Z-Scanning of Multiple-Pulse Laser Ablation of Copper Study for Application in Roll-Printed Electronics

Abstract

The benefits of pulsed laser ablation in advanced manufacturing have been studied in terms of intensity, adequate orientation, damped noise, and great adaptability. During ultrashort laser ablation, the interaction between a copper surface and numerous pulses was explored to establish ideal focusing conditions. We present a simple theoretical description of morphological changes in the ablated channel and illustrate its utility in real-time placement of the interactive surface at the focus during multiple-pulse laser ablation of copper. The experimental results for copper ablation depth indicate that combining a dynamic focusing mechanism and a theoretical formula for ablation-cycle-dependent ablation depth allows one to regulate the geometry of ablated channels. This model can be applied to a wide range of high-efficiency ablation systems and could be crucial in the development of a high-precision ablation system for the curved surfaces in highly scaled copper gravures used in printed electronics, which currently presents an engineering problem.