X-ray residual stress measurement of yttria-partially stabilized zirconia.

Abstract

The X-ray elastic constants and the stress constant for the X-ray stress measumement of partially stabilized tetragonal zirconia with 2.5 mol% and 3 mol% yttria were determined for diffractions from plane (0 2 6) by Cu-Kα radiation and from plane (1 3 3) by Cr-Kα radiation. The X-ray value of E/(1+ v) (E=Young's modulus, v=Poisson's ratio) was rather insensitive to the conditions of sintering and surface finishing. The measured value for plane (1 3 3) was lower than that for plane (0 2 6). The accuracy of the X-ray stress measurement was found to be higher for the case of plane (1 3 3). The residual stresses measured on the ground, lapped and polished surfaces were all compressive. The Ψ splitting of the sin2 Ψ diagram was observed for the cases of heavy grinding. The magnitude of the compressive residual stress became larger with increasing the diamond grain size of a cutting wheel, while it was insensitive to the cutting depth. The full width at the half maximum of the X-ray diffraction profiles and the amount of transformation from the tetragonal phase to the monoclinic phase also increased with increasing the diamond grain size of a cutting wheel.