Abstract
powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of additive on cutting efficiency was investigated and compared with the micro-blades with developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with but wear depth increased. It was found that the blades including consumed less momentary energy than the blades containing during dicing test. Micro-blades containing exhibited lower flexural strength than the blades with resulting from higher amount of sintering defects relevant to the less effectiveness of on fluidity. The effect of and on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of showed the best cutting efficiency.
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