Abstract
Tensile tests were carried out for sputtered copper thin films. Thin films were fabricated by RF magnetron sputtering. The target power of the sputtering equipment was set from 10 to 150 W to control the grain size. The grain size increased with increasing target power. The effect of grain size on the deformation behavior under tensile loading was investigated by X-ray method. The changes in the internal stress and the full width at half maximum were measured under tensile loading. The 0.2% proof stress decreased with grain size. For the full width at half maximum, the value was almost constant in the elastic region. When the plastic deformation occurred, the value increased rapidly with applied strain. For the specimen with fine grains, the value returned to the initial value in spite of after large plastic deformation. After tensile loading, many intergranular cracks could be observed on the specimen surface.
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