Abstract
AbstractXPS analysis of electroless deposition of successive SnPd and Cu films on a NiTi surface has been performed in order to explain the nucleation and growth. Chemical interaction of Sn with the NiTi surface is shown to be associated with the growth of Sn oxide and hydroxide that can be formed after the reaction of Sn atoms with TiO2 oxide. 3D growth of pure metallic palladium occurs, leading to the formation of nanometric metallic Pd clusters. The interaction of copper atoms with the palladium surface leads to the formation of interfacial PdCu intermetallic and consequently to strong interfacial adhesion. Copyright © 2004 John Wiley & Sons, Ltd.
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