XTEM investigation of Ge/Pd shallow contact to p-In 0.53Ga 0.47As

Abstract

Cross-sectional transmission electron microscopy, in combination with energy dispersive X-ray spectroscopy and focused beam microdiffraction, was applied to study the solid-state reactions taking place during contact formation of the system Ge(115 nm)/Pd(50 nm)—In 0.53Ga 0.47As. In order to get information about the sequence of the different processes, rapid thermal, annealing experiments in the range 225–400 °C were performed. The following features were observed: at 225 °C Pd reacted with the substrate forming the quaternary phase Pd xIn 0.53Ga 0.47As (x ≈ 4), and with the Ge-layer forming mainly PdGe and Pd 2Ge. Between Pd x In 0.53Ga 0.47As and In 0.53Ga 0.47As, a 5 nm thick amorphous Pd-In-Ga-As layer remained, indicating that the first reaction step was solid-state amorphization. After annealing at 350 °C, Pd xIn 0.53Ga 0.47As disappeared and regrowth of In 0.53Ga 0.47As occured. Finally, at 400 °C, residual Ge from the amorphous top layer diffused to the interface and grew epitaxially on the regrown In 0.53Ga 0.47As, thus separating the III–V compound semiconductor from the Pd-Ge reaction products. The interface remained flat, while only about 10 nm of the active In 0.53Ga 0.47As layer had been modified during the annealing processes.