Abstract
Thermally induced stresses created during package manufacturing and their roles in mechanical failure are important issues for the microelectronic industry. In the present paper, a numerical analysis of the die embedding process into a printed circuit board by means of the package assembling and lamination is presented. The complex package consisting of a silicon die, an adhesive, a copper foil, an epoxy resin and prepregs (an E-glass woven structure pre-impregnated with an epoxy resin) is investigated in terms of warpage and stress development. Both are mainly introduced due to a mismatch of coefficients of thermal expansion and particularly to shrinkage of the polymer parts (adhesive, epoxy resin). Their impact on possible package failures is discussed. A two-dimensional axisymmetric numerical model is employed for investigation of the embedding process flow. Temperature dependent material properties for all materials are used in the analysis. A special focus is set on the orthotropic properties of the prepreg materials. Those are analytically homogenized based on the lamination theory of plain woven fabric composites and implemented into the numerical model. The numerical results of embedding process steps are validated experimentally by an X-ray diffraction method (Rocking-Curve-Technique) showing a good agreement of the calculated and measured curvature radius values.
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