X-ray Triaxial Stress Analysis Using Whole Diffraction Ring Detected with Imaging Plate.

Abstract

This paper describes a study on X-ray stress analysis using a two-dimensional X-ray detector. An imaging plate (IP) was adopted in this study as one of the two-dimensional detectors, which enabled us to obtain whole diffraction patterns rapidly and accurately and also to analyze their digital data in a computer. A new X-ray triaxial stress analysis, which is fitted to use the two-dimensional detector, was presented. This method was applied to measure residual stresses, introduced by grinding, as well as applied ones on a steel. The stresses measured by the present method agreed well with those measured by the conventional Dolle-Hauk method. The scattering of stresses obtained by the present method was almost the same as that obtained by the conventional method. The time of measurement for full triaxial stress analysis by the present method was almost one-thirtieth that of the conventional one. It was found that the use of IP effectively shortened the measurement time in case of triaxial stress analysis, compared with the case of plane stress analysis.