Zero thermal expansion, electrical conductivity and hardness of Mn3Zn0.5Sn0.5N/Cu composites

Abstract

Mn3Zn0.5Sn0.5N/Cu composites were successfully prepared by sintering at 723 K and 823 K. The results show that the thermal expansion of Cu decreases effectively by mixing Mn3Zn0.5Sn0.5N within its negative thermal expansion temperature range. The thermal expansion of composites can be tailored by adjusting the volume fraction of Mn3Zn0.5Sn0.5N. When the volume fraction of Mn3Zn0.5Sn0.5N is 40%, the composite shows a near zero thermal expansion, with the coefficient of thermal expansion of 0.268 × 10−6 K–1 Mn3Zn0.5Sn0.5N/Cu composites exhibit excellent electrical conductivity at the level of 104 S/cm, which is less than that of the matrix Cu. The hardness of composite is improved by adding Mn3Zn0.5Sn0.5N with high stiffness. Some classic models are used to predict the properties of composites and corrected according to the experiment data.