X-ray characterization techniques for the assessment of surface damage in crystalline wafers: A model study in AlN

Abstract

A high-resolution X-ray diffraction method with enhanced surface sensitivity has been used to investigate the effects of various polishing steps on the near-surface region of single crystal substrates. The method involves the study of a highly asymmetric reflection, observable under grazing incidence conditions. Analysis of rocking curve measurements and reciprocal space maps (RSMs) revealed subtle structural differences between the polished substrates. For aluminum nitride wafers, damage induced from diamond sawing and mechanical polishing was readily identifiable by on-axis rocking curves, but this method was unable to distinguish between sample surfaces subjected to various degrees of chemical mechanical polishing (CMP). To characterize sufficiently these surfaces, (10.3) RSMs were measured to provide both qualitative and quantitative information about the near-surface region. Two features present in the RSMs were utilized to quantitatively assess the polished wafers: the magnitude of the diffuse scatter in the omega-scans and the elongation of the crystal truncation rod. The method is able to distinguish between different degrees of CMP surface preparation and provides metrics to quantify subsurface damage after this polishing step.