X-ray stress measurement and FEM analysis of residual stress distribution near interface in bonded ceramic/metal compounds

Abstract

There are enormous heterogeneous interfaces in the interior of metal matrix composites (MMCs). Because of the significant difference between the coefficients of thermal expansion (CTEs) of the matrix and reinforcement, the complicated thermal residual stresses are believed to be induced into the matrix and reinforcement near the interfaces when composites are fabricated or annealed at a certain high temperature and cooled down to room temperature. In order to obtain a further understanding of the thermal residual stress distribution near the interfaces in such a material, the residual stress distribution along the depth in 6061 Al component of bonded SiC/6061 Al model material was determined by X-ray stress measurement. Meanwhile, FEM was performed to analyze the residual stress distribution in the two constituents and the results were discussed. In the bonded SiC/6061 Al model material, the residual stress distribution is nearly linear in SiC component, and non-linear in the 6061 Al part. The calculated results indicate that the residual stress state in the components depends on the ratio of the thickness of ceramic and metal. The measured and calculated residual stress distributions are in agreement in general trend, however the calculated values are higher than the measured ones.