Abstract
Abstract Much basic research has been done on the crosslinking behaviour of so-called “engineering plastics”. Up to now the industrial conversion to actual manufacture of multifunctional electronic components has gained ever increasing importance in the plastics industry and will continue to do so in the coming years. Examples of this are SMD (surface mounted device) technology, and 3D-MID (3-dimensional moulded interconnected devices) technology. These techniques require materials with high short-term temperature stability. In this paper it will be discussed which engineering plastics are significant for the radiation crosslinking process, for both technical and commercial reasons. The main topics will be the crosslinking behaviour of Polybutylenterephthalate (PBT) and Polyamide (PA). The importance and the challenges to the irradiation industry, as well as practical applications, will be shown.
Published Version
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