Activation Energy Of Cross-linking Reaction Research Articles

Analysis of Cross-linking Reactions for High Sensitivity and Non-antimonite Permanent Photoresist for MEMS

The permanent photoresist is a versatile material to fabricate three-dimensional structures for the Micro Electro Mechanical Systems (MEMS) field. The replacement to non-antimonite initiators is ongoing toward the mass manufacturing. We investigate on the reaction mechanism of cross-linking formulating chemically amplified negative-tone photoresists by adopting an infrared spectra measurement system. The consumption of epoxy group is monitored during post exposure bake (PEB). The patterning profile of 40 μm lines with 30 μm thickness indicates no significant difference on the photoresist formulation. However, the FT-IR measurement results and the simulation models describe the difference in cross-linking behavior in tested photoresists. The activation energy of cross-linking reaction is also calculated. The impact on cross-linking reaction from the residual solvent in photoresist film is also discussed utilizing a Thermal Desorption Spectrometer (TDS).

Crosslinking of silicone modified polyamideimide

Prepolymers of polyamide-imide was synthesized with excess MDI and TMA in NMP. The resulting isocyanate terminated prepolymers mixed with silicon compound were heated. The chemical reaction and properties of the resulting polymers are studied with IR, NMR, TGA as well as dynamic mechanical measurement. Observation of experiments reveals that the addition of γ-APS enhances the crosslinking. The modified polyamide-imides exhibit excellent adhesion on glass. And the activation energy of cross-linking reaction as measured from DSC is 72 KJ/mole. The drastic weight loss of the post cured polymer took place at 500°C.