Abstract
A zincate-free electroless nickel deposition on aluminum bond pads is investigated. A three-step, etch, rinse, and electroless plating, is demonstrated for deposition on aluminum bond pads patterned with polyimide. The chemicals used are compatible with this dielectric material. The deposition has been achieved with good selectivity, uniformity, and deposition rate at aluminum bond pads. The adhesion and contact resistance were also determined and improved through anneals in the range 200-400°C for 1 h. The optimized condition for adhesion and contact resistance was an anneal at 400°C. The combination of a nickel hypophosphite reducing agent and the additives used leads to an active plating bath in the early stages of deposition, by comparison with commercial solutions, and hence, good coverage of the aluminum bond pad using the simplified process. © 2004 The Electrochemical Society. All rights reserved.
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