Zn additions modifying microstructure, thermal parameters and cytotoxicity of Sn-0.7Cu eutectic solder alloys

Abstract

Alloys from the SnCu systems have superior properties as compared to the SnPb alloys, such as mechanical and corrosion resistance. However, SnCu alloys still exhibit low oxidation resistance, poor wettability and low reliability. One way to optimize such properties is by adding alloying elements, such as zinc. Zn is generally used in Pb-free solder alloys to minimize intermetallic compound growth in soldered joints, refine the microstructure and increase mechanical strength, in addition to reducing the final cost. The addition of Zn is motivated by the effects it promotes such as microstructural refining, suppression of intermetallics in the substrate/alloy reaction layer, increase in fluidity and mechanical properties. Therefore, this study aims to understand the effects of Zn additions (0.2 and 0.5 in wt%) on solidification thermal parameters (growth rate-V and cooling rate-Ṫ), macrostructure, microstructure, phase transformation, macrosegregation and cytotoxicity in directionally solidified eutectic Sn-0.7wt.%Cu alloy under transient heat flow regime of solidification in copper sheet. Thus, the samples have been characterized by Optical Microscopy (OM), Scanning Electron Microscopy (SEM), X-Ray Fluorescence (XRF) and X-Ray Diffraction (XRD). The CALPHAD (CALculation of PHAse Diagrams) method by Thermo-calc software was used to generate property diagrams and isopleths. Cytotoxicity analysis was performed based on cell viability with incubation periods of 15 and 30 days for the alloys, with subsequent exposures of the extracts for 24 and 48 h. The Zn additions caused slight changes in the phase transformation temperatures of the Sn-Cu-Zn alloys. Macrostructures exhibiting columnar-to-equiaxed transition (CET) were observed for the Sn-Cu-Zn alloys. The microstructures of the Sn-Cu-Zn alloys were predominantly dendritic with a matrix rich in tin (β-Sn) surrounded by a eutectic mixture of the β-Sn + Cu6Sn5 + CuZn phases. After CET on Sn-Cu-Zn castings, low velocity eutectic cells have been observed. Moreover, Zn additions refined and did not change the dendritic arrangement of the Sn-Cu-Zn alloys, when compared to the Sn-0.7wt.%Cu alloy. However, increasing the Zn content did not affect the microstructural scale in the ternary alloys when compared to each other. The variations in the microstructural scale did not influence the toxicity of the examined alloys, but factors such as incubation time and chemical composition did. In general, Zn improved the cell viability of the Sn-Cu-Zn alloys, but still with moderate cytotoxic levels.