Abstract
The technology for evaluation of metal materials encompasses machine parts and structures. Residual stress is one indicator used for evaluating the strength and stiffness of metal materials. X-ray residual stress measurement is a non-destructive, non-contact, and precise method in various residual stress measurement methods. This method is used only for research purposes because of its long measurement time and large device size. Therefore, we developed a small, high-speed X-ray residual stress measurement device with a charge-integration-type silicon-on-insulator (SOI) pixel detector, INTPIX4, for industrial use.Previous studies have shown that residual stress can be measured in less than 1 s by using a measurement device with an SOI pixel detector. In this study, we report a more detailed specification of the measurement device and consider its availability for metal material evaluation.
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