexible hybrid electronics (FHE) systems designed for monitoring temperature within storage containers across various industries, including food, pharmaceuticals, agriculture, automotive, and defense. The first system, a copper-flex system (CFS), employs an 88.9 µm polyimide substrate with 35 µm thick copper traces, coated with a 12.5 µm polyimide solder mask. The second system, a printed-flex system (PFS), utilizes a 127 µm polyimide substrate with high-temperature resistance and tensile strength. Conductive silver ink was screen-printed on the PFS substrate, and electronic components including a temperature sensor were attached. Functional and reliability tests were performed to check the accuracy and durability of the temperature sensor. Further, environmental and mechanical characterizations including moisture and insulation resistance, corrosion, elongation, bending, and terminal bond strength tests were performed based on ASTM and IPC-TM650 standards. Moisture and insulation resistance test on the PFS test coupons without a coating layer indicated stable resistance of approximately 18 MΩ, while permanent color change indicated oxidation of copper on uncoated CFS test coupons. After 72 hours of corrosion test, both the CFS and PFS “meander line” test coupons covered with polyimide showed negligible change in weight and resistance, approximately 0.35%. A Young’s modulus of 7.17 GPa and 2.6 GPa was calculated from the elongation test for the CFS and PFS, respectively. Bending tests on PFS revealed negligible average resistance change (0.1%) during 180° bending cycles, while no impact was recorded on the CFS. During the terminal bond strength test, soldered wires detached from the CFS test coupons at an average force of 43 N, while it was 3.8 N on the PFS test coupons. Both systems with polyimide coating layer demonstrate robustness and reliability for diverse applications in various industries.

Defect‐Driven Light Perception and Memristor Storage with Phase Transition in Vanadium Dioxide

AbstractTunable optical information storage is crucial in artificial retinal systems for mimicking neurobiological visual characteristics. The perception and storage of light signals rely heavily on the regulation of the conductivity states of memristor materials (e.g., transition metal oxides). Controlling light memristor behavior via defects and polymorphic phases remains underexplored and differs from traditional plasticity training via repeated testing. In this study, defect‐driven ultraviolet light perception and memristor storage with phase transitions in vanadium dioxide (VO2) thin films are presented. The effects of oxygen defects and the corresponding polymorphic phases on ultraviolet light memristors are investigated. The dependence of phonon vibrations and insulator–metal transition behavior on defect levels are revealed. Self‐doping and polymorphs enable VO2 to exhibit distinct ultraviolet memristor performance. It is anticipated that defect‐driven light memristors significantly contribute to the realization of artificial synaptic devices and the implementation of advanced electronic neuron systems.

Polymer nanocomposites with concurrently enhanced dielectric constant and breakdown strength at high temperature enabled by rationally designed core-shell structured nanofillers

Polymer dielectrics are required to maintain high energy density at elevated temperatures for advanced power and electronic systems. Herein, we report a novel solution-processed core-shell structured polyimide (PI) nanocomposite with moderate dielectric constant HfO2 core and wide-bandgap Al2O3 shell, effectively addressing the typical trade-off between dielectric constant and breakdown strength in dielectric nanocomposites predominant at elevated temperatures. The formation of improved dielectrically matching interfaces by the rationally designed dielectric constant gradient from core-shell-matrix remarkably mitigates the distortion of the electric field around the interfaces, resulting in a high breakdown strength. Wide band gap Al2O3 shell also introduces deeper traps to impede the conduction loss. The validity of Al2O3 shell has been proved via experiments and simulations. Accordingly, HfO2@Al2O3/PI nanocomposite exhibits an excellent charge-discharge efficiency of 91.7 % at 300 MV/m and a maximum discharged energy density of 2.94 J/cm3 at 150 °C, demonstrating its potential for high-temperature energy storage.

Polymorphic Heterogeneous Polar Structure Enabled Superior Capacitive Energy Storage in Lead-Free Relaxor Ferroelectrics at Low Electric Field.

High-performance energy storage dielectrics capable of low/moderate field operation are vital in advanced electrical and electronic systems. However, in contrast to achievements in enhancing recoverable energy density (Wrec), the active realization of superior Wrec and energy efficiency (η) with giant energy-storage coefficient (Wrec/E) in low/moderate electric field (E) regions is much more challenging for dielectric materials. Herein, lead-free relaxor ferroelectrics are reported with giant Wrec/E designed with polymorphic heterogeneous polar structure. Following the guidance of Landau phenomenological theory and rational composition construction, the conceived (Bi0.5Na0.5)TiO3-based ternary solid solution that delivers giant Wrec/E of ≈0.0168 µCcm-2, high Wrec of ≈4.71 J cm-3 and high η of ≈93% under low E of 280kVcm-1, accompanied by great stabilities against temperature/frequency/cycling number and excellent charging-discharging properties, which is ahead of most currently reported lead-free energy storage bulk ceramics measured at same E range. Atomistic observations reveal that the correlated coexisting local rhombohedral-tetragonal polar nanoregions embedded in the cubic matrix are constructed, which enables high polarization, minimized hysteresis, and significantly delayed polarization saturation concurrently, endowing giant Wrec/E along with high Wrec and η. These findings advance the superiority and feasibility of polymorphic nanodomains in designing highly efficient capacitors for low/moderate field-region practical applications.

High-temperature dielectric with excellent capacitive performance enabled by rationally designed traps in blends

Polymer dielectrics with excellent capacitive performance are urgently needed in advanced electrical and electronic systems. However, due to the dramatic increase in the conduction loss, the energy density and efficiency of polymers degrade severely at elevated temperatures, limiting their application in harsh environments up to 150 °C. Herein, an all-organic polyurea (PU)/polyetherimide (PEI) blend film is designed to prepare high-temperature polymer dielectric. It is found that carrier traps can be introduced by blending, and the hydrogen bond between PU and PEI increases the trap depth, leading to suppressed leakage current and enhanced breakdown strength, thus improving the energy storage performance. PU/30%PEI exhibits a high discharged energy density of ∼3.74 J/cm3 with an efficiency higher than 90% at 150 °C, which is 78% and 70% higher than pristine PU and PEI, respectively. This work provides a facile strategy to improve the energy storage performance of polymer dielectrics by introducing deep traps through blending.

High Energy Storage Performance in BiFeO3-Based Lead-Free High-Entropy Ferroelectrics.

Dielectric capacitors are widely used in advanced electrical and electronic systems due to the rapid charge/discharge rates and high power density. High comprehensive energy storage properties are the ultimate ambition in the field of application achievements. Here, the high-entropy strategy is proposed to design and fabricate single-phase homogeneous (Bi0.5Ba0.1Sr0.1Ca0.2Na0.1)(Fe0.5Ti0.3Zr0.1Nb0.1)O3 ceramic, the hierarchical heterostructure including rhombohedral-tetragonal multiphase nanoclusters and locally disordered oxygen octahedral tilt can lead to the increased dielectric relaxation, diffused phase transition, diverse local polarization configurations, grain refinement, ultrasmall polar nanoregions, large random field, delayed polarization saturation and improved breakdown field. Accordingly, a giant Wrec ≈13.3 J cm-3 and a high η ≈78% at 66.4kV mm-1 can be simultaneously achieved in the lead-free high-entropy BiFeO3-based ceramic, showing an obvious advantage in overall energy-storage properties over BiFeO3-based lead-free ceramics. Moreover, an ultrafast discharge rate (t0.9 = 18ns) can be achieved at room temperature, concomitant with favorable temperature stability in the range of 20-160 °C, due to the enhanced diffuse phase transition and fast polarization response. This work provides a feasible pathway to design and generate dielectric materials exhibiting high comprehensive energy-storage performance.

A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics

A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics