Abstract
A wire pull test Finite Element Analysis (FEA) simulation enabled better insight into the role of both wafer fabrication Back End of Line (BEOL) as well as package level wire material in causing bond pad lift/peeling failure. In this work, it was discovered that wire material change had a greater impact to the BEOL stress compared to the BEOL design itself. Alternate BEOL designs need to be continuously evaluated prior to introduction to the bond pad design. FEA simulation can alleviate the prototyping phase by narrowing down the number of samples required for testing.
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