Abstract
We analyze the performance of a microwave chip mount that uses wirebonds toconnect the chip and mount grounds. A simple impedance ladder model predictsthat transmission crosstalk between two feedlines falls off exponentially withdistance at low frequencies, but rises to near unity above a resonance frequency setby the chip to ground capacitance. Using SPICE simulations and experimentalmeasurements of a scale model, the basic predictions of the ladder model wereverified. In particular, by decreasing the capacitance between the chip and boxgrounds, the resonance frequency increased and transmission decreased. Thismodel then influenced the design of a new mount that improved the isolation to − 65 dB at 6 GHz, even though the chip dimensions were increased to1 cm × 1 cm, three times as large as our previous devices. We measured a coplanar resonator in thismount as preparation for larger qubit chips, and were able to identify cavity, slotline, andresonator modes.
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