WITHDRAWN: Update on CGA packages for space applications

Abstract

Abstract This paper is the 10th anniversary update of a previous paper published in 2006 on the topics of ceramic column grid array (CCGA or CGA) packages and assembly reliability. CGAs are commercial-off-the-shelf (COTS) area array packaging technologies that are now widely used in numerous high reliability applications including National Aeronautics and Space Administration (NASA) electronic systems. Key updates on packaging technologies and test data on assembly reliability characterizations are discussed in seven topics: (1) updates on the recent microelectronics packaging roadmaps, especially those for single-chip CGA packages, (2) tensile-strength test data for characterizations of the individual column integrity of CGAs before and after environmental exposures, (3) thermal cycle test data showing solder joint behavior of decoupling capacitors mounted on the high inputs/outputs (I/Os) flip-chip CGA ceramic substrate, (4) thermal cycle test results performed under a number of thermal cycle conditions including extreme cold exposures for CGA assemblies with internal wire-bond or flip-chip die having a large number of columns — from 1144 to 1752 columns and 1-mm pitch, (5) test results revealing synergistic effects of mechanical drop shock or vibration test results for “as assembled” CGAs and those with initial thermal cycling conditions, (6) images and photomicrographs taken by optical microscopy, X-ray, and C-SAM as well as failure mechanisms revealed by non-destructive and destructive methods using scanning electron microscopy (SEM), cross-sectioning, and dye-and-pry techniques, and (7) simple analytical models developed for analyses of stresses and strains of solder joints for single- and double-sided mirror-image CGA assemblies.