Zastosowanie zywic epoksydowych w elektronice i optoelektronice. Cz. I. Wlasciwosci mechaniczne i stabilnosc termiczna zywic epoksydowych stosowanych do hermetyzacji urzadzen elektronicznych

Abstract

The problems concerning electronic circuitry encapsulation with epoxy resins (EP resins) were discussed in this literature review. Types of most important components of epoxy molding compounds (Table 1) as well as their functions in the epoxy systems and requirements concerning them were presented. In the encapsulated semiconductor structure (Fig. 1) an analysis of the spots of internal stresses occurrence and the reasons of them [equations (1) and (2)] causing the microcircuit system damage were presented. As well the current directions of research on new EP resins warranting the operational reliability of the integrated circuits produced recently, fulfilling the requirements of new technologies of electronic industry. There is also presented a review of modified epoxy molding compounds characterized with small values of flexural modulus and the same time as high as possible glass transition temperature allowing to keep small value of the coefficient of thermal expansion [scheme A and B, equation (3)]. Modification has been carried out by introducing of flexible domains or biphenyl segments [formula (1)] to EP matrix.