Abstract
Manual process of creating bonding diagram is known to be time consuming and error prone. In comparison, offline programming (OLP) provides a much more viable option to reduce the wire bonding creation time and error. OLP is available in two versions, i.e., vendor specific OLP and direct integration offline pro- gramming (Di-OLP). Both versions utilize the bonding diagram and computer aided design data to speed up bonding program creation. However, the newly proposed Di-OLP is more flexible as it can be used to create bonding program for multiple machine platforms in microelectronics industry. Some special features of Di-OLP method are presented. The application of generic OLP however, is applicable to machines that recognize ASCII text file. The user needs to know the data format accepted by machine and convert the data accordingly to suit its application for different machine platforms. Di-OLP is also a practical method to replace the time consuming manual method in production line.
Highlights
Semiconductor industry is moving in the trend of increased integration and miniaturization
OLP is available in two versions, i.e., vendor specific OLP and direct integration offline programming (Di-OLP)
The OLP method is known to speed up bonding program creation process and improve accuracy of bond program created [6,9]
Summary
Semiconductor industry is moving in the trend of increased integration and miniaturization. The trend of increased integration has resulted in new challenges for wire bond process; mainly because more wires are bonded on a chip and pad pitch has become smaller [3]. As wire count increases and bond pitch becomes smaller the manual bonding program preparation method becomes very tedious and time consuming. Errors are likely to occur due to the fact that operator only has access to locally enlarge image of bond pad and leadframe during the manual bonding program preparation process. This narrow vision makes it very difficult for operator to recognize the exact bonding bond pad position where bonding wire is to be placed. It greatly reduces the time required to create the bonding program [6,7,8]
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